ATE247326T1 - Epoxidharzgiessmasse - Google Patents

Epoxidharzgiessmasse

Info

Publication number
ATE247326T1
ATE247326T1 AT95924261T AT95924261T ATE247326T1 AT E247326 T1 ATE247326 T1 AT E247326T1 AT 95924261 T AT95924261 T AT 95924261T AT 95924261 T AT95924261 T AT 95924261T AT E247326 T1 ATE247326 T1 AT E247326T1
Authority
AT
Austria
Prior art keywords
epoxy resin
resin casting
glycidyl
beta
components
Prior art date
Application number
AT95924261T
Other languages
English (en)
Inventor
Werner Hollstein
Werner Pfander
Irene Jennrich
Rolf Grebenstein
Original Assignee
Vantico Ag
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag, Bosch Gmbh Robert filed Critical Vantico Ag
Application granted granted Critical
Publication of ATE247326T1 publication Critical patent/ATE247326T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Insulating Of Coils (AREA)
  • Organic Insulating Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Medicines Containing Plant Substances (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AT95924261T 1994-07-01 1995-06-17 Epoxidharzgiessmasse ATE247326T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH211994 1994-07-01
PCT/EP1995/002345 WO1996001481A1 (en) 1994-07-01 1995-06-17 Epoxy resin casting composition

Publications (1)

Publication Number Publication Date
ATE247326T1 true ATE247326T1 (de) 2003-08-15

Family

ID=4226319

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95924261T ATE247326T1 (de) 1994-07-01 1995-06-17 Epoxidharzgiessmasse

Country Status (11)

Country Link
US (2) US5872163A (de)
EP (1) EP0787348B1 (de)
JP (1) JP3896529B2 (de)
KR (1) KR100366481B1 (de)
AT (1) ATE247326T1 (de)
AU (1) AU692890B2 (de)
DE (1) DE69531500T2 (de)
ES (1) ES2203643T3 (de)
HU (1) HU220297B (de)
PT (1) PT787348E (de)
WO (1) WO1996001481A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6103157A (en) * 1997-07-02 2000-08-15 Ciba Specialty Chemicals Corp. Process for impregnating electrical coils
JP3422252B2 (ja) * 1998-04-22 2003-06-30 株式会社日立製作所 高電圧トランスおよびそれを用いた点火トランス
DE19910711A1 (de) * 1999-03-10 2000-09-14 Bakelite Ag Imprägniervergußmassen, ihre Verwendung sowie ein Verfahren zur Imprägnierung von Zündspulen
US6758993B2 (en) * 2002-04-17 2004-07-06 Delphi Technologies, Inc. System and method for minimizing cure-induced residual stress in an epoxy impregnated ignition coil
DE10247411B4 (de) * 2002-10-11 2012-12-20 Robert Bosch Gmbh Verfahren zur Herstellung einer bauraumoptimierten Primärdrahtwicklung für eine Stabzündspule
US7671114B2 (en) * 2004-01-26 2010-03-02 Henkel Corporation Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder
DE102005060860A1 (de) * 2005-12-20 2007-06-28 Robert Bosch Gmbh Elektronikkomponente mit Vergussmasse
EP2009145B1 (de) * 2006-04-13 2017-11-15 NTN Corporation Dichtstoff, mit aufgespritzten überzügen bedeckte elemente und lager
ES2341375T3 (es) * 2007-04-03 2010-06-18 Abb Research Ltd Composicion de resina epoxi curable.
JP5256795B2 (ja) * 2008-03-14 2013-08-07 住友ベークライト株式会社 熱硬化性樹脂成形材料
US7982133B2 (en) * 2008-08-29 2011-07-19 Pratt & Whitney Canada Corp. Crack controlled resin insulated electrical coil
KR101555191B1 (ko) * 2009-02-11 2015-09-24 삼성전자 주식회사 카본/에폭시 수지 조성물 및 이를 이용한 카본-에폭시 유전막의 제조방법
DE102009012195A1 (de) * 2009-03-06 2010-09-09 Siemens Aktiengesellschaft Gießharzsystem für Isolatoren mit erhöhter Wärmeformbeständigkeit
JP5483696B2 (ja) * 2010-01-07 2014-05-07 株式会社Ａｄｅｋａ 硬化性樹脂組成物
US9751107B2 (en) 2012-03-21 2017-09-05 Valspar Sourcing, Inc. Two-coat single cure powder coating
PL2828008T5 (pl) * 2012-03-21 2025-11-17 Swimc Llc Sposób powlekania proszkowego
EP4079935A3 (de) 2012-03-21 2023-01-25 Swimc Llc Doppelpulverbeschichtung mit einzelhärtung
CA2902617C (en) * 2013-03-15 2021-03-02 Plasma Systems Holdings, Inc. Multi-function epoxy casting resin system
JP6318518B2 (ja) * 2013-09-26 2018-05-09 住友ベークライト株式会社 エポキシ樹脂成形材料、モールドコイルの製造方法及びモールドコイル
EP2933019A1 (de) 2014-04-15 2015-10-21 Henkel AG&Co. KGAA Lagerstabile, wärmeaktivierbare quaternäre Ammoniumkatalysatoren zur Epoxid-Härtung
JP6657566B2 (ja) * 2015-02-24 2020-03-04 三菱ケミカル株式会社 低粘度樹脂組成物
EP3173434B1 (de) * 2014-07-24 2019-11-20 Mitsubishi Chemical Corporation Wärmehärtende harzzusammensetzung und formkörper daraus
US10287387B2 (en) 2014-09-11 2019-05-14 Kaneka Corporation Epoxy resin composition for casting
JP6137407B2 (ja) * 2015-03-27 2017-05-31 東レ株式会社 繊維強化複合材料用２液型エポキシ樹脂組成物および繊維強化複合材料
FR3091406B1 (fr) 2018-12-31 2021-01-15 Centre National De Recherche Scient Cnrs Matériau pour l’isolation électrique et procédé de fabrication
JP2021161310A (ja) * 2020-04-01 2021-10-11 株式会社東芝 注型樹脂、および密閉型絶縁装置
CN117682796A (zh) * 2023-12-20 2024-03-12 华能中天节能科技集团有限责任公司 一种防水岩棉保温板及其制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008048B1 (de) * 1978-07-31 1984-01-18 Sumitomo Bakelite Company Limited Verfahren zur Herstellung eines elektrischen Gegenstandes
DE3006491C2 (de) * 1980-02-21 1983-01-05 Streif AG, 5461 Vettelschoß Versetzbares, an einem Bauwerk verankertes Gerüst
CA1154895A (en) * 1980-02-21 1983-10-04 Dieter Skudelny Flowable mixture and use of synthetic calcium silicate
CA1164124A (en) * 1980-07-15 1984-03-20 Kurt Munk Pourable solid mixture
DE3229558C2 (de) * 1982-08-07 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart Imprägniervergußmasse für elektrische Bauteile
JPS61106618A (ja) * 1984-10-31 1986-05-24 Nippon Soda Co Ltd 複合エポキシ樹脂の製造方法
DE3762348D1 (de) * 1986-05-07 1990-05-23 Ciba Geigy Ag Glasfaserverstaerkte epoxidharzformmasse und deren verwendung.
JPH0660294B2 (ja) * 1986-06-05 1994-08-10 ソマ−ル株式会社 エポキシ樹脂系粉体塗料組成物
EP0348193A3 (de) * 1988-06-24 1990-09-12 Somar Corporation Epoxydharzzusammensetzung
US5064881A (en) * 1989-01-18 1991-11-12 Mitsui Petrochemical Industries, Ltd. Epoxy resin composition and semiconductor sealing material comprising same based on spherical silica
JPH0799915B2 (ja) * 1989-08-26 1995-10-25 株式会社日立製作所 回転電機の回転子及びその絶縁方法
EP0540467A1 (de) * 1991-10-29 1993-05-05 Ciba-Geigy Ag Stabilisierte Epoxidharz-Zusammensetzungen

