ATE251233T1 - Verfahren und vorrichtung zum sputtern von magnetischem targetmaterial - Google Patents

Verfahren und vorrichtung zum sputtern von magnetischem targetmaterial

Info

Publication number
ATE251233T1
ATE251233T1 AT95910064T AT95910064T ATE251233T1 AT E251233 T1 ATE251233 T1 AT E251233T1 AT 95910064 T AT95910064 T AT 95910064T AT 95910064 T AT95910064 T AT 95910064T AT E251233 T1 ATE251233 T1 AT E251233T1
Authority
AT
Austria
Prior art keywords
magnetic
target
front surface
sputtering
target material
Prior art date
Application number
AT95910064T
Other languages
English (en)
Inventor
Barry Manley
Original Assignee
Manley Kelly
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/142,162 external-priority patent/US5415754A/en
Application filed by Manley Kelly filed Critical Manley Kelly
Application granted granted Critical
Publication of ATE251233T1 publication Critical patent/ATE251233T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Cosmetics (AREA)
AT95910064T 1993-10-22 1994-10-21 Verfahren und vorrichtung zum sputtern von magnetischem targetmaterial ATE251233T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/142,162 US5415754A (en) 1993-10-22 1993-10-22 Method and apparatus for sputtering magnetic target materials
US22194194A 1994-04-01 1994-04-01
PCT/US1994/012070 WO1995012003A2 (en) 1993-10-22 1994-10-21 Method and apparatus for sputtering magnetic target materials

Publications (1)

Publication Number Publication Date
ATE251233T1 true ATE251233T1 (de) 2003-10-15

Family

ID=26839820

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95910064T ATE251233T1 (de) 1993-10-22 1994-10-21 Verfahren und vorrichtung zum sputtern von magnetischem targetmaterial

Country Status (6)

Country Link
EP (1) EP0724652B1 (de)
JP (1) JPH11500490A (de)
AT (1) ATE251233T1 (de)
AU (1) AU1829795A (de)
DE (1) DE69433208T2 (de)
WO (1) WO1995012003A2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19617057C2 (de) * 1996-04-29 1998-07-23 Ardenne Anlagentech Gmbh Sputteranlage mit zwei längserstreckten Magnetrons
DE19622605A1 (de) * 1996-06-05 1997-12-11 Leybold Systems Gmbh Sputterkathode
DE19622606C2 (de) * 1996-06-05 2002-02-28 Applied Films Gmbh & Co Kg Sputterkathode
DE19708344A1 (de) * 1997-03-01 1998-09-03 Leybold Systems Gmbh Sputterkathode
DE19747923C2 (de) 1997-10-30 2002-09-12 Leybold Systems Gmbh Sputterkathode
DE19750270A1 (de) * 1997-11-13 1999-05-20 Leybold Systems Gmbh Sputterkathode
DE19754986C2 (de) * 1997-12-11 2002-09-12 Leybold Systems Gmbh Sputterkathode
FR2833474B1 (fr) 2001-12-19 2004-03-05 A5 Ind Presentoir modulaire pour marchandises
JP4873681B2 (ja) * 2004-08-09 2012-02-08 独立行政法人物質・材料研究機構 デュアルマグネトロンスパッタリング装置及び薄膜体製造方法
US8016982B2 (en) 2007-11-30 2011-09-13 Panasonic Corporation Sputtering apparatus and sputtering method
DE102009053609A1 (de) 2009-11-16 2011-05-19 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zum Magnetronsputtern ferromagnetischer Materialien
US8900428B2 (en) * 2011-01-06 2014-12-02 Sputtering Components, Inc. Sputtering apparatus
FR2972199B1 (fr) 2011-03-01 2015-04-24 Commissariat Energie Atomique Dispositif de production de nanoparticules a haut rendement, utilisation du dispositif de production dans un dispositif de depot et procede de depot de nanoparticules
US9758862B2 (en) 2012-09-04 2017-09-12 Sputtering Components, Inc. Sputtering apparatus
JP2016160522A (ja) * 2015-03-05 2016-09-05 日立金属株式会社 ターゲット
CN109312450B (zh) * 2016-06-21 2021-01-12 株式会社爱发科 靶材装置、溅射装置
RU2627820C1 (ru) * 2016-11-02 2017-08-11 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Узел катода магнетронного распылителя

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2700793B2 (ja) * 1988-01-25 1998-01-21 株式会社コーセー 易崩壊性顆粒配合化粧料
US4964968A (en) * 1988-04-30 1990-10-23 Mitsubishi Kasei Corp. Magnetron sputtering apparatus
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4865708A (en) * 1988-11-14 1989-09-12 Vac-Tec Systems, Inc. Magnetron sputtering cathode
JPH0774439B2 (ja) * 1989-01-30 1995-08-09 三菱化学株式会社 マグネトロンスパッタ装置
JP3040155B2 (ja) * 1990-11-29 2000-05-08 御木本製薬株式会社 スクラブ洗浄料

Also Published As

Publication number Publication date
JPH11500490A (ja) 1999-01-12
DE69433208T2 (de) 2004-08-05
EP0724652A1 (de) 1996-08-07
DE69433208D1 (de) 2003-11-06
AU1829795A (en) 1995-05-22
WO1995012003A2 (en) 1995-05-04
EP0724652A4 (de) 1997-02-12
EP0724652B1 (de) 2003-10-01
WO1995012003A3 (en) 1995-06-22

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