ATE159302T1 - Iii-v verbindungs-halbleiter-vorrichtung, drucker- und anzeigevorrichtung unter verwendung derselben, und verfahren zur herstellung dieser vorrichtung - Google Patents
Iii-v verbindungs-halbleiter-vorrichtung, drucker- und anzeigevorrichtung unter verwendung derselben, und verfahren zur herstellung dieser vorrichtungInfo
- Publication number
- ATE159302T1 ATE159302T1 AT91118935T AT91118935T ATE159302T1 AT E159302 T1 ATE159302 T1 AT E159302T1 AT 91118935 T AT91118935 T AT 91118935T AT 91118935 T AT91118935 T AT 91118935T AT E159302 T1 ATE159302 T1 AT E159302T1
- Authority
- AT
- Austria
- Prior art keywords
- iii
- compound semiconductor
- printer
- making
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
- H10H20/818—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
- H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3418—Phosphides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3421—Arsenides
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Led Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30339490 | 1990-11-07 | ||
| JP2316256A JPH04186780A (ja) | 1990-11-20 | 1990-11-20 | 半導体素子およびその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE159302T1 true ATE159302T1 (de) | 1997-11-15 |
Family
ID=26563503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT91118935T ATE159302T1 (de) | 1990-11-07 | 1991-11-06 | Iii-v verbindungs-halbleiter-vorrichtung, drucker- und anzeigevorrichtung unter verwendung derselben, und verfahren zur herstellung dieser vorrichtung |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5659184A (de) |
| EP (1) | EP0484922B1 (de) |
| AT (1) | ATE159302T1 (de) |
| DE (1) | DE69127952T2 (de) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE150213T1 (de) * | 1991-05-23 | 1997-03-15 | Canon Kk | Lichtemittierende vorrichtung, optischer druckkopf mit solcher vorrichtung, und optischer drucker mit solchem druckkopf |
| US5907768A (en) * | 1996-08-16 | 1999-05-25 | Kobe Steel Usa Inc. | Methods for fabricating microelectronic structures including semiconductor islands |
| US5955776A (en) * | 1996-12-04 | 1999-09-21 | Ball Semiconductor, Inc. | Spherical shaped semiconductor integrated circuit |
| EP0996173B1 (de) * | 1998-10-23 | 2015-12-30 | Xerox Corporation | Halbleiterstrukturen mit polykristallinen GaN-Schichten und Herstellungsverfahren |
| US6498643B1 (en) | 2000-11-13 | 2002-12-24 | Ball Semiconductor, Inc. | Spherical surface inspection system |
| JP4310076B2 (ja) * | 2001-05-31 | 2009-08-05 | キヤノン株式会社 | 結晶性薄膜の製造方法 |
| DE10335081A1 (de) * | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoeleketronischer Halbleiterchip |
| DE10335080A1 (de) * | 2003-07-31 | 2005-03-03 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| JP4502382B2 (ja) * | 2004-11-02 | 2010-07-14 | キヤノン株式会社 | 有機トランジスタ |
| JP2006245238A (ja) * | 2005-03-02 | 2006-09-14 | Canon Inc | スルーホールの形成方法および電子回路の製造方法 |
| US9012253B2 (en) * | 2009-12-16 | 2015-04-21 | Micron Technology, Inc. | Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods |
| EP2801786B1 (de) * | 2013-05-08 | 2019-01-02 | Sick AG | Optoelektronischer Sensor und Verfahren zur Erkennung von Objektkanten |
| US11640995B2 (en) | 2017-06-20 | 2023-05-02 | Intel Corporation | Ferroelectric field effect transistors (FeFETs) having band-engineered interface layer |
| WO2018236356A1 (en) * | 2017-06-20 | 2018-12-27 | Intel Corporation | FERROELECTRIC FIELD EFFECT TRANSISTORS (FEFET) HAVING COMPOUND SEMICONDUCTOR CHANNELS |
| CN110767668B (zh) * | 2019-12-30 | 2020-03-27 | 杭州美迪凯光电科技股份有限公司 | 含纳米级表面的clcc封装体盖板、封装体和摄像模组 |
| CN110992853B (zh) * | 2019-11-19 | 2021-03-12 | 西安交通大学 | 一种发光水晶字的制备方法 |
| US20250062127A1 (en) * | 2023-08-15 | 2025-02-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of implanting semiconductor donor substrate and method of manufacturing semiconductor-on-insulator structure |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6048384A (ja) * | 1983-08-26 | 1985-03-16 | Ricoh Co Ltd | Ledアレイヘツド |
| US4657603A (en) * | 1984-10-10 | 1987-04-14 | Siemens Aktiengesellschaft | Method for the manufacture of gallium arsenide thin film solar cells |
| DE3723222A1 (de) * | 1986-07-16 | 1988-02-11 | Mitsubishi Cable Ind Ltd | Material fuer ein lichtemittierendes element und verfahren zur zuechtung von dessen kristallen |
| CA1331950C (en) * | 1987-03-26 | 1994-09-13 | Hiroyuki Tokunaga | Iii - v group compound crystal article and process for producing the same |
| CA1332039C (en) * | 1987-03-26 | 1994-09-20 | Takao Yonehara | Ii - vi group compound crystal article and process for producing the same |
| CA1321121C (en) * | 1987-03-27 | 1993-08-10 | Hiroyuki Tokunaga | Process for producing compound semiconductor and semiconductor device using compound semiconductor obtained by same |
| US5304820A (en) * | 1987-03-27 | 1994-04-19 | Canon Kabushiki Kaisha | Process for producing compound semiconductor and semiconductor device using compound semiconductor obtained by same |
| JPS6451677A (en) * | 1987-08-24 | 1989-02-27 | Canon Kk | Electroluminescence element |
| JPH02125765A (ja) * | 1988-11-04 | 1990-05-14 | Mitsubishi Electric Corp | Ledアレイ・ヘッド |
| JPH02201975A (ja) * | 1989-01-31 | 1990-08-10 | Canon Inc | 発光装置 |
| JP2858434B2 (ja) * | 1989-03-31 | 1999-02-17 | キヤノン株式会社 | 結晶の形成方法および結晶物品 |
| JP3207918B2 (ja) * | 1991-04-22 | 2001-09-10 | キヤノン株式会社 | Iii−v族化合物の多結晶半導体材料を用いた発光素子およびその製造方法 |
-
1991
- 1991-11-06 AT AT91118935T patent/ATE159302T1/de not_active IP Right Cessation
- 1991-11-06 EP EP91118935A patent/EP0484922B1/de not_active Expired - Lifetime
- 1991-11-06 DE DE69127952T patent/DE69127952T2/de not_active Expired - Fee Related
-
1994
- 1994-06-20 US US08/262,772 patent/US5659184A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0484922A1 (de) | 1992-05-13 |
| US5659184A (en) | 1997-08-19 |
| DE69127952T2 (de) | 1998-03-05 |
| DE69127952D1 (de) | 1997-11-20 |
| EP0484922B1 (de) | 1997-10-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |