ATE236436T1 - Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum - Google Patents

Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum

Info

Publication number
ATE236436T1
ATE236436T1 AT00925432T AT00925432T ATE236436T1 AT E236436 T1 ATE236436 T1 AT E236436T1 AT 00925432 T AT00925432 T AT 00925432T AT 00925432 T AT00925432 T AT 00925432T AT E236436 T1 ATE236436 T1 AT E236436T1
Authority
AT
Austria
Prior art keywords
integrated circuit
electronic device
grid
dilectric
producing
Prior art date
Application number
AT00925432T
Other languages
English (en)
Inventor
Lucille Dossetto
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Application granted granted Critical
Publication of ATE236436T1 publication Critical patent/ATE236436T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Details Of Aerials (AREA)
  • Electric Clocks (AREA)
AT00925432T 1999-05-25 2000-05-11 Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum ATE236436T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9906585A FR2794266B1 (fr) 1999-05-25 1999-05-25 Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout
PCT/FR2000/001268 WO2000072254A1 (fr) 1999-05-25 2000-05-11 Procede de fabrication de dispositif electronique portable a circuit integre comportant un dielectrique bas cout

Publications (1)

Publication Number Publication Date
ATE236436T1 true ATE236436T1 (de) 2003-04-15

Family

ID=9545963

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00925432T ATE236436T1 (de) 1999-05-25 2000-05-11 Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum

Country Status (8)

Country Link
US (1) US6521985B1 (de)
EP (1) EP1190377B1 (de)
CN (1) CN1351733A (de)
AT (1) ATE236436T1 (de)
AU (1) AU4415800A (de)
DE (1) DE60001943D1 (de)
FR (1) FR2794266B1 (de)
WO (1) WO2000072254A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5817207A (en) 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
US6791172B2 (en) * 2001-04-25 2004-09-14 General Semiconductor Of Taiwan, Ltd. Power semiconductor device manufactured using a chip-size package
US20050266611A1 (en) * 2004-06-01 2005-12-01 Jack Tu Flip chip packaging method and flip chip assembly thereof
EP1739596A1 (de) * 2005-06-21 2007-01-03 VisionCard PersonalisierungsgmbH Karte und Herstellungsverfahren
US7777317B2 (en) * 2005-12-20 2010-08-17 Assa Abloy Identification Technologies Austria GmbH (Austria) Card and manufacturing method
FR2968431B1 (fr) * 2010-12-06 2012-12-28 Oberthur Technologies Procédé de fabrication d'un dispositif a microcircuit
US9122968B2 (en) 2012-04-03 2015-09-01 X-Card Holdings, Llc Information carrying card comprising a cross-linked polymer composition, and method of making the same
US9439334B2 (en) 2012-04-03 2016-09-06 X-Card Holdings, Llc Information carrying card comprising crosslinked polymer composition, and method of making the same
WO2014149926A1 (en) 2013-03-15 2014-09-25 X-Card Holdings, Llc Methods of making a core layer for an information carrying card, and resulting products
US10043541B1 (en) * 2015-12-12 2018-08-07 Magnecomp Corporation Disk drive head stack assembly having height-controlled suspension circuit tail tack
EP3762871B1 (de) 2018-03-07 2024-08-07 X-Card Holdings, LLC Metallkarte
TWI688317B (zh) * 2018-10-31 2020-03-11 台灣愛司帝科技股份有限公司 發光二極體晶片的固接方法及固接裝置
US12220897B2 (en) 2022-10-20 2025-02-11 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same
US12528279B2 (en) 2022-10-20 2026-01-20 X-Card Holdings, Llc Core layer for information carrying card, resulting information carrying card, and methods of making the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
JPH01108095A (ja) * 1987-10-20 1989-04-25 Ryoden Kasei Co Ltd Ｉｃカード
JP3061954B2 (ja) * 1991-08-20 2000-07-10 株式会社東芝 半導体装置
EP0538010A3 (en) * 1991-10-17 1993-05-19 Fujitsu Limited Semiconductor package, a holder, a method of production and testing for the same
TW258829B (de) * 1994-01-28 1995-10-01 Ibm
EP0688050A1 (de) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Montageverfahren für IC-Karte und so erhaltene Karte
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
US5710695A (en) * 1995-11-07 1998-01-20 Vlsi Technology, Inc. Leadframe ball grid array package
FR2741191B1 (fr) * 1995-11-14 1998-01-09 Sgs Thomson Microelectronics Procede de fabrication d'un micromodule, notamment pour cartes a puces
DE19621044A1 (de) * 1996-05-24 1997-11-27 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines kartenförmigen Datenträgers
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置

Also Published As

Publication number Publication date
FR2794266A1 (fr) 2000-12-01
DE60001943D1 (de) 2003-05-08
US6521985B1 (en) 2003-02-18
EP1190377B1 (de) 2003-04-02
AU4415800A (en) 2000-12-12
EP1190377A1 (de) 2002-03-27
FR2794266B1 (fr) 2002-01-25
CN1351733A (zh) 2002-05-29
WO2000072254A1 (fr) 2000-11-30

Similar Documents

Publication Publication Date Title
ATE236436T1 (de) Verfahren zur herstellung einer tragbaren elektronischen anordnung mit einer integrierten schaltung mit kostengünstigem dielektricum
DE60003167D1 (de) Verfahren zur herstellung einer elektronischen vorrichtung der kontaktlosen karten art
TW200509420A (en) Heatsinking electronic devices
TW338185B (en) Multi-electronic device package
DE60139809D1 (de) Elektronische verpackung mit eingebettetem kondensator und deren herstellungsverfahren
MXPA06000842A (es) Tarjeta de circuito impreso con componentes empotrados y metodo de fabricacion.
SG81960A1 (en) Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument
TW429560B (en) Heatspreader for a flip chip device, and method for connecting the heatspreader
TW200725880A (en) Semiconductor piezoresistive sensor and operation method thereof
EP2261970A3 (de) Verfahren zur Herstellung einer Halbleitervorrichtung mit einem Schritt zur Anbringung einer Kupferfolie auf einem Substrat, als Teil einer eine Elektrodenfläche mit einem Anschlusselement verbindenden Verdrahtung
DE59704976D1 (de) Trägerelement für einen halbleiterchip
EP1244055A3 (de) Tragbares elektronisches Medium und Herstellungsverfahren
MY137304A (en) Jig for holding and conveyance, and holding and conveyance method
TW200620519A (en) Laminated board and probe card
TW200610080A (en) Electronic device and method of manufacturing the same
TW200605169A (en) Circuit device and process for manufacture thereof
EP1884995A3 (de) Schaltungssubstrat, Herstellungsverfahren dafür und Halbleitervorrichtung
ATE243349T1 (de) Flächiger träger mit mindestens einem halbleiterchip
DE50305281D1 (de) Datenträger mit transponderspule
TW200503516A (en) Electronic device, SIM card socket and its manufacturing method
TW200601536A (en) Multilayer leadframe module with embedded passive components and method of producing the same
TW200520157A (en) Device and method for manufacturing the same
ATE519359T1 (de) Übertragungsleitung
DE50211933D1 (de) Folienbatterie mit integriertem bauelement zur verwendung in einer chipkarte
ATE498872T1 (de) Verfahren zur herstellung eines transponders und transponder

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties