ATE300858T1 - Füllstoffe für verbesserte epoxid-laminate - Google Patents

Füllstoffe für verbesserte epoxid-laminate

Info

Publication number
ATE300858T1
ATE300858T1 AT97916913T AT97916913T ATE300858T1 AT E300858 T1 ATE300858 T1 AT E300858T1 AT 97916913 T AT97916913 T AT 97916913T AT 97916913 T AT97916913 T AT 97916913T AT E300858 T1 ATE300858 T1 AT E300858T1
Authority
AT
Austria
Prior art keywords
talc particles
talc
fillers
those
less
Prior art date
Application number
AT97916913T
Other languages
English (en)
Inventor
Aroon Vishwanath Tungare
Scott Harold Richgels
Jeffrey Robert Kamla
Peggy Mae Conn
Original Assignee
Isola Laminate Systems Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24486319&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE300858(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Isola Laminate Systems Corp filed Critical Isola Laminate Systems Corp
Application granted granted Critical
Publication of ATE300858T1 publication Critical patent/ATE300858T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
AT97916913T 1996-03-22 1997-03-21 Füllstoffe für verbesserte epoxid-laminate ATE300858T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/620,525 US6187852B1 (en) 1996-03-22 1996-03-22 Fillers for improved epoxy laminates
PCT/US1997/004620 WO1997035457A1 (en) 1996-03-22 1997-03-21 Fillers for improved epoxy laminates

Publications (1)

Publication Number Publication Date
ATE300858T1 true ATE300858T1 (de) 2005-08-15

Family

ID=24486319

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97916913T ATE300858T1 (de) 1996-03-22 1997-03-21 Füllstoffe für verbesserte epoxid-laminate

Country Status (7)

Country Link
US (2) US6187852B1 (de)
EP (1) EP0864248B1 (de)
AT (1) ATE300858T1 (de)
AU (1) AU2540597A (de)
DE (1) DE69733803T2 (de)
TW (1) TW413659B (de)
WO (1) WO1997035457A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7507471B1 (en) * 1995-10-10 2009-03-24 Isola Usa Corp Reducing dusting of epoxy laminates
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US8105690B2 (en) * 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
CN100488906C (zh) * 1998-10-13 2009-05-20 Ppg工业俄亥俄公司 玻璃纤维补强的预浸渍片、层压件、电路板以及装配织物的方法
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
US20070111578A1 (en) * 2005-11-15 2007-05-17 Langon Alfred J Socket adapter mold
EP2053163A1 (de) * 2007-10-26 2009-04-29 SAPPI Netherlands Services B.V. Beschichtungsformulierung für Offsetpapier und damit beschichtetes Papier
EP2240757A1 (de) * 2008-01-09 2010-10-20 Dow Global Technologies Inc. Vorrichtung und verfahren zur beurteilung der bearbeitbarkeit von laminaten
CN101368077B (zh) * 2008-10-09 2011-11-30 腾辉电子(苏州)有限公司 一种环氧树脂胶液
US20120055704A1 (en) * 2010-09-06 2012-03-08 Taiwan Union Technology Corporation Epoxy resin blend
SG192780A1 (en) 2011-02-24 2013-09-30 Isola Usa Corp Ultrathin laminates
BR112017016276B8 (pt) 2015-01-29 2023-03-21 Imerys Talc America Inc Composição de resina reforçada e método de reduzir a degradação térmica de um material de policarbonato reforçado
JP6672953B2 (ja) 2016-03-29 2020-03-25 味の素株式会社 樹脂シート
AR127339A1 (es) * 2021-10-15 2024-01-10 Nippon Steel Corp Tubo metálico para pozo petrolero
WO2025113789A1 (en) 2023-11-29 2025-06-05 Ithaka Institute For Carbon Strategies Prepreg, prepreg body and a method to produce a prepreg