Also Published As

Publication number Publication date
EP0787348A1 (de) 1997-08-06
JP2000510497A (ja) 2000-08-15
HUT75581A (en) 1997-05-28
EP0787348B1 (de) 2003-08-13
ES2203643T3 (es) 2004-04-16
WO1996001481A1 (en) 1996-01-18
AU2884395A (en) 1996-01-25
US6030713A (en) 2000-02-29
DE69531500T2 (de) 2004-04-08
JP3896529B2 (ja) 2007-03-22
HU220297B (hu) 2001-11-28
HU9603545D0 (en) 1997-02-28
KR100366481B1 (ko) 2005-01-25
US5872163A (en) 1999-02-16
AU692890B2 (en) 1998-06-18
DE69531500D1 (de) 2003-09-18
PT787348E (pt) 2003-12-31

Similar Documents

Publication Publication Date Title
ATE247326T1 (de) Epoxidharzgiessmasse
JPS6424825A (en) Epoxy resin composition
ZA814767B (en) Thermosetting coating compostion containing a blocked acid catalyst
KR860001167A (ko) 무용제 폴리이미드-변태 에폭시 조성물
MY134219A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
KR910016853A (ko) 개질된 에폭시 수지
SG157958A1 (en) Epoxy resin composition
MY143183A (en) Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt
EP0372983A3 (de) Epoxydharzzusammensetzung für die Versiegelung von Halbleitern
EP0736556A3 (de) Wollastonit enthaltendes, härtbares Epoxidharzgemisch
MY102900A (en) Advanced epoxy resins and coating compositions containing advanced epoxy resins.
MY137564A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
BR9708165A (pt) Composições de resina epóxi curável contendo endurecedores de poliamina processáveis em água
JPS5657820A (en) Curable epoxy resin composition
JPH01275621A (ja) エポキシ樹脂組成物
JPS5790072A (en) Resist ink composition for chemical plating
JPS5681333A (en) Epoxy resin composition
CA2102484A1 (en) Polyphenylene ether/polyepoxide resin system for electrical laminates
DE50105080D1 (de) Beschichtungszusammensetzungen
MY104012A (en) Thermosetting resin composition.
EP0077096A3 (de) Härtbare Massen und Verfahren zum Herstellen einer gehärteten Masse
JPS5467000A (en) Transparent thermosetting resin composition
JPS5725322A (en) Epoxy resin composition
JPS5647433A (en) Thermosetting resin composition
KR900004841A (ko) 에폭시 수지 분말 피복 조성물

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties