ATE171979T1 - Ätzende zusammensetzung - Google Patents

Ätzende zusammensetzung

Info

Publication number
ATE171979T1
ATE171979T1 AT93910211T AT93910211T ATE171979T1 AT E171979 T1 ATE171979 T1 AT E171979T1 AT 93910211 T AT93910211 T AT 93910211T AT 93910211 T AT93910211 T AT 93910211T AT E171979 T1 ATE171979 T1 AT E171979T1
Authority
AT
Austria
Prior art keywords
pct
sec
date
pub
date dec
Prior art date
Application number
AT93910211T
Other languages
English (en)
Inventor
David Shaun Holywe Maternaghan
Original Assignee
Micro Image Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Image Technology Ltd filed Critical Micro Image Technology Ltd
Application granted granted Critical
Publication of ATE171979T1 publication Critical patent/ATE171979T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • ing And Chemical Polishing (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
AT93910211T 1992-05-16 1993-05-17 Ätzende zusammensetzung ATE171979T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929210514A GB9210514D0 (en) 1992-05-16 1992-05-16 Etching compositions

Publications (1)

Publication Number Publication Date
ATE171979T1 true ATE171979T1 (de) 1998-10-15

Family

ID=10715607

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93910211T ATE171979T1 (de) 1992-05-16 1993-05-17 Ätzende zusammensetzung

Country Status (8)

Country Link
US (1) US5496485A (de)
EP (1) EP0640120B1 (de)
JP (1) JP3630168B2 (de)
KR (1) KR950701671A (de)
AT (1) ATE171979T1 (de)
DE (1) DE69321465T2 (de)
GB (1) GB9210514D0 (de)
WO (1) WO1993023493A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5695661A (en) 1995-06-07 1997-12-09 Micron Display Technology, Inc. Silicon dioxide etch process which protects metal
JP3188843B2 (ja) * 1996-08-28 2001-07-16 ステラケミファ株式会社 微細加工表面処理剤及び微細加工表面処理方法
JP3408090B2 (ja) * 1996-12-18 2003-05-19 ステラケミファ株式会社 エッチング剤
US5843322A (en) * 1996-12-23 1998-12-01 Memc Electronic Materials, Inc. Process for etching N, P, N+ and P+ type slugs and wafers
US6149828A (en) * 1997-05-05 2000-11-21 Micron Technology, Inc. Supercritical etching compositions and method of using same
DE69939255D1 (de) * 1998-02-27 2008-09-18 Stella Chemifa K K Oberflächenbehandlungsmittel für mikrobearbeitung und verfahren zur behandlung einer oberfläche
KR100464305B1 (ko) * 1998-07-07 2005-04-13 삼성전자주식회사 에챈트를이용한pzt박막의청소방법
US6242165B1 (en) 1998-08-28 2001-06-05 Micron Technology, Inc. Supercritical compositions for removal of organic material and methods of using same
DE19843552A1 (de) 1998-09-23 2000-03-30 Bayer Ag Wäßrige Dispersionen mit reduziertem Gehalt an Triethylamin
US6453914B2 (en) 1999-06-29 2002-09-24 Micron Technology, Inc. Acid blend for removing etch residue
US6562726B1 (en) 1999-06-29 2003-05-13 Micron Technology, Inc. Acid blend for removing etch residue
EP1198534B1 (de) * 1999-07-13 2004-10-13 Kao Corporation Schleifmittelzusammensetzung
JP3714082B2 (ja) * 2000-01-13 2005-11-09 株式会社村田製作所 ランガサイト系単結晶基板の製造方法、ランガサイト系単結晶基板および圧電デバイス
US6465358B1 (en) * 2000-10-06 2002-10-15 Intel Corporation Post etch clean sequence for making a semiconductor device
KR100420100B1 (ko) * 2001-07-12 2004-03-04 삼성전자주식회사 알루미늄 에천트 조성물
US20030158057A1 (en) * 2002-02-21 2003-08-21 Kim Yeoung Ku Cleaning material of color cathode ray tube panel and the cleaning method using the same
US7192860B2 (en) * 2002-06-20 2007-03-20 Honeywell International Inc. Highly selective silicon oxide etching compositions
US20030235986A1 (en) * 2002-06-20 2003-12-25 Wolfgang Sievert Silicon oxide etching compositions with reduced water content
DE10344351A1 (de) * 2003-09-24 2005-05-19 Infineon Technologies Ag Verfahren zum anisotropen Ätzen von Silizium
JP4799843B2 (ja) * 2003-10-17 2011-10-26 三星電子株式会社 高いエッチング選択比を有するエッチング組成物、その製造方法、これを用いた酸化膜の選択的エッチング方法、及び半導体装置の製造方法
JP4810928B2 (ja) * 2004-08-18 2011-11-09 三菱瓦斯化学株式会社 洗浄液および洗浄法。
US7241920B2 (en) * 2004-11-09 2007-07-10 General Chemical Performance Products, Llc Filterable surfactant composition
US7112289B2 (en) * 2004-11-09 2006-09-26 General Chemical Performance Products Llc Etchants containing filterable surfactant
KR100579421B1 (ko) 2004-11-20 2006-05-12 테크노세미켐 주식회사 은 식각액 조성물
KR101452550B1 (ko) 2007-07-19 2014-10-21 미쓰비시 가가꾸 가부시키가이샤 Ⅲ 족 질화물 반도체 기판 및 그 세정 방법
US8153019B2 (en) * 2007-08-06 2012-04-10 Micron Technology, Inc. Methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
WO2010113616A1 (ja) * 2009-03-31 2010-10-07 ダイキン工業株式会社 エッチング液
TWI507508B (zh) * 2009-05-22 2015-11-11 Stella Chemifa Corp Micro-processing agent, and micro-processing methods
EP2438140A1 (de) * 2009-06-04 2012-04-11 Merck Patent GmbH Zweikomponentiges ätzen
JP7611857B2 (ja) * 2019-05-01 2025-01-10 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド エッチング組成物
WO2020251800A1 (en) 2019-06-13 2020-12-17 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
JP2025165671A (ja) * 2024-04-23 2025-11-05 ステラケミファ株式会社 基板処理液、基板処理方法、および基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3457107A (en) * 1965-07-20 1969-07-22 Diversey Corp Method and composition for chemically polishing metals
JPS5120972B1 (de) * 1971-05-13 1976-06-29
US3935118A (en) * 1973-03-05 1976-01-27 Philip A. Hunt Chemical Corporation Nitric acid system for etching magnesium plates
JPH062836B2 (ja) * 1986-08-06 1994-01-12 ポリプラスチックス株式会社 ポリアセタ−ル樹脂成形品の表面処理法
JPS63283028A (ja) * 1986-09-29 1988-11-18 Hashimoto Kasei Kogyo Kk 微細加工表面処理剤
US5277835A (en) * 1989-06-26 1994-01-11 Hashimoto Chemical Industries Co., Ltd. Surface treatment agent for fine surface treatment
DE4101564A1 (de) * 1991-01-21 1992-07-23 Riedel De Haen Ag Aetzloesung fuer nasschemische prozesse der halbleiterherstellung
JP2734839B2 (ja) * 1991-10-09 1998-04-02 シャープ株式会社 アルミニウム用エッチング液およびエッチング方法並びにアルミニウムエッチング製品

Also Published As

Publication number Publication date
JP3630168B2 (ja) 2005-03-16
JPH07506616A (ja) 1995-07-20
EP0640120A1 (de) 1995-03-01
DE69321465T2 (de) 1999-06-24
GB9210514D0 (en) 1992-07-01
EP0640120B1 (de) 1998-10-07
DE69321465D1 (de) 1998-11-12
KR950701671A (ko) 1995-04-28
WO1993023493A1 (en) 1993-11-25
US5496485A (en) 1996-03-05

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