ATE171564T1 - Halbleiteranordnung mit elektrischer verbindung - Google Patents

Halbleiteranordnung mit elektrischer verbindung

Info

Publication number
ATE171564T1
ATE171564T1 AT93903478T AT93903478T ATE171564T1 AT E171564 T1 ATE171564 T1 AT E171564T1 AT 93903478 T AT93903478 T AT 93903478T AT 93903478 T AT93903478 T AT 93903478T AT E171564 T1 ATE171564 T1 AT E171564T1
Authority
AT
Austria
Prior art keywords
lid
bonded
package
flange
chip
Prior art date
Application number
AT93903478T
Other languages
English (en)
Inventor
Victor Albert Keith Temple
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Application granted granted Critical
Publication of ATE171564T1 publication Critical patent/ATE171564T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT93903478T 1992-01-21 1993-01-19 Halbleiteranordnung mit elektrischer verbindung ATE171564T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/823,343 US5248901A (en) 1992-01-21 1992-01-21 Semiconductor devices and methods of assembly thereof

Publications (1)

Publication Number Publication Date
ATE171564T1 true ATE171564T1 (de) 1998-10-15

Family

ID=25238495

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93903478T ATE171564T1 (de) 1992-01-21 1993-01-19 Halbleiteranordnung mit elektrischer verbindung

Country Status (7)

Country Link
US (1) US5248901A (de)
EP (1) EP0623241B1 (de)
JP (1) JPH07503102A (de)
AT (1) ATE171564T1 (de)
CA (1) CA2127890A1 (de)
DE (1) DE69321216T2 (de)
WO (1) WO1993014517A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2106981A1 (en) * 1992-01-27 1993-07-28 Victor Albert Keith Temple Semiconductor devices and methods of mass production thereof
US5366932A (en) * 1993-04-26 1994-11-22 Harris Corporation Semi-conductor chip packaging method and semi-conductor chip having interdigitated gate runners with gate bonding pads
US5446316A (en) * 1994-01-06 1995-08-29 Harris Corporation Hermetic package for a high power semiconductor device
US5473193A (en) * 1994-01-06 1995-12-05 Harris Corporation Package for parallel subelement semiconductor devices
JPH07221590A (ja) * 1994-01-31 1995-08-18 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
EP0910394A4 (de) * 1996-04-10 1999-09-08 Diacrin Inc Verfahren zur herstellung pathogenfreien schweinegewebes für die humantransplatation
US6075289A (en) * 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
US6157076A (en) * 1997-06-30 2000-12-05 Intersil Corporation Hermetic thin pack semiconductor device
JPH11330283A (ja) * 1998-05-15 1999-11-30 Toshiba Corp 半導体モジュール及び大型半導体モジュール
US7692211B1 (en) 2001-07-03 2010-04-06 Silicon Power Corporation Super GTO-based power blocks
US6663294B2 (en) 2001-08-29 2003-12-16 Silicon Bandwidth, Inc. Optoelectronic packaging assembly
US6603193B2 (en) 2001-09-06 2003-08-05 Silicon Bandwidth Inc. Semiconductor package
US6847115B2 (en) 2001-09-06 2005-01-25 Silicon Bandwidth Inc. Packaged semiconductor device for radio frequency shielding
US7135768B2 (en) * 2001-09-06 2006-11-14 Silicon Bandwidth Inc. Hermetic seal
JP3960156B2 (ja) * 2002-07-19 2007-08-15 千住金属工業株式会社 板状基板封止用リッドの製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL274434A (de) * 1961-02-06 1900-01-01
GB1100697A (en) * 1965-11-22 1968-01-24 Matsushita Electronics Corp Alternator semiconductor diode and rectifying circuit assembly
US3576474A (en) * 1968-02-23 1971-04-27 Gen Motors Corp Passivated power rectifier
US3723836A (en) * 1972-03-15 1973-03-27 Motorola Inc High power semiconductor device included in a standard outline housing
DE2927609A1 (de) * 1979-07-07 1981-01-15 Licentia Gmbh Halbleiterzelle mit druckkontaktierter halbleiterscheibe
US5028987A (en) * 1989-07-03 1991-07-02 General Electric Company High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip

Also Published As

Publication number Publication date
EP0623241B1 (de) 1998-09-23
DE69321216T2 (de) 1999-03-18
US5248901A (en) 1993-09-28
WO1993014517A1 (en) 1993-07-22
DE69321216D1 (de) 1998-10-29
CA2127890A1 (en) 1993-07-22
JPH07503102A (ja) 1995-03-30
EP0623241A1 (de) 1994-11-09

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Legal Events

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