ATE261789T1 - Flussverwaltungsystem - Google Patents

Flussverwaltungsystem

Info

Publication number
ATE261789T1
ATE261789T1 AT98950971T AT98950971T ATE261789T1 AT E261789 T1 ATE261789 T1 AT E261789T1 AT 98950971 T AT98950971 T AT 98950971T AT 98950971 T AT98950971 T AT 98950971T AT E261789 T1 ATE261789 T1 AT E261789T1
Authority
AT
Austria
Prior art keywords
gas
heating zones
cooling zone
components
circuit boards
Prior art date
Application number
AT98950971T
Other languages
English (en)
Inventor
Donald P Cudmore
Joel Brad Bailey
Tadeusz Formella
Sabi Avramescu
Anthony Prem
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Application granted granted Critical
Publication of ATE261789T1 publication Critical patent/ATE261789T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/002—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by condensation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Flow Control (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • Pipeline Systems (AREA)
AT98950971T 1997-10-16 1998-10-06 Flussverwaltungsystem ATE261789T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/951,364 US5993500A (en) 1997-10-16 1997-10-16 Flux management system
PCT/US1998/021104 WO1999020425A1 (en) 1997-10-16 1998-10-06 Flux management system

Publications (1)

Publication Number Publication Date
ATE261789T1 true ATE261789T1 (de) 2004-04-15

Family

ID=25491602

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98950971T ATE261789T1 (de) 1997-10-16 1998-10-06 Flussverwaltungsystem

Country Status (7)

