ATE276575T1 - Verfahren zum herstellen von dünnschicht- chipwiderständen - Google Patents

Verfahren zum herstellen von dünnschicht- chipwiderständen

Info

Publication number
ATE276575T1
ATE276575T1 AT02700251T AT02700251T ATE276575T1 AT E276575 T1 ATE276575 T1 AT E276575T1 AT 02700251 T AT02700251 T AT 02700251T AT 02700251 T AT02700251 T AT 02700251T AT E276575 T1 ATE276575 T1 AT E276575T1
Authority
AT
Austria
Prior art keywords
resistor
chip resistors
film chip
thin film
producing thin
Prior art date
Application number
AT02700251T
Other languages
English (en)
Inventor
Wolfgang Werner
Horst Wolf
Reiner Wilhelm Kuehl
Original Assignee
Bc Components Holdings B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bc Components Holdings B V filed Critical Bc Components Holdings B V
Application granted granted Critical
Publication of ATE276575T1 publication Critical patent/ATE276575T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/003—Apparatus or processes specially adapted for manufacturing resistors using lithography, e.g. photolithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146—Laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/94—Laser ablative material removal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT02700251T 2001-03-02 2002-02-19 Verfahren zum herstellen von dünnschicht- chipwiderständen ATE276575T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10110179A DE10110179B4 (de) 2001-03-02 2001-03-02 Verfahren zum Herstellen von Dünnschicht-Chipwiderständen
PCT/EP2002/001730 WO2002071419A1 (de) 2001-03-02 2002-02-19 Verfahren zum herstellen von dünnschicht-chipwiderständen

Publications (1)

Publication Number Publication Date
ATE276575T1 true ATE276575T1 (de) 2004-10-15

Family

ID=7676132

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02700251T ATE276575T1 (de) 2001-03-02 2002-02-19 Verfahren zum herstellen von dünnschicht- chipwiderständen

Country Status (9)

Country Link
US (1) US6998220B2 (de)
EP (1) EP1374257B1 (de)
JP (1) JP4092209B2 (de)
KR (1) KR100668185B1 (de)
CN (1) CN100413000C (de)
AT (1) ATE276575T1 (de)
DE (2) DE10110179B4 (de)
TW (1) TW594802B (de)
WO (1) WO2002071419A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10110179B4 (de) 2001-03-02 2004-10-14 BCcomponents Holding B.V. Verfahren zum Herstellen von Dünnschicht-Chipwiderständen
US7378337B2 (en) * 2003-11-04 2008-05-27 Electro Scientific Industries, Inc. Laser-based termination of miniature passive electronic components
TW200534296A (en) * 2004-02-09 2005-10-16 Rohm Co Ltd Method of making thin-film chip resistor
JP2011187985A (ja) * 2004-03-31 2011-09-22 Mitsubishi Materials Corp チップ抵抗器の製造方法
US7882621B2 (en) * 2008-02-29 2011-02-08 Yageo Corporation Method for making chip resistor components
CN102176356A (zh) * 2011-03-01 2011-09-07 西安天衡计量仪表有限公司 一种铂电阻芯片及铂电阻芯片的制备方法
DE102018115205A1 (de) * 2018-06-25 2020-01-02 Vishay Electronic Gmbh Verfahren zur Herstellung einer Vielzahl von Widerstandsbaueinheiten

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765145C3 (de) * 1968-04-09 1973-11-29 Siemens Ag, 1000 Berlin U. 8000 Muenchen Verfahren zum Bearbeiten dunner Schichten von elektrischen Schalt kreisen mit Laserstrahlen
US3699649A (en) * 1969-11-05 1972-10-24 Donald A Mcwilliams Method of and apparatus for regulating the resistance of film resistors
US4468414A (en) 1983-07-29 1984-08-28 Harris Corporation Dielectric isolation fabrication for laser trimming
US4594265A (en) 1984-05-15 1986-06-10 Harris Corporation Laser trimming of resistors over dielectrically isolated islands
DE3843230C1 (en) * 1988-12-22 1989-09-21 W.C. Heraeus Gmbh, 6450 Hanau, De Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks
JPH04178503A (ja) 1990-11-14 1992-06-25 Nec Corp 歪センサーの製造方法
US5384230A (en) 1992-03-02 1995-01-24 Berg; N. Edward Process for fabricating printed circuit boards
DE4429794C1 (de) * 1994-08-23 1996-02-29 Fraunhofer Ges Forschung Verfahren zum Herstellen von Chip-Widerständen
US5683928A (en) * 1994-12-05 1997-11-04 General Electric Company Method for fabricating a thin film resistor
US5852226A (en) * 1997-01-14 1998-12-22 Pioneer Hi-Bred International, Inc. Soybean variety 93B82
US5976392A (en) * 1997-03-07 1999-11-02 Yageo Corporation Method for fabrication of thin film resistor
DE19901540A1 (de) * 1999-01-16 2000-07-20 Philips Corp Intellectual Pty Verfahren zur Feinabstimmung eines passiven, elektronischen Bauelementes
US6365483B1 (en) 2000-04-11 2002-04-02 Viking Technology Corporation Method for forming a thin film resistor
US6605760B1 (en) * 2000-12-22 2003-08-12 Pioneer Hi-Bred International, Inc. Soybean variety 94B73
US6613965B1 (en) * 2000-12-22 2003-09-02 Pioneer Hi-Bred International, Inc. Soybean variety 94B54
DE10110179B4 (de) 2001-03-02 2004-10-14 BCcomponents Holding B.V. Verfahren zum Herstellen von Dünnschicht-Chipwiderständen

Also Published As

Publication number Publication date
KR20030086282A (ko) 2003-11-07
JP2004530290A (ja) 2004-09-30
US6998220B2 (en) 2006-02-14
JP4092209B2 (ja) 2008-05-28
DE50201035D1 (de) 2004-10-21
EP1374257B1 (de) 2004-09-15
EP1374257A1 (de) 2004-01-02
US20040126704A1 (en) 2004-07-01
DE10110179B4 (de) 2004-10-14
DE10110179A1 (de) 2002-12-05
KR100668185B1 (ko) 2007-01-11
CN100413000C (zh) 2008-08-20
CN1552080A (zh) 2004-12-01
TW594802B (en) 2004-06-21
WO2002071419A1 (de) 2002-09-12

Similar Documents

Publication Publication Date Title
WO2005039868A3 (de) Strukturierung von elektrischen funktionsschichten mittels einer transferfolie und strukturierung des klebers
DE60320717D1 (de) Schichtbildungsverfahren und Substrat mit einer dadurch erhaltenen Schicht
ID21598A (id) Substrat semikonduktor dan piranti semikonduktor dengan film tipis, metoda pembuatannya, dan peralatan oksidasi anoda
ATE439335T1 (de) Verfahren zur herstellung eines transparenten elements mit unsichtbaren elektroden
ATE519230T1 (de) Verfahren zur herstellung von elektrisch verbundenen optoelektrischen halbleitervorrichtungen
EP1427007A3 (de) Anschlüsse für Halbleiterbauelement und Verfahren zu deren Herstellung
ATE369727T1 (de) Verfahren zur herstellung eines schaltungsträgers und verwendung des verfahrens
ATE483531T1 (de) Substrat, umfassend zumindest eine voll- oder teilflächige makrostrukturierte schicht, verfahren zu deren herstellung und deren verwendung
WO2004071141A3 (en) Metal base wiring board for retaining light emitting elements, light emitting source, lighting apparatus, and display apparatus
DE60310907D1 (de) Vorrichtung zum aufbringen von vielschichtlagen auf ein substrat
DE60135104D1 (de) Mittel zum falschungssicheren von einem substrat
TW200520609A (en) Mask, method for manufacturing thereof, method for manufacturing organic electroluminescent device, and organic electroluminescent device
ATE276575T1 (de) Verfahren zum herstellen von dünnschicht- chipwiderständen
ATE228753T1 (de) Verfahren zum einbringen von durchkontaktierungslöchern in ein beidseitig mit metallschichten versehenes, elektrisch isolierendes basismaterial
DE3585115D1 (de) Verfahren zur herstellung und einstellung von eingegrabenen schichten.
WO2006033852A3 (en) Structured surface using ablatable radiation sensitive material
WO2004038809A3 (en) Formation of contacts on semiconductor substrates
TW200621381A (en) Thin film pattern substrate, method for manufacturing device, electro-optic device, and electronic apparatus
MXPA03007648A (es) Formacion de patron metalico.
NO307437B1 (no) Fremgangsmåte og innretning for stabling av substrater, som skal forbindes med hverandre ved hjelp av binding
EP1388890A4 (de) Verfahren zur herstellung einer elektronischen komponente
WO2002057094A8 (en) Method for applying designs to a substrate
US20090314421A1 (en) Decorative architectural glass panel method and apparatus
MX2007003615A (es) Circuito integrado y metodo de fabricacion.
TW200517687A (en) Color filter substrate and manufacturing method thereof; electro-optical apparatus, and electronic equipment

Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee