Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
  • H10P95/06—Planarisation of inorganic insulating materials
  • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
  • H10P95/064—Planarisation of inorganic insulating materials involving a dielectric removal step the removal being chemical etching
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W20/00—Interconnections in chips, wafers or substrates
  • H10W20/01—Manufacture or treatment
  • H10W20/071—Manufacture or treatment of dielectric parts thereof
  • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
  • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
  • H10P14/69—Inorganic materials
  • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
  • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
  • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
  • H10P14/6927—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being a silicon oxynitride, e.g. SiON or SiON:H

Landscapes

• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Formation Of Insulating Films (AREA)
• Drying Of Semiconductors (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=23027564

Family Applications (2)

Family Applications After (1)

Country Status (5)

Families Citing this family (5)

Family Cites Families (9)

• 1989
  • 1989-10-24 DE DE68926392T patent/DE68926392T2/de not_active Expired - Fee Related
  • 1989-10-24 AT AT90203417T patent/ATE137358T1/de not_active IP Right Cessation
  • 1989-10-24 DE DE68926344T patent/DE68926344T2/de not_active Expired - Fee Related
  • 1989-10-24 AT AT90203418T patent/ATE137608T1/de not_active IP Right Cessation
  • 1989-10-24 ES ES90203418T patent/ES2088958T3/es not_active Expired - Lifetime
  • 1989-10-24 ES ES90203417T patent/ES2088957T3/es not_active Expired - Lifetime
  • 1989-10-24 EP EP19890310921 patent/EP0368504A3/de not_active Withdrawn
  • 1989-11-07 JP JP1289850A patent/JPH02199831A/ja active Pending

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