ATE109278T1 - Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe. - Google Patents

Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe.

Info

Publication number
ATE109278T1
ATE109278T1 AT87114529T AT87114529T ATE109278T1 AT E109278 T1 ATE109278 T1 AT E109278T1 AT 87114529 T AT87114529 T AT 87114529T AT 87114529 T AT87114529 T AT 87114529T AT E109278 T1 ATE109278 T1 AT E109278T1
Authority
AT
Austria
Prior art keywords
packaged substrate
investigation
substrate
land
fixed assembly
Prior art date
Application number
AT87114529T
Other languages
English (en)
Inventor
Teruhisa Omron Tateisi Yotuya
Shimo-Kaiinji Igadera
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61236499A external-priority patent/JPH0820229B2/ja
Priority claimed from JP61256994A external-priority patent/JP2664141B2/ja
Priority claimed from JP61256995A external-priority patent/JPH07120420B2/ja
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of ATE109278T1 publication Critical patent/ATE109278T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AT87114529T 1986-10-03 1987-10-05 Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe. ATE109278T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61236499A JPH0820229B2 (ja) 1986-10-03 1986-10-03 実装基板検査装置
JP61256994A JP2664141B2 (ja) 1986-10-30 1986-10-30 実装基板検査装置
JP61256995A JPH07120420B2 (ja) 1986-10-30 1986-10-30 実装基板検査装置

Publications (1)

Publication Number Publication Date
ATE109278T1 true ATE109278T1 (de) 1994-08-15

Family

ID=27332376

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87114529T ATE109278T1 (de) 1986-10-03 1987-10-05 Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe.

Country Status (5)