Country Link
US (1) US5993500A (de)
EP (1) EP1023136B1 (de)
JP (1) JP3604341B2 (de)
AT (1) ATE261789T1 (de)
CA (1) CA2306623A1 (de)
DE (1) DE69822491D1 (de)
WO (1) WO1999020425A1 (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6145734A (en) * 1996-04-16 2000-11-14 Matsushita Electric Industrial Co., Ltd. Reflow method and reflow device
JP3636815B2 (ja) * 1996-05-15 2005-04-06 松下電器産業株式会社 リフロー式半田付け装置
JP2924888B2 (ja) * 1997-05-08 1999-07-26 松下電器産業株式会社 電子ユニットの半田付け装置
JP2937188B2 (ja) * 1997-05-12 1999-08-23 松下電器産業株式会社 電子ユニットの製造装置と製造方法
US6146448A (en) * 1998-11-02 2000-11-14 Soltec B.V. Flux management system for a solder reflow oven
US6095403A (en) 1999-01-22 2000-08-01 International Business Machines Corporation Circuit board component retention
US6354481B1 (en) * 1999-02-18 2002-03-12 Speedline Technologies, Inc. Compact reflow and cleaning apparatus
US6193774B1 (en) * 1999-02-19 2001-02-27 Conceptronic, Inc. Reflow solder convection oven with a passive gas decontamination subsystem
JP2001170767A (ja) * 1999-12-10 2001-06-26 Hitachi Ltd はんだ付け装置
US6527164B1 (en) * 2000-05-31 2003-03-04 Advanced Micro Devices, Inc. Removing flux residue from reflow furnace using active gaseous solvent
US6382500B1 (en) * 2000-08-22 2002-05-07 Advanced Micro Devices, Inc. Solder reflow furnace with flux effluent collector and method of preventing flux contamination
GB2375975B (en) * 2001-05-30 2005-07-20 Philip Arthur Mullins Filtering apparatus
US6593549B2 (en) * 2001-11-30 2003-07-15 Intel Corporation Cooling device/heater assembly including a supporting bracket for a reflow oven
US6694637B2 (en) 2002-01-18 2004-02-24 Speedline Technologies, Inc. Flux collection method and system
US6749655B2 (en) 2002-04-17 2004-06-15 Speedline Technologies, Inc. Filtration of flux contaminants
US6780225B2 (en) 2002-05-24 2004-08-24 Vitronics Soltec, Inc. Reflow oven gas management system and method
US9226407B2 (en) * 2002-07-01 2015-12-29 Semigear Inc Reflow treating unit and substrate treating apparatus
DE10246540B4 (de) * 2002-09-30 2012-03-15 Rehm Thermal Systems Gmbh Vorrichtung zur Reinigung von Prozessgas einer Reflowlötanlage
DE10301102B3 (de) * 2003-01-08 2004-03-25 Siemens Ag Verfahren zum Reinigen von Prozessgas eines Lötofens, sowie Lötofen und Reinigungssystem zur Durchführung des Verfahrens
US6897410B1 (en) 2003-11-07 2005-05-24 Delaware Capital Formation, Inc. Dual stage pre-heater
DE102004025528B4 (de) * 2004-05-25 2010-03-04 Eisenmann Anlagenbau Gmbh & Co. Kg Verfahren und Vorrichtung zum Trocknen von beschichteten Gegenständen
CN100548555C (zh) * 2005-02-07 2009-10-14 千住金属工业株式会社 回流炉的烟雾的除去方法和回流炉
US8557907B2 (en) * 2005-08-26 2013-10-15 Macro-M S.A. De C.V. Reactive block copolymers for the preparation of inorganic tubule-polymer composites
JP2007067061A (ja) * 2005-08-30 2007-03-15 Furukawa Electric Co Ltd:The フラックス回収装置
US7514650B2 (en) * 2005-12-08 2009-04-07 Despatch Industries Limited Partnership Continuous infrared furnace
CN101309771A (zh) * 2006-01-06 2008-11-19 株式会社田村制作所 回流装置
JP2007273571A (ja) * 2006-03-30 2007-10-18 Tamura Furukawa Machinery:Kk リフロー炉
US8110015B2 (en) 2007-05-30 2012-02-07 Illinois Tool Works, Inc. Method and apparatus for removing contaminants from a reflow apparatus
ITUD20070200A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Apparecchiatura per l'essiccazione di elementi a piastra per l'elettronica ed assimilabili e relativo procedimento
US7708183B2 (en) 2008-03-28 2010-05-04 Illinois Tool Works Inc. Reflow solder oven with cooling diffuser
CN102652044B (zh) * 2009-12-11 2015-06-10 千住金属工业株式会社 回流炉
CN102131352A (zh) * 2010-01-13 2011-07-20 鸿富锦精密工业（深圳）有限公司 一种制造印刷电路板的方法
GB2479553B (en) * 2010-04-14 2012-07-18 Afc Holcroft Aluminium brazing
US9589817B2 (en) 2011-04-15 2017-03-07 Illinois Tool Works Inc. Dryer
US9936569B2 (en) * 2011-10-25 2018-04-03 L'Air Liquide, Soci§té Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Method and device for cooling soldered printed circuit boards
JP5459294B2 (ja) * 2011-11-15 2014-04-02 株式会社デンソー リフロー装置
KR20150018504A (ko) * 2012-05-11 2015-02-23 린데 악티엔게젤샤프트 웨이브 솔더링 기기의 구성 요소 세정 장치 및 방법
CN102990182B (zh) * 2012-12-31 2015-09-30 北京中科同志科技有限公司 真空回流焊机及其冷却系统
JP6028607B2 (ja) * 2013-02-14 2016-11-16 株式会社デンソー フラックスヒューム回収装置
US20150034702A1 (en) * 2013-08-01 2015-02-05 Semigear Inc Apparatus & method for treating substrate
US20150034699A1 (en) * 2013-08-01 2015-02-05 Semigear Inc Reflow treating unit & substrate treating apparatus
US9198300B2 (en) * 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
JP6188671B2 (ja) * 2014-12-12 2017-08-30 株式会社Ｓｓテクノ 水蒸気リフロー装置及び水蒸気リフロー方法
JP7241286B2 (ja) * 2018-06-27 2023-03-17 パナソニックＩｐマネジメント株式会社 リフロー炉およびはんだ付け処理方法
US12168190B2 (en) * 2019-06-05 2024-12-17 Ceco Environmental Ip Inc. Self-cleaning filter
CN112935450B (zh) * 2019-12-10 2025-10-31 伊利诺斯工具制品有限公司 回流焊炉
EP4032648A1 (de) * 2021-01-25 2022-07-27 Infineon Technologies AG Anordnung zur formung einer verbindung
DE102021129131B4 (de) 2021-11-09 2024-02-29 Ersa Gmbh Lötanlage, insbesondere eine Reflowlötanlage mit seitlich neben einem Prozesskanal vorgesehenen Lüftereinheiten
CN116688705A (zh) * 2022-02-28 2023-09-05 伊利诺斯工具制品有限公司 废气净化系统
DE102022113902A1 (de) 2022-06-02 2023-12-07 Ersa Gmbh Reflowlötanlage mit einem wenigstens abschnittsweise gebogen, ecken- und kantenfreien Luftkanal

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1739367A (en) * 1925-11-11 1929-12-10 Love Michael Dust trap
US4348174A (en) * 1981-01-22 1982-09-07 Hybrid Technology Corporation Method and apparatus for vapor conservation and control
US4479927A (en) * 1982-08-09 1984-10-30 The Perkin-Elmer Corporation Regenerable cold trap for aluminum chloride effluent
US4771929A (en) * 1987-02-20 1988-09-20 Hollis Automation, Inc. Focused convection reflow soldering method and apparatus
JPH06268B2 (ja) * 1988-02-23 1994-01-05 エイティックテクトロン株式会社 リフロー半田付け方法及び装置
JPH0248132Y2 (de) * 1988-09-16 1990-12-18
US4912857A (en) * 1988-10-17 1990-04-03 Electrovert Ltd. Cooling and exhaust unit for solder reflow system
JPH0446666A (ja) * 1990-05-31 1992-02-17 Eiteitsuku Tekutoron Kk リフロ―半田付け方法及び装置
US5069380A (en) * 1990-06-13 1991-12-03 Carlos Deambrosio Inerted IR soldering system
US5125556A (en) * 1990-09-17 1992-06-30 Electrovert Ltd. Inerted IR soldering system
NL9101383A (nl) * 1991-08-13 1993-03-01 Soltec Bv Soldeerinrichting met deken van zuurstofarm gas.
NL9200498A (nl) * 1992-03-17 1993-10-18 Soltec Bv Van een filter voorziene soldeerinrichting.
WO1994004305A1 (en) * 1992-08-18 1994-03-03 Precision Dispensing Equipment, Inc. Method and apparatus for applying flux
US5345061A (en) * 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
DE4329000C2 (de) * 1993-08-28 1996-12-05 Woerthmann Rainer Dipl Ing Fh Lötdüse für eine Lötwelle zum Löten von Werkstücken
US5347103A (en) * 1993-08-31 1994-09-13 Btu International Convection furnace using shimmed gas amplifier
DE4416788C2 (de) * 1994-05-06 1999-08-19 Siemens Ag Verfahren zum Wellenlöten von Leiterplatten
US5577658A (en) * 1995-06-23 1996-11-26 Electrovert Usa Corp. Gas knife cooling system
US5617990A (en) * 1995-07-03 1997-04-08 Micron Electronics, Inc. Shield and method for selective wave soldering
US5617989A (en) * 1995-07-25 1997-04-08 Kelzer; Robert A. Solder leveling apparatus and method
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
US5623829A (en) * 1996-01-17 1997-04-29 Btu International Vortex tube cooling system for solder reflow convection furnaces
US5611476C1 (en) * 1996-01-18 2002-02-26 Btu Int Solder reflow convection furnace employing flux handling and gas densification systems
US5641341A (en) * 1996-02-14 1997-06-24 Heller Industries Method for minimizing the clogging of a cooling zone heat exchanger in a reflow solder apparatus

Also Published As

Publication number Publication date
CA2306623A1 (en) 1999-04-29
EP1023136B1 (de) 2004-03-17
WO1999020425A1 (en) 1999-04-29
US5993500A (en) 1999-11-30
JP2001520462A (ja) 2001-10-30
JP3604341B2 (ja) 2004-12-22
DE69822491D1 (de) 2004-04-22
EP1023136A1 (de) 2000-08-02

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties