ATE301172T1 - Verfahren zum polieren einer speicher- oder festplatte mit einer zusammensetzung, die aminosäuren enthält - Google Patents

Verfahren zum polieren einer speicher- oder festplatte mit einer zusammensetzung, die aminosäuren enthält

Info

Publication number: ATE301172T1
Authority: AT; Austria
Prior art keywords: polishing; memory; amino acids; hard disk; composition containing
Prior art date: 2000-04-04

Application number

AT01924609T

Other languages

English (en)

Inventor

Mingming Fang

Shumin Wang

Original Assignee

Cabot Microelectronics Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-04-04

Filing date

2001-04-03

Publication date

2005-08-15

2001-04-03 Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp

2005-08-15 Application granted granted Critical

2005-08-15 Publication of ATE301172T1 publication Critical patent/ATE301172T1/de

Links

238000005498 polishing Methods 0.000 title abstract 3
150000001413 amino acids Chemical class 0.000 title abstract 2
238000000034 method Methods 0.000 title abstract 2
239000007800 oxidant agent Substances 0.000 abstract 1
150000002978 peroxides Chemical class 0.000 abstract 1
JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 abstract 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Manufacturing Of Magnetic Record Carriers (AREA)
Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

AT01924609T 2000-04-04 2001-04-03 Verfahren zum polieren einer speicher- oder festplatte mit einer zusammensetzung, die aminosäuren enthält ATE301172T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US09/542,774 US6471884B1 (en)	2000-04-04	2000-04-04	Method for polishing a memory or rigid disk with an amino acid-containing composition
PCT/US2001/010694 WO2001074959A2 (en)	2000-04-04	2001-04-03	Method for polishing a memory or rigid disk with an amino acid-containing composition

Publications (1)

Publication Number	Publication Date
ATE301172T1 true ATE301172T1 (de)	2005-08-15

Family

ID=24165224

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT01924609T ATE301172T1 (de)	2000-04-04	2001-04-03	Verfahren zum polieren einer speicher- oder festplatte mit einer zusammensetzung, die aminosäuren enthält

Country Status (12)

Country	Link
US (1)	US6471884B1 (de)
EP (1)	EP1272579B1 (de)
JP (1)	JP3964680B2 (de)
KR (1)	KR100735787B1 (de)
CN (1)	CN1209431C (de)
AT (1)	ATE301172T1 (de)
AU (1)	AU5124901A (de)
DE (1)	DE60112419T2 (de)
HK (1)	HK1052718B (de)
MY (1)	MY119974A (de)
TW (1)	TW527408B (de)
WO (1)	WO2001074959A2 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4053165B2 (ja) *	1998-12-01	2008-02-27	株式会社フジミインコーポレーテッド	研磨用組成物およびそれを用いた研磨方法
KR100738842B1 (ko) *	2000-05-30	2007-07-12	가부시키가이샤 후지미인코퍼레이티드	연마 조성물 및 그를 이용한 연마 방법
US20050028449A1 (en) *	2001-09-03	2005-02-10	Norihiko Miyata	Polishing composition
US6755721B2 (en) *	2002-02-22	2004-06-29	Saint-Gobain Ceramics And Plastics, Inc.	Chemical mechanical polishing of nickel phosphorous alloys
TWI254741B (en) *	2003-02-05	2006-05-11	Kao Corp	Polishing composition
US7306748B2 (en)	2003-04-25	2007-12-11	Saint-Gobain Ceramics & Plastics, Inc.	Methods for machining ceramics
US8025808B2 (en)	2003-04-25	2011-09-27	Saint-Gobain Ceramics & Plastics, Inc.	Methods for machine ceramics
JP4202201B2 (ja) *	2003-07-03	2008-12-24	株式会社フジミインコーポレーテッド	研磨用組成物
BRPI0412515A (pt) *	2003-07-11	2006-09-19	Grace W R & Co	partìculas abrasivas para polimento quìmico mecánico
JP4608196B2 (ja) *	2003-09-30	2011-01-05	株式会社フジミインコーポレーテッド	研磨用組成物
US20050139119A1 (en) *	2003-12-24	2005-06-30	Rader W. S.	Polishing composition
US7708904B2 (en) *	2005-09-09	2010-05-04	Saint-Gobain Ceramics & Plastics, Inc.	Conductive hydrocarbon fluid
US8353740B2 (en) *	2005-09-09	2013-01-15	Saint-Gobain Ceramics & Plastics, Inc.	Conductive hydrocarbon fluid
CN101588894B (zh)	2006-12-20	2013-03-27	圣戈本陶瓷及塑料股份有限公司	机械加工无机非金属工件的方法
DE102007005291A1 (de)	2007-02-02	2008-08-07	Evonik Degussa Gmbh	Dispersion zum chemisch-mechanischen Polieren
US8226841B2 (en)	2009-02-03	2012-07-24	Cabot Microelectronics Corporation	Polishing composition for nickel-phosphorous memory disks
US9330703B2 (en) *	2009-06-04	2016-05-03	Cabot Microelectronics Corporation	Polishing composition for nickel-phosphorous memory disks
US9039914B2 (en)	2012-05-23	2015-05-26	Cabot Microelectronics Corporation	Polishing composition for nickel-phosphorous-coated memory disks
KR101273973B1 (ko) *	2013-03-04	2013-06-12	황의용	광택향상 효과가 우수한 알루미늄용 화학 연마제 조성물
CN103937414B (zh) *	2014-04-29	2018-03-02	杰明纳微电子股份有限公司	一种计算机硬盘盘基片的精抛光液
US9401104B2 (en) *	2014-05-05	2016-07-26	Cabot Microelectronics Corporation	Polishing composition for edge roll-off improvement
WO2017061109A1 (ja) *	2015-10-07	2017-04-13	三洋化成工業株式会社	磁気ディスク用研磨材及び磁気ディスクの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2841235B2 (ja)	1990-08-29	1998-12-24	株式会社フジミインコーポレーテッド	研磨剤組成物
JP3397501B2 (ja)	1994-07-12	2003-04-14	株式会社東芝	研磨剤および研磨方法
US5935278A (en) *	1996-08-30	1999-08-10	Showa Denko Kabushiki Kaisha	Abrasive composition for magnetic recording disc substrate
JP3534145B2 (ja) *	1996-10-04	2004-06-07	オージー技研株式会社	複数槽式入浴装置
US5954997A (en)	1996-12-09	1999-09-21	Cabot Corporation	Chemical mechanical polishing slurry useful for copper substrates
EP1086484A4 (de) *	1998-04-10	2003-08-06	Ferro Corp	Aufschlämmung zum chemisch-mechanischen polieren von metallischen oberflächen
JP3998813B2 (ja)	1998-06-15	2007-10-31	株式会社フジミインコーポレーテッド	研磨用組成物
JP4053165B2 (ja)	1998-12-01	2008-02-27	株式会社フジミインコーポレーテッド	研磨用組成物およびそれを用いた研磨方法
US6258140B1 (en) *	1999-09-27	2001-07-10	Fujimi America Inc.	Polishing composition
US6153935A (en) *	1999-09-30	2000-11-28	International Business Machines Corporation	Dual etch stop/diffusion barrier for damascene interconnects
US6293848B1 (en) *	1999-11-15	2001-09-25	Cabot Microelectronics Corporation	Composition and method for planarizing surfaces

2000
- 2000-04-04 US US09/542,774 patent/US6471884B1/en not_active Expired - Lifetime
2001
- 2001-03-30 TW TW090107724A patent/TW527408B/zh not_active IP Right Cessation
- 2001-04-02 MY MYPI20011563A patent/MY119974A/en unknown
- 2001-04-03 AU AU5124901A patent/AU5124901A/xx not_active Withdrawn
- 2001-04-03 DE DE60112419T patent/DE60112419T2/de not_active Expired - Lifetime
- 2001-04-03 HK HK03104865.1A patent/HK1052718B/zh not_active IP Right Cessation
- 2001-04-03 AT AT01924609T patent/ATE301172T1/de not_active IP Right Cessation
- 2001-04-03 CN CNB018075983A patent/CN1209431C/zh not_active Expired - Fee Related
- 2001-04-03 EP EP01924609A patent/EP1272579B1/de not_active Expired - Lifetime
- 2001-04-03 JP JP2001572638A patent/JP3964680B2/ja not_active Expired - Fee Related
- 2001-04-03 WO PCT/US2001/010694 patent/WO2001074959A2/en not_active Ceased
- 2001-04-03 KR KR1020027013183A patent/KR100735787B1/ko not_active Expired - Fee Related

Also Published As

Publication number	Publication date
HK1052718B (zh)	2005-09-30
CN1209431C (zh)	2005-07-06
CN1422313A (zh)	2003-06-04
EP1272579A2 (de)	2003-01-08
HK1052718A1 (en)	2003-09-26
MY119974A (en)	2005-08-30
DE60112419D1 (de)	2005-09-08
DE60112419T2 (de)	2006-04-06
WO2001074959A3 (en)	2002-07-04
AU2001251249A8 (en)	2008-06-26
AU5124901A (en)	2001-10-15
WO2001074959A2 (en)	2001-10-11
KR20020093886A (ko)	2002-12-16
TW527408B (en)	2003-04-11
KR100735787B1 (ko)	2007-07-06
JP2003529663A (ja)	2003-10-07
US6471884B1 (en)	2002-10-29
EP1272579B1 (de)	2005-08-03
JP3964680B2 (ja)	2007-08-22
WO2001074959A8 (en)	2008-05-29

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Legal Events

Date	Code	Title	Description
2006-02-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties