ATE207141T1 - Elektrolytkupferfolie mit hoher zugspannung und verfahren zu deren herstellung - Google Patents

Elektrolytkupferfolie mit hoher zugspannung und verfahren zu deren herstellung

Info

Publication number
ATE207141T1
ATE207141T1 AT97918418T AT97918418T ATE207141T1 AT E207141 T1 ATE207141 T1 AT E207141T1 AT 97918418 T AT97918418 T AT 97918418T AT 97918418 T AT97918418 T AT 97918418T AT E207141 T1 ATE207141 T1 AT E207141T1
Authority
AT
Austria
Prior art keywords
copper foil
producing
high tensile
tensile strength
same
Prior art date
Application number
AT97918418T
Other languages
English (en)
Inventor
Hisao Sakai
Toshiko Yokota
Tsutomu Asai
Susumu Takahashi
Mitsuo Suzuki
Makoto Dobashi
Yasuji Hara
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE207141T1 publication Critical patent/ATE207141T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Push-Button Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT97918418T 1996-05-13 1997-05-13 Elektrolytkupferfolie mit hoher zugspannung und verfahren zu deren herstellung ATE207141T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14119896 1996-05-13
PCT/JP1997/001604 WO1997043466A1 (en) 1996-05-13 1997-05-13 High-tensile electrolytic copper foil and process for producing the same

Publications (1)

Publication Number Publication Date
ATE207141T1 true ATE207141T1 (de) 2001-11-15

Family

ID=15286439

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97918418T ATE207141T1 (de) 1996-05-13 1997-05-13 Elektrolytkupferfolie mit hoher zugspannung und verfahren zu deren herstellung

Country Status (11)

Country Link
US (2) US5958209A (de)
EP (1) EP0841412B1 (de)
JP (1) JP3346774B2 (de)
KR (1) KR100299392B1 (de)
CN (1) CN1125194C (de)
AT (1) ATE207141T1 (de)
DE (1) DE69707391T2 (de)
ES (1) ES2162278T3 (de)
MY (1) MY138743A (de)
TW (1) TW432124B (de)
WO (1) WO1997043466A1 (de)

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JP2000017476A (ja) * 1998-04-30 2000-01-18 Mitsui Mining & Smelting Co Ltd 分散強化型電解銅箔及びその製造方法
US6709564B1 (en) * 1999-09-30 2004-03-23 Rockwell Scientific Licensing, Llc Integrated circuit plating using highly-complexed copper plating baths
JP2001177204A (ja) * 1999-12-15 2001-06-29 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔の製造方法
JP3306404B2 (ja) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板
JP3661763B2 (ja) * 2000-01-28 2005-06-22 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3670185B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
JP3670186B2 (ja) * 2000-01-28 2005-07-13 三井金属鉱業株式会社 プリント配線板用表面処理銅箔の製造方法
DE10005680B4 (de) * 2000-02-07 2005-03-31 Cis Solartechnik Gmbh Trägermaterial für eine flexible, bandförmige CIS-Solarzelle
LU90532B1 (en) * 2000-02-24 2001-08-27 Circuit Foil Luxembourg Trading Sarl Comosite copper foil and manufacturing method thereof
JP2002111185A (ja) * 2000-10-03 2002-04-12 Sony Chem Corp バンプ付き配線回路基板及びその製造方法
JP3789107B2 (ja) 2002-07-23 2006-06-21 株式会社日鉱マテリアルズ 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔
JP4273309B2 (ja) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
AU2005202863B2 (en) * 2004-09-06 2006-11-30 Nippon Mining & Metals Co., Ltd. Method for producing sheet-form electrolytic copper
JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
KR100941219B1 (ko) * 2005-03-31 2010-02-10 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용하여 얻어진 표면 처리 전해 동박, 그 표면 처리 전해 동박을 이용한 동장 적층판 및 프린트 배선판
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
CN101426959B (zh) * 2006-04-28 2010-11-17 三井金属矿业株式会社 电解铜箔、采用该电解铜箔的表面处理铜箔及采用该表面处理铜箔的覆铜层压板以及该电解铜箔的制造方法
JP5255229B2 (ja) * 2006-04-28 2013-08-07 三井金属鉱業株式会社 電解銅箔、その電解銅箔を用いた表面処理銅箔及びその表面処理銅箔を用いた銅張積層板並びにその電解銅箔の製造方法
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US8303792B1 (en) 2007-08-29 2012-11-06 Magnecomp Corporation High strength electrodeposited suspension conductors
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US9428840B2 (en) * 2011-10-31 2016-08-30 Furukawa Electric Co., Ltd. High strength, high heat resistance electrodeposited copper foil and manufacturing method for same
JP5875350B2 (ja) * 2011-11-30 2016-03-02 三井金属鉱業株式会社 電解銅合金箔及びキャリア箔付電解銅合金箔
US9663868B2 (en) 2011-12-28 2017-05-30 Mitsui Mining & Smelting Co., Ltd. Electro-deposited copper-alloy foil and electro-deposited copper-alloy foil provided with carrier foil
JP5722813B2 (ja) * 2012-03-02 2015-05-27 Jx日鉱日石金属株式会社 電解銅箔及び二次電池用負極集電体
JP5201431B1 (ja) * 2012-05-17 2013-06-05 日立電線株式会社 圧延銅箔
JP5201432B1 (ja) * 2012-05-17 2013-06-05 日立電線株式会社 圧延銅箔
JP5718476B2 (ja) * 2012-06-27 2015-05-13 古河電気工業株式会社 リチウムイオン二次電池用電解銅箔、リチウムイオン二次電池の負極電極及びリチウムイオン二次電池
CN102995086A (zh) * 2012-12-11 2013-03-27 联合铜箔(惠州)有限公司 一种生产低轮廓电解铜箔用添加剂及生产工艺
TWI499693B (zh) * 2013-02-22 2015-09-11 Jx Nippon Mining & Metals Corp Production method of copper foil and graphene for graphene production
TWI533496B (zh) 2013-07-23 2016-05-11 Chang Chun Petrochemical Co Electrolytic copper foil
CN105492660B (zh) * 2013-08-01 2017-12-01 古河电气工业株式会社 配线基板用铜箔
KR101500566B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
KR101500565B1 (ko) * 2014-03-20 2015-03-12 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 집전체, 음극 및 리튬전지
TWI542739B (zh) * 2014-03-21 2016-07-21 長春石油化學股份有限公司 電解銅箔
WO2016117587A1 (ja) * 2015-01-22 2016-07-28 三井金属鉱業株式会社 キャリア付極薄銅箔及びその製造方法
KR102318603B1 (ko) * 2016-08-23 2021-10-27 에스케이넥실리스 주식회사 이차전지의 용량 유지율을 향상시킬 수 있는 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
KR101733408B1 (ko) 2016-11-11 2017-05-10 일진머티리얼즈 주식회사 이차전지용 전해동박 및 그의 제조방법
KR101733410B1 (ko) * 2016-11-11 2017-05-10 일진머티리얼즈 주식회사 저온 물성이 우수한 이차전지용 전해동박 및 그의 제조방법
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
KR101755203B1 (ko) 2016-11-11 2017-07-10 일진머티리얼즈 주식회사 이차전지용 전해동박 및 그의 제조방법
TWI619850B (zh) * 2017-02-24 2018-04-01 南亞塑膠工業股份有限公司 電解液、電解銅箔及其製造方法
PL245191B1 (pl) * 2020-01-30 2024-05-27 Mitsui Mining & Smelting Co Ltd Elektrolityczna folia miedziana
KR102844898B1 (ko) 2020-04-27 2025-08-11 엘지이노텍 주식회사 회로기판, 센서 구동장치 및 이를 포함하는 카메라 모듈
KR20220043617A (ko) * 2020-09-29 2022-04-05 에스케이넥실리스 주식회사 고강도 전해동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지 및 그것의 제조방법
KR102413300B1 (ko) * 2020-12-10 2022-06-27 와이엠티 주식회사 금속박, 이를 포함하는 캐리어 부착 금속박 및 이를 포함하는 인쇄회로기판
KR102495997B1 (ko) 2021-03-11 2023-02-06 일진머티리얼즈 주식회사 낮은 휨 변형을 갖는 저조도 표면처리동박, 이를 포함하는 동박적층판 및 프린트 배선판
CN120485893A (zh) * 2025-06-18 2025-08-15 东强（连州）铜箔有限公司 一种超高精细化pcb用高强度vlp铜箔及其制备方法

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Also Published As

Publication number Publication date
EP0841412B1 (de) 2001-10-17
US6194056B1 (en) 2001-02-27
US5958209A (en) 1999-09-28
EP0841412A4 (de) 1999-02-03
KR19990028891A (ko) 1999-04-15
ES2162278T3 (es) 2001-12-16
CN1125194C (zh) 2003-10-22
EP0841412A1 (de) 1998-05-13
WO1997043466A1 (en) 1997-11-20
DE69707391D1 (de) 2001-11-22
TW432124B (en) 2001-05-01
MY138743A (en) 2009-07-31
DE69707391T2 (de) 2002-07-11
KR100299392B1 (ko) 2001-09-22
JP3346774B2 (ja) 2002-11-18
CN1193360A (zh) 1998-09-16

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