ATE235574T1 - Kupfer-legierung mit verbesserter bruchfestigkeit - Google Patents

Kupfer-legierung mit verbesserter bruchfestigkeit

Info

Publication number
ATE235574T1
ATE235574T1 AT00107405T AT00107405T ATE235574T1 AT E235574 T1 ATE235574 T1 AT E235574T1 AT 00107405 T AT00107405 T AT 00107405T AT 00107405 T AT00107405 T AT 00107405T AT E235574 T1 ATE235574 T1 AT E235574T1
Authority
AT
Austria
Prior art keywords
weight percent
copper alloy
alloy
breaking strength
iron
Prior art date
Application number
AT00107405T
Other languages
English (en)
Inventor
Frank N Mandigo
John F Breedis
Original Assignee
Olin Corp Corp Of The Commonwe
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp Corp Of The Commonwe filed Critical Olin Corp Corp Of The Commonwe
Application granted granted Critical
Publication of ATE235574T1 publication Critical patent/ATE235574T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
AT00107405T 1999-05-04 2000-04-05 Kupfer-legierung mit verbesserter bruchfestigkeit ATE235574T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/304,803 US6251199B1 (en) 1999-05-04 1999-05-04 Copper alloy having improved resistance to cracking due to localized stress

Publications (1)

Publication Number Publication Date
ATE235574T1 true ATE235574T1 (de) 2003-04-15

Family

ID=23178098

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00107405T ATE235574T1 (de) 1999-05-04 2000-04-05 Kupfer-legierung mit verbesserter bruchfestigkeit

Country Status (11)

Country Link
US (1) US6251199B1 (de)
EP (1) EP1050594B1 (de)
JP (1) JP3872932B2 (de)
KR (1) KR100709908B1 (de)
CN (1) CN1140647C (de)
AT (1) ATE235574T1 (de)
CA (1) CA2370170A1 (de)
DE (1) DE60001762T2 (de)
MX (1) MXPA01011101A (de)
TW (1) TW500814B (de)
WO (1) WO2000066803A1 (de)

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KR100513943B1 (ko) * 2001-03-27 2005-09-09 닛꼬 긴조꾸 가꼬 가부시키가이샤 구리 및 구리합금과 그 제조방법
US6764556B2 (en) 2002-05-17 2004-07-20 Shinya Myojin Copper-nickel-silicon two phase quench substrate
US7291231B2 (en) * 2002-05-17 2007-11-06 Metglas, Inc. Copper-nickel-silicon two phase quench substrate
US7182823B2 (en) * 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
US7291232B2 (en) * 2003-09-23 2007-11-06 Luvata Oy Process for high strength, high conductivity copper alloy of Cu-Ni-Si group
JP4166197B2 (ja) * 2004-06-30 2008-10-15 日鉱金属株式会社 ＢａｄＷａｙの曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
JP4566020B2 (ja) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 異方性の小さい電気電子部品用銅合金板
JP5306591B2 (ja) * 2005-12-07 2013-10-02 古河電気工業株式会社 配線用電線導体、配線用電線、及びそれらの製造方法
JP5156317B2 (ja) * 2006-09-27 2013-03-06 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造法
US8287669B2 (en) 2007-05-31 2012-10-16 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
WO2009098810A1 (ja) * 2008-02-08 2009-08-13 Mitsui Mining & Smelting Co., Ltd. 析出硬化型銅合金条の製造方法
GB0905346D0 (en) 2009-03-27 2009-05-13 British Telecomm Apparatus for repairing wiring
JP5714863B2 (ja) 2010-10-14 2015-05-07 矢崎総業株式会社 雌端子および雌端子の製造方法
JP5557761B2 (ja) * 2011-01-26 2014-07-23 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
CN105229192B (zh) 2013-03-14 2018-09-11 美题隆公司 提高锻造铜-镍-锡合金的可成形性
CN109930026B (zh) * 2017-12-18 2020-12-18 有研工程技术研究院有限公司 一种高强度高导电、耐应力松弛铜合金引线框架材料及其制备方法
US20220396853A1 (en) * 2019-11-29 2022-12-15 Mitsubishi Materials Corporation Copper alloy, copper alloy plastic working material, component for electronic/electrical equipment, terminal, busbar, and heat- diffusing substrate
KR102421870B1 (ko) * 2022-05-19 2022-07-19 주식회사 풍산 강도, 전기전도도 및 굽힘가공성이 우수한 구리-니켈-실리콘-망간-주석계 동합금재 및 그의 제조 방법

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JP3049137B2 (ja) 1991-12-27 2000-06-05 株式会社神戸製鋼所 曲げ加工性が優れた高力銅合金及びその製造方法
JP3275377B2 (ja) * 1992-07-28 2002-04-15 三菱伸銅株式会社 微細組織を有する電気電子部品用Ｃｕ合金板材
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KR0157257B1 (ko) 1995-12-08 1998-11-16 정훈보 석출물 성장 억제형 고강도, 고전도성 동합금 및 그 제조방법
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US5868877A (en) 1997-07-22 1999-02-09 Olin Corporation Copper alloy having improved stress relaxation

Also Published As

Publication number Publication date
HK1029813A1 (en) 2001-04-12
EP1050594A1 (de) 2000-11-08
JP3872932B2 (ja) 2007-01-24
DE60001762T2 (de) 2004-03-04
CN1353775A (zh) 2002-06-12
CN1140647C (zh) 2004-03-03
WO2000066803A1 (en) 2000-11-09
DE60001762D1 (de) 2003-04-30
TW500814B (en) 2002-09-01
MXPA01011101A (es) 2002-07-22
CA2370170A1 (en) 2000-11-09
JP2000355721A (ja) 2000-12-26
US6251199B1 (en) 2001-06-26
KR20010113909A (ko) 2001-12-28
KR100709908B1 (ko) 2007-04-24
EP1050594B1 (de) 2003-03-26

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Legal Events

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