ATE82333T1 - Kupferfolie, durch elektrolytische abscheidung hergestellt. - Google Patents

Kupferfolie, durch elektrolytische abscheidung hergestellt.

Info

Publication number
ATE82333T1
ATE82333T1 AT86105554T AT86105554T ATE82333T1 AT E82333 T1 ATE82333 T1 AT E82333T1 AT 86105554 T AT86105554 T AT 86105554T AT 86105554 T AT86105554 T AT 86105554T AT E82333 T1 ATE82333 T1 AT E82333T1
Authority
AT
Austria
Prior art keywords
copper foil
electrolytic deposition
foil manufactured
electrolyzing
manufactured
Prior art date
Application number
AT86105554T
Other languages
English (en)
Inventor
Kuniki Ueno
Kazuyoshi Nabekura
Yutaka Hirasawa
Makoto Fujiki
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15411921&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE82333(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP60146623A external-priority patent/JPS6210291A/ja
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE82333T1 publication Critical patent/ATE82333T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Cosmetics (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Fats And Perfumes (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
AT86105554T 1985-07-05 1986-04-22 Kupferfolie, durch elektrolytische abscheidung hergestellt. ATE82333T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60146623A JPS6210291A (ja) 1985-07-05 1985-07-05 電解銅箔
EP86105554A EP0207244B2 (de) 1985-07-05 1986-04-22 Verfahren zur Herstellung einer Kupferfolie durch elektrolytische Abscheidung.

Publications (1)

Publication Number Publication Date
ATE82333T1 true ATE82333T1 (de) 1992-11-15

Family

ID=15411921

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86105554T ATE82333T1 (de) 1985-07-05 1986-04-22 Kupferfolie, durch elektrolytische abscheidung hergestellt.

Country Status (7)

Country Link
EP (1) EP0207244B2 (de)
JP (1) JPH0610181A (de)
AT (1) ATE82333T1 (de)
DE (1) DE3687089T3 (de)
ES (1) ES8708151A1 (de)
FI (1) FI862842L (de)
NO (1) NO862041L (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837764A (en) * 1987-03-26 1989-06-06 Bunker Ramo Corporation Programmable apparatus and method for testing computer peripherals
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
TW432124B (en) 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
JP3670179B2 (ja) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板
JP3521074B2 (ja) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 電解銅箔の物性検査方法
JP2004269950A (ja) * 2003-03-07 2004-09-30 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH494824A (de) * 1969-07-10 1970-08-15 Fluehmann Werner Verfahren zur elektrolytischen Abscheidung von Kupfer hoher Duktilität
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
JPS6152387A (ja) * 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法

Also Published As

Publication number Publication date
EP0207244A2 (de) 1987-01-07
ES556394A0 (es) 1987-07-01
FI862842A0 (fi) 1986-07-04
FI862842A7 (fi) 1987-01-06
EP0207244B1 (de) 1992-11-11
NO862041L (no) 1987-01-06
JPH0610181A (ja) 1994-01-18
DE3687089T2 (de) 1993-03-18
FI862842L (fi) 1987-01-06
DE3687089D1 (de) 1992-12-17
DE3687089T3 (de) 1999-10-07
ES8708151A1 (es) 1987-07-01
EP0207244B2 (de) 1999-03-31
EP0207244A3 (en) 1988-05-25

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Legal Events

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