Country Link
US (2) US4953100A (de)
EP (1) EP0263473B1 (de)
AT (1) ATE109278T1 (de)
DE (1) DE3750285T2 (de)
HK (1) HK36696A (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
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EP0263473B1 (de) * 1986-10-03 1994-07-27 Omron Tateisi Electronics Co. Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe
US5093797A (en) * 1987-01-13 1992-03-03 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
JP2517637B2 (ja) * 1988-02-15 1996-07-24 キヤノン株式会社 マ―ク位置検出方法及びそれが適用される装置
SG66545A1 (en) * 1988-05-09 1999-07-20 Omron Tateisi Electronics Co Apparatus for inspecting printed circuit boards and the like and method of operating the same
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JPH02140886A (ja) * 1988-11-21 1990-05-30 Omron Tateisi Electron Co 画像の前処理装置
US5027417A (en) * 1989-03-31 1991-06-25 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
US5144681A (en) * 1989-03-31 1992-09-01 Dainnippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
JPH03188358A (ja) * 1989-12-19 1991-08-16 Hajime Sangyo Kk 物体の表面検査装置
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EP0435660B1 (de) * 1989-12-29 1997-06-04 Canon Kabushiki Kaisha Bildverarbeitungsverfahren zur Bewertung von Objekten und Vorrichtung zur Qualitätsprüfung zur Durchführung des Verfahrens
US5243665A (en) * 1990-03-07 1993-09-07 Fmc Corporation Component surface distortion evaluation apparatus and method
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US5392360A (en) * 1993-04-28 1995-02-21 International Business Machines Corporation Method and apparatus for inspection of matched substrate heatsink and hat assemblies
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JPH10143660A (ja) 1996-11-11 1998-05-29 Hitachi Ltd 欠陥判定処理方法およびその装置
KR19980039109A (ko) * 1996-11-27 1998-08-17 배순훈 클린칭 검사기능을 갖는 자삽경로 작성장치와 그 검사방법
US6047084A (en) * 1997-11-18 2000-04-04 Motorola, Inc. Method for determining accuracy of a circuit assembly process and machine employing the same
JP2000326495A (ja) * 1999-05-24 2000-11-28 Matsushita Electric Ind Co Ltd クリーム半田印刷の検査方法
US6542630B1 (en) 1999-09-14 2003-04-01 Teradyne, Inc. Inspecting component placement relative to component pads
JP3870872B2 (ja) * 2002-08-06 2007-01-24 オムロン株式会社 検査データ作成方法およびこの方法を用いた基板検査装置
DE10261865A1 (de) * 2002-12-20 2004-07-15 Uwe Braun Sonnenlichtleitsysteme Lichtsysteme Gmbh Verfahren, Vorrichtung und Computerprogramm zur optischen Oberflächenerfassung
GB0324638D0 (en) * 2003-10-22 2003-11-26 Gore W L & Ass Uk An on-line inspection system
CN1662132B (zh) * 2004-02-26 2010-08-18 欧姆龙株式会社 安装错误检测方法和采用该方法的基板检测装置
JP4165538B2 (ja) * 2004-07-21 2008-10-15 オムロン株式会社 部品実装検査方法および部品実装検査装置
JP4935109B2 (ja) * 2005-03-17 2012-05-23 オムロン株式会社 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置
JP4595705B2 (ja) * 2005-06-22 2010-12-08 オムロン株式会社 基板検査装置並びにそのパラメータ設定方法およびパラメータ設定装置
CN102292700A (zh) * 2009-01-24 2011-12-21 惠普开发有限公司 用于增强安全印刷的系统和方法
US11084225B2 (en) 2018-04-02 2021-08-10 Nanotronics Imaging, Inc. Systems, methods, and media for artificial intelligence process control in additive manufacturing
US11209795B2 (en) 2019-02-28 2021-12-28 Nanotronics Imaging, Inc. Assembly error correction for assembly lines
US10481579B1 (en) 2019-02-28 2019-11-19 Nanotronics Imaging, Inc. Dynamic training for assembly lines
US11156991B2 (en) 2019-06-24 2021-10-26 Nanotronics Imaging, Inc. Predictive process control for a manufacturing process
CN110534411B (zh) * 2019-08-21 2021-07-13 大同新成新材料股份有限公司 一种芯片硅的加工方法
CN114450135A (zh) 2019-09-10 2022-05-06 纳米电子成像有限公司 用于制造过程的系统、方法和介质
US11063965B1 (en) 2019-12-19 2021-07-13 Nanotronics Imaging, Inc. Dynamic monitoring and securing of factory processes, equipment and automated systems
US11100221B2 (en) 2019-10-08 2021-08-24 Nanotronics Imaging, Inc. Dynamic monitoring and securing of factory processes, equipment and automated systems
US12153408B2 (en) 2019-11-06 2024-11-26 Nanotronics Imaging, Inc. Systems, methods, and media for manufacturing processes
US12165353B2 (en) 2019-11-06 2024-12-10 Nanotronics Imaging, Inc. Systems, methods, and media for manufacturing processes
TW202223567A (zh) 2019-11-06 2022-06-16 美商奈米創尼克影像公司 用於工廠自動化生產線之製造系統及方法
KR102866210B1 (ko) 2019-11-20 2025-09-29 나노트로닉스 이미징, 인코포레이티드 정교한 공격으로부터 산업 생산의 보호
US11086988B1 (en) 2020-02-28 2021-08-10 Nanotronics Imaging, Inc. Method, systems and apparatus for intelligently emulating factory control systems and simulating response data
KR102882438B1 (ko) * 2021-03-25 2025-11-06 현대자동차주식회사 차량의 품질 관리 시스템 및 그 방법

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JPS58201185A (ja) * 1982-05-19 1983-11-22 Toshiba Corp 位置検出装置
DE3347645C1 (de) * 1983-12-30 1985-10-10 Dr.-Ing. Ludwig Pietzsch Gmbh & Co, 7505 Ettlingen Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt
JPS60263807A (ja) * 1984-06-12 1985-12-27 Dainippon Screen Mfg Co Ltd プリント配線板のパタ−ン欠陥検査装置
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Also Published As

Publication number Publication date
EP0263473A3 (en) 1990-10-10
EP0263473A2 (de) 1988-04-13
EP0263473B1 (de) 1994-07-27
US5027295A (en) 1991-06-25
HK36696A (en) 1996-03-08
US4953100A (en) 1990-08-28
DE3750285D1 (de) 1994-09-01
DE3750285T2 (de) 1995-03-30

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