ATE106068T1 - SILVER GLASS PASTE. - Google Patents
SILVER GLASS PASTE.Info
- Publication number
- ATE106068T1 ATE106068T1 AT89309566T AT89309566T ATE106068T1 AT E106068 T1 ATE106068 T1 AT E106068T1 AT 89309566 T AT89309566 T AT 89309566T AT 89309566 T AT89309566 T AT 89309566T AT E106068 T1 ATE106068 T1 AT E106068T1
- Authority
- AT
- Austria
- Prior art keywords
- paste
- silver
- glass
- glass paste
- silver glass
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/66—Conductive materials thereof
- H10W70/666—Organic materials or pastes
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Joining Of Glass To Other Materials (AREA)
- Die Bonding (AREA)
Abstract
An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass frit, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/248,120 US4986849A (en) | 1988-09-23 | 1988-09-23 | Silver-glass pastes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE106068T1 true ATE106068T1 (en) | 1994-06-15 |
Family
ID=22937758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT89309566T ATE106068T1 (en) | 1988-09-23 | 1989-09-20 | SILVER GLASS PASTE. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4986849A (en) |
| EP (1) | EP0360587B1 (en) |
| JP (1) | JPH02117798A (en) |
| KR (1) | KR900004649A (en) |
| AT (1) | ATE106068T1 (en) |
| DE (1) | DE68915498T2 (en) |
| FI (1) | FI94411C (en) |
| IE (1) | IE893034L (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5164119A (en) * | 1988-09-23 | 1992-11-17 | Johnson Matthey Inc. | Silver-glass pastes |
| US5183784A (en) * | 1990-02-21 | 1993-02-02 | Johnson Matthey Inc. | Silver-glass pastes |
| US5075262A (en) * | 1990-02-21 | 1991-12-24 | Johnson Matthey, Inc. | Silver-glass pastes |
| JP2653314B2 (en) * | 1992-02-07 | 1997-09-17 | 鳴海製陶株式会社 | Induction cooking container |
| DE69807976T2 (en) * | 1997-05-09 | 2003-06-05 | Jsr Corp | Composition of a glass paste |
| US6020646A (en) * | 1997-12-05 | 2000-02-01 | The Charles Stark Draper Laboratory, Inc. | Intergrated circuit die assembly |
| JP3539195B2 (en) * | 1998-03-25 | 2004-07-07 | 株式会社村田製作所 | Conductive paste and method of manufacturing ceramic substrate using the same |
| US20050239947A1 (en) * | 2004-02-27 | 2005-10-27 | Greenhill David A | Polymeric silver layer |
| JP4583063B2 (en) * | 2004-04-14 | 2010-11-17 | 三井金属鉱業株式会社 | Silver compound-coated silver powder and method for producing the same |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3374110A (en) * | 1964-05-27 | 1968-03-19 | Ibm | Conductive element, composition and method |
| US3350341A (en) * | 1964-07-16 | 1967-10-31 | Du Pont | Silver compositions containing novel vitreous binders and a vehicle |
| US3497774A (en) * | 1967-06-07 | 1970-02-24 | Beckman Instruments Inc | Electrical circuit module and method of manufacture |
| US3898091A (en) * | 1973-06-04 | 1975-08-05 | M & T Chemicals Inc | Novel glazing composition and method |
| US4273583A (en) * | 1979-06-29 | 1981-06-16 | E. I. Du Pont De Nemours And Company | Flake silver powders with chemisorbed monolayer of dispersant |
| US4401767A (en) * | 1981-08-03 | 1983-08-30 | Johnson Matthey Inc. | Silver-filled glass |
| US4459166A (en) * | 1982-03-08 | 1984-07-10 | Johnson Matthey Inc. | Method of bonding an electronic device to a ceramic substrate |
| US4436785A (en) * | 1982-03-08 | 1984-03-13 | Johnson Matthey Inc. | Silver-filled glass |
| US4636254A (en) * | 1985-07-23 | 1987-01-13 | Quantum Materials, Inc. | Silver-glass paste for attachment of silicon die to ceramic substrate |
| US4761224A (en) * | 1986-03-10 | 1988-08-02 | Quantum Materials Inc. | Silver-glass paste with poly-modal flake size distribution and quick dry vehicle |
| US4859241A (en) * | 1986-04-16 | 1989-08-22 | Johnson Matthey Inc. | Metal flake and use thereof |
| DK54988A (en) * | 1987-11-25 | 1989-05-26 | Du Pont | MATERIALS FOR BINDING INTEGRATED CIRCUITS TO INORGANIC, DIELECTRIC SURFACES |
-
1988
- 1988-09-23 US US07/248,120 patent/US4986849A/en not_active Expired - Lifetime
-
1989
- 1989-09-19 KR KR1019890013437A patent/KR900004649A/en not_active Withdrawn
- 1989-09-19 JP JP1243265A patent/JPH02117798A/en active Pending
- 1989-09-20 AT AT89309566T patent/ATE106068T1/en not_active IP Right Cessation
- 1989-09-20 DE DE68915498T patent/DE68915498T2/en not_active Expired - Fee Related
- 1989-09-20 EP EP89309566A patent/EP0360587B1/en not_active Expired - Lifetime
- 1989-09-22 FI FI894501A patent/FI94411C/en not_active IP Right Cessation
- 1989-09-22 IE IE893034A patent/IE893034L/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FI894501A0 (en) | 1989-09-22 |
| IE893034L (en) | 1990-03-23 |
| KR900004649A (en) | 1990-04-12 |
| US4986849A (en) | 1991-01-22 |
| DE68915498T2 (en) | 1994-10-06 |
| FI894501L (en) | 1990-03-24 |
| JPH02117798A (en) | 1990-05-02 |
| EP0360587A2 (en) | 1990-03-28 |
| EP0360587B1 (en) | 1994-05-25 |
| EP0360587A3 (en) | 1990-10-17 |
| DE68915498D1 (en) | 1994-06-30 |
| FI94411B (en) | 1995-05-31 |
| FI94411C (en) | 1995-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |