ATE236453T1 - Vorrichtung zur erzeugung eines ausgedehnten induktionsplasmas für plasmabehandlungen - Google Patents

Vorrichtung zur erzeugung eines ausgedehnten induktionsplasmas für plasmabehandlungen

Info

Publication number
ATE236453T1
ATE236453T1 AT98401199T AT98401199T ATE236453T1 AT E236453 T1 ATE236453 T1 AT E236453T1 AT 98401199 T AT98401199 T AT 98401199T AT 98401199 T AT98401199 T AT 98401199T AT E236453 T1 ATE236453 T1 AT E236453T1
Authority
AT
Austria
Prior art keywords
plasma
process chamber
generating
internal
electromagnetic energy
Prior art date
Application number
AT98401199T
Other languages
English (en)
Inventor
Pascal Colpo
Francois Rossi
Jean Daviet
Roland Ernst
Original Assignee
Europ Economic Community
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Europ Economic Community filed Critical Europ Economic Community
Application granted granted Critical
Publication of ATE236453T1 publication Critical patent/ATE236453T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32504—Means for preventing sputtering of the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Magnetic Treatment Devices (AREA)
  • Arc Welding In General (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT98401199T 1997-10-10 1998-05-19 Vorrichtung zur erzeugung eines ausgedehnten induktionsplasmas für plasmabehandlungen ATE236453T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97402395A EP0908921A1 (de) 1997-10-10 1997-10-10 Bearbeitungskammer zur Plasma gesteigerte chemischen Dampfphasenabscheidung und diese Bearbeitungskammer benutzende Vorrichtung
EP98400888A EP0908922B1 (de) 1997-10-10 1998-04-10 Bearbeitungskammer zur Plasma Behandlung und diese Bearbeitungskammer benutzende Vorrichtung

Publications (1)

Publication Number Publication Date
ATE236453T1 true ATE236453T1 (de) 2003-04-15

Family

ID=8229877

Family Applications (2)

Application Number Title Priority Date Filing Date
AT98400888T ATE249098T1 (de) 1997-10-10 1998-04-10 Bearbeitungskammer zur plasma behandlung und diese bearbeitungskammer benutzende vorrichtung
AT98401199T ATE236453T1 (de) 1997-10-10 1998-05-19 Vorrichtung zur erzeugung eines ausgedehnten induktionsplasmas für plasmabehandlungen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT98400888T ATE249098T1 (de) 1997-10-10 1998-04-10 Bearbeitungskammer zur plasma behandlung und diese bearbeitungskammer benutzende vorrichtung

Country Status (6)

Country Link
EP (2) EP0908921A1 (de)
AT (2) ATE249098T1 (de)
DE (3) DE69817721T2 (de)
DK (2) DK0908922T3 (de)
ES (2) ES2205398T3 (de)
PT (2) PT908922E (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1228810C (zh) * 1997-04-21 2005-11-23 东京电子亚利桑那公司 物理汽相沉积的方法和设备
US6565717B1 (en) 1997-09-15 2003-05-20 Applied Materials, Inc. Apparatus for sputtering ionized material in a medium to high density plasma
US6080287A (en) * 1998-05-06 2000-06-27 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6287435B1 (en) 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
US6390019B1 (en) 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
GB9812852D0 (en) * 1998-06-16 1998-08-12 Surface Tech Sys Ltd Plasma processing apparatus
DE19923018C2 (de) * 1999-05-19 2001-09-27 Univ Dresden Tech Vorrichtung zur Bearbeitung bandförmiger Werkstücke mit Hilfe resonanter Hochfrequenzplasmen
DE60140803D1 (de) 2000-05-17 2010-01-28 Ihi Corp Plasma-cvd-vorrichtung und verfahren
US6831742B1 (en) 2000-10-23 2004-12-14 Applied Materials, Inc Monitoring substrate processing using reflected radiation
JP4770029B2 (ja) 2001-01-22 2011-09-07 株式会社Ｉｈｉ プラズマｃｖｄ装置及び太陽電池の製造方法
US6673199B1 (en) 2001-03-07 2004-01-06 Applied Materials, Inc. Shaping a plasma with a magnetic field to control etch rate uniformity
US20040129221A1 (en) * 2003-01-08 2004-07-08 Jozef Brcka Cooled deposition baffle in high density plasma semiconductor processing
DE10358505B4 (de) * 2003-12-13 2007-10-11 Roth & Rau Ag Plasmaquelle zur Erzeugung eines induktiv gekoppelten Plasmas

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3879597A (en) * 1974-08-16 1975-04-22 Int Plasma Corp Plasma etching device and process
AT369927B (de) * 1980-04-15 1983-02-10 Vmei Lenin Nis Baugruppe zum schutz elektrischer isolatoren vor einer glimmentladung
US4795879A (en) * 1987-04-13 1989-01-03 The United States Of America As Represented By The United States Department Of Energy Method of processing materials using an inductively coupled plasma
US4990229A (en) * 1989-06-13 1991-02-05 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
JPH04350156A (ja) * 1991-05-27 1992-12-04 Ishikawajima Harima Heavy Ind Co Ltd 薄膜形成装置
US5641375A (en) * 1994-08-15 1997-06-24 Applied Materials, Inc. Plasma etching reactor with surface protection means against erosion of walls
US5556521A (en) * 1995-03-24 1996-09-17 Sony Corporation Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source
US5763851A (en) * 1995-11-27 1998-06-09 Applied Materials, Inc. Slotted RF coil shield for plasma deposition system
TW327236B (en) * 1996-03-12 1998-02-21 Varian Associates Inductively coupled plasma reactor with faraday-sputter shield
TW324831B (en) * 1996-05-09 1998-01-11 Applied Materials Inc Plasma generating device

Also Published As

Publication number Publication date
DE69817721T2 (de) 2004-07-22
ES2205398T3 (es) 2004-05-01
DE69812830D1 (de) 2003-05-08
EP0908922A1 (de) 1999-04-14
DE69838823D1 (de) 2008-01-17
EP0908921A1 (de) 1999-04-14
DK0908922T3 (da) 2004-01-19
ATE249098T1 (de) 2003-09-15
PT908923E (pt) 2003-08-29
PT908922E (pt) 2004-01-30
DE69812830T2 (de) 2003-11-06
DE69838823T2 (de) 2008-11-13
DK0908923T3 (da) 2003-07-21
EP0908922B1 (de) 2003-09-03
ES2192750T3 (es) 2003-10-16
DE69817721D1 (de) 2003-10-09

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