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE30843E (en) * 1971-05-10 1982-01-05 Epoxy tape
USRE34164E (en) * 1974-03-30 1993-01-19 Aluminum Company Of America Synthetic hydrotalcite
US4214026A (en) * 1978-08-24 1980-07-22 Asahi Kasei Kogyo Kabushiki Kaisha Sheet molding material
JPS55142645A (en) * 1979-04-24 1980-11-07 Shin Kobe Electric Machinery Laminated board
JPS57199643A (en) 1981-06-01 1982-12-07 Nikkan Ind Laminated board
JPS597044A (ja) 1982-07-05 1984-01-14 ニツカン工業株式会社 積層板
US4632798A (en) * 1983-07-27 1986-12-30 Celanese Corporation Encapsulation of electronic components with anisotropic thermoplastic polymers
JPS60203642A (ja) * 1984-03-28 1985-10-15 Shin Kobe Electric Mach Co Ltd コンポジツト積層板の製造法
US4719250A (en) * 1984-06-18 1988-01-12 Hoechst Celanese Corporation Encapsulation of electronic components
JPH0197633A (ja) 1987-10-09 1989-04-17 Sumitomo Bakelite Co Ltd 印刷回路用積層板の製造方法
JPH01222950A (ja) 1988-03-03 1989-09-06 Hitachi Chem Co Ltd 積層板
JPH02120330A (ja) 1988-10-28 1990-05-08 Shin Kobe Electric Mach Co Ltd 積層板の製造法
JPH02133440A (ja) 1988-11-15 1990-05-22 Matsushita Electric Works Ltd 電気用積層板の製造方法
US4960634A (en) 1990-03-14 1990-10-02 International Business Machines Corporation Epoxy composition of increased thermal conductivity and use thereof
US5264065A (en) 1990-06-08 1993-11-23 Amp-Akzo Corporation Printed circuits and base materials having low Z-axis thermal expansion
JPH0592438A (ja) * 1991-10-02 1993-04-16 Matsushita Electric Works Ltd 積層板の製造方法
JPH05138808A (ja) * 1991-11-16 1993-06-08 Toshiba Chem Corp 銅張積層板
US5362457A (en) * 1992-08-13 1994-11-08 Aluminum Company Of America Direct synthesis of anion substituted hydrotalcite
JPH0724955A (ja) * 1993-07-07 1995-01-27 Toshiba Chem Corp 銅張積層板
US5776424A (en) * 1994-04-29 1998-07-07 Aluminum Company Of America Two powder synthesis of hydrotalcite and hydrotalcite-like compounds with monovalen inorganic anions

Also Published As

Publication number Publication date
EP0864248A1 (de) 1998-09-16
AU2540597A (en) 1997-10-10
DE69733803D1 (de) 2005-09-01
TW413659B (en) 2000-12-01
US6187852B1 (en) 2001-02-13
US6322885B2 (en) 2001-11-27
DE69733803T2 (de) 2006-06-08
US20010014705A1 (en) 2001-08-16
WO1997035457A1 (en) 1997-09-25
EP0864248B1 (de) 2005-07-27

Similar Documents

Publication Publication Date Title
DE69733803D1 (de) Füllstoffe für verbesserte epoxid-laminate
TW353112B (en) Polishing composition
DE60203706D1 (en) Heterophasisches propylenpolymer
GB0228914D0 (en) Particles
TW349988B (en) Adhesive compositions for electronic applications
EP1178085A3 (de) Teilchen mit einem daran befestigtem stabilen freien Radikal, polymerisierte modifizierte Teilchen und Verfahren zu deren Herstellung
EP0275991A3 (de) Thermoplastische Harzzusammensetzung
EP0957128A3 (de) Polyoxymethylenharz-Zusammensetzung
CA2049180A1 (en) High modulus silicones as toughening agents for epoxy resins
CA2093577A1 (en) Alkyl or alkoxy substituted s-heterocyclic retinoids
EP1153984A4 (de) Harzzusammensetzung,formgegenstand und verwendung
MY130918A (en) Copper foil surface treatment agent
FR2641540B1 (de)
SE8501162L (sv) Laminat
CA2329303A1 (en) Stabilizer composition for halogen-containing thermoplastic resin compositions
EP1201716A4 (de) Polycarbonatharzzusammensetzung
CA2145261A1 (en) Aqueous Curable Resin Compositions
MY129163A (en) Flame-retarded resin composition
EP0372017A4 (en) Epoxy resin compositions for sealing semiconductor devices
CA2353628A1 (en) Polycarbonate molding compositions with improved mechanical properties
TW200516126A (en) Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
AU2003250187A1 (en) Lacquer formulations
EP0138609A3 (de) Harzzusammensetzungen für Schichtplatten
WO1994015986A3 (en) Substituted resorcinol-based epoxy resins
ES2117682T3 (es) Suspensiones para la fabricacion de resinas de moldes rellenas.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties