ATE273556T1 - Thermistorchips und verfahren zu deren herstellung - Google Patents
Thermistorchips und verfahren zu deren herstellungInfo
- Publication number
- ATE273556T1 ATE273556T1 AT97116656T AT97116656T ATE273556T1 AT E273556 T1 ATE273556 T1 AT E273556T1 AT 97116656 T AT97116656 T AT 97116656T AT 97116656 T AT97116656 T AT 97116656T AT E273556 T1 ATE273556 T1 AT E273556T1
- Authority
- AT
- Austria
- Prior art keywords
- metal layer
- production
- metal
- metal layers
- thermistor chips
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
- H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8268396A JP3058097B2 (ja) | 1996-10-09 | 1996-10-09 | サーミスタチップ及びその製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE273556T1 true ATE273556T1 (de) | 2004-08-15 |
Family
ID=17457900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT97116656T ATE273556T1 (de) | 1996-10-09 | 1997-09-24 | Thermistorchips und verfahren zu deren herstellung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6081181A (de) |
| EP (1) | EP0836198B1 (de) |
| JP (1) | JP3058097B2 (de) |
| KR (1) | KR100318251B1 (de) |
| AT (1) | ATE273556T1 (de) |
| DE (1) | DE69730186T2 (de) |
| TW (1) | TW388888B (de) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100340130B1 (ko) * | 1999-11-09 | 2002-06-10 | 엄우식 | 정 온도 계수 서미스터와 배리스터 복합소자 및 그 제조방법 |
| KR100329314B1 (ko) * | 2000-01-13 | 2002-03-22 | 엄우식 | 정온도계수 서미스터와 배리스터 복합소자 및 그 제조 방법 |
| US6755518B2 (en) * | 2001-08-30 | 2004-06-29 | L&P Property Management Company | Method and apparatus for ink jet printing on rigid panels |
| US6498561B2 (en) * | 2001-01-26 | 2002-12-24 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
| TW540829U (en) * | 2002-07-02 | 2003-07-01 | Inpaq Technology Co Ltd | Improved chip-type thick film resistor structure |
| JP4047760B2 (ja) * | 2003-04-28 | 2008-02-13 | ローム株式会社 | チップ抵抗器およびその製造方法 |
| JP2005223039A (ja) * | 2004-02-04 | 2005-08-18 | Murata Mfg Co Ltd | チップ型サーミスタおよびその特性調整方法 |
| JP2009218552A (ja) * | 2007-12-17 | 2009-09-24 | Rohm Co Ltd | チップ抵抗器およびその製造方法 |
| CN102971808B (zh) * | 2010-06-24 | 2015-11-25 | Tdk株式会社 | 片式热敏电阻及其制造方法 |
| US8584348B2 (en) * | 2011-03-05 | 2013-11-19 | Weis Innovations | Method of making a surface coated electronic ceramic component |
| JP6020502B2 (ja) * | 2014-03-31 | 2016-11-02 | 株式会社村田製作所 | 積層セラミック電子部品 |
| US10083781B2 (en) | 2015-10-30 | 2018-09-25 | Vishay Dale Electronics, Llc | Surface mount resistors and methods of manufacturing same |
| US10438729B2 (en) | 2017-11-10 | 2019-10-08 | Vishay Dale Electronics, Llc | Resistor with upper surface heat dissipation |
| CN108962516B (zh) * | 2018-08-10 | 2024-04-30 | 广东风华高新科技股份有限公司 | 一种片式电阻器及其制造方法 |
| JP7477073B2 (ja) * | 2019-08-01 | 2024-05-01 | 太陽誘電株式会社 | 積層セラミック電子部品 |
| CN120048599B (zh) * | 2024-12-31 | 2025-09-30 | 捷群电子科技(淮安)有限公司 | 一种抗硫化厚膜电阻及其制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3645785A (en) * | 1969-11-12 | 1972-02-29 | Texas Instruments Inc | Ohmic contact system |
| JPS62293707A (ja) * | 1986-06-13 | 1987-12-21 | 株式会社村田製作所 | キャップ付き電子部品 |
| FR2620561B1 (fr) * | 1987-09-15 | 1992-04-24 | Europ Composants Electron | Thermistance ctp pour le montage en surface |
| US4993142A (en) * | 1989-06-19 | 1991-02-19 | Dale Electronics, Inc. | Method of making a thermistor |
| DE4029681A1 (de) * | 1990-09-19 | 1992-04-02 | Siemens Ag | Verfahren zum herstellen von oberflaechenmontierbaren keramischen bauelementen in melf-technologie |
| US5294910A (en) * | 1991-07-01 | 1994-03-15 | Murata Manufacturing Co., Ltd. | Platinum temperature sensor |
| JP2897486B2 (ja) * | 1991-10-15 | 1999-05-31 | 株式会社村田製作所 | 正特性サーミスタ素子 |
| US5257003A (en) * | 1992-01-14 | 1993-10-26 | Mahoney John J | Thermistor and its method of manufacture |
| JPH05258906A (ja) * | 1992-03-13 | 1993-10-08 | Tdk Corp | チップ型サーミスタ |
| US5339068A (en) * | 1992-12-18 | 1994-08-16 | Mitsubishi Materials Corp. | Conductive chip-type ceramic element and method of manufacture thereof |
| JPH06231906A (ja) * | 1993-01-28 | 1994-08-19 | Mitsubishi Materials Corp | サーミスタ |
| JPH06302404A (ja) * | 1993-04-16 | 1994-10-28 | Murata Mfg Co Ltd | 積層型正特性サ−ミスタ |
| JPH08138902A (ja) * | 1993-11-11 | 1996-05-31 | Matsushita Electric Ind Co Ltd | チップ抵抗器およびその製造方法 |
| US5680092A (en) * | 1993-11-11 | 1997-10-21 | Matsushita Electric Industrial Co., Ltd. | Chip resistor and method for producing the same |
| US5699607A (en) * | 1996-01-22 | 1997-12-23 | Littelfuse, Inc. | Process for manufacturing an electrical device comprising a PTC element |
-
1996
- 1996-10-09 JP JP8268396A patent/JP3058097B2/ja not_active Expired - Lifetime
-
1997
- 1997-09-24 AT AT97116656T patent/ATE273556T1/de not_active IP Right Cessation
- 1997-09-24 EP EP97116656A patent/EP0836198B1/de not_active Expired - Lifetime
- 1997-09-24 TW TW086113904A patent/TW388888B/zh not_active IP Right Cessation
- 1997-09-24 DE DE69730186T patent/DE69730186T2/de not_active Expired - Lifetime
- 1997-10-03 US US08/943,502 patent/US6081181A/en not_active Expired - Lifetime
- 1997-10-09 KR KR1019970051823A patent/KR100318251B1/ko not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE69730186T2 (de) | 2005-09-01 |
| KR19980032699A (ko) | 1998-07-25 |
| EP0836198A2 (de) | 1998-04-15 |
| EP0836198A3 (de) | 1999-01-07 |
| US6081181A (en) | 2000-06-27 |
| JP3058097B2 (ja) | 2000-07-04 |
| EP0836198B1 (de) | 2004-08-11 |
| KR100318251B1 (ko) | 2002-02-19 |
| DE69730186D1 (de) | 2004-09-16 |
| TW388888B (en) | 2000-05-01 |
| JPH10116704A (ja) | 1998-05-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |