ATE400405T1 - Verfahren zur herstellung eines schleifgegenstands - Google Patents

Verfahren zur herstellung eines schleifgegenstands

Info

Publication number
ATE400405T1
ATE400405T1 AT06000630T AT06000630T ATE400405T1 AT E400405 T1 ATE400405 T1 AT E400405T1 AT 06000630 T AT06000630 T AT 06000630T AT 06000630 T AT06000630 T AT 06000630T AT E400405 T1 ATE400405 T1 AT E400405T1
Authority
AT
Austria
Prior art keywords
producing
backing
coating composition
grinding article
abrasive coating
Prior art date
Application number
AT06000630T
Other languages
English (en)
Inventor
Michael J Muilenburg
Chong Yong Kim
Jerry J Fizel
Richard J Webb
John J Gagliardi
Daniel B Pendergrass
Robert J Streifel
Wesley J Bruxvoort
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE400405T1 publication Critical patent/ATE400405T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
AT06000630T 2000-11-29 2001-04-11 Verfahren zur herstellung eines schleifgegenstands ATE400405T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/726,064 US20020072296A1 (en) 2000-11-29 2000-11-29 Abrasive article having a window system for polishing wafers, and methods

Publications (1)

Publication Number Publication Date
ATE400405T1 true ATE400405T1 (de) 2008-07-15

Family

ID=24917074

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06000630T ATE400405T1 (de) 2000-11-29 2001-04-11 Verfahren zur herstellung eines schleifgegenstands
AT01926874T ATE320881T1 (de) 2000-11-29 2001-04-11 Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT01926874T ATE320881T1 (de) 2000-11-29 2001-04-11 Schleifmittel mit einem fenstersystem zum polieren von wafern und verfahren hierfür

Country Status (13)

Country Link
US (3) US20020072296A1 (de)
EP (2) EP1655103B1 (de)
JP (1) JP2004516947A (de)
KR (1) KR100711160B1 (de)
CN (1) CN1238161C (de)
AT (2) ATE400405T1 (de)
AU (1) AU2001253382A1 (de)
CA (1) CA2430377A1 (de)
DE (2) DE60134797D1 (de)
IL (1) IL155856A0 (de)
MY (1) MY126929A (de)
TW (1) TW564202B (de)
WO (1) WO2002043925A1 (de)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
US7824244B2 (en) * 2007-05-30 2010-11-02 Corning Incorporated Methods and apparatus for polishing a semiconductor wafer
US6609950B2 (en) * 2000-07-05 2003-08-26 Ebara Corporation Method for polishing a substrate
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US6702866B2 (en) * 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US20050054277A1 (en) * 2003-09-04 2005-03-10 Teng-Chun Tsai Polishing pad and method of polishing wafer
DE10346254A1 (de) * 2003-09-25 2005-05-12 Supfina Grieshaber Gmbh & Co Verfahren zur Bearbeitung von Werkstückoberflächen
JP2005150235A (ja) 2003-11-12 2005-06-09 Three M Innovative Properties Co 半導体表面保護シート及び方法
JP4646526B2 (ja) * 2004-02-18 2011-03-09 株式会社日立製作所 記憶制御システム及び同システムの制御方法
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
US20060025046A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article splicing system and methods
US7090560B2 (en) * 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
CN101244535B (zh) * 2006-02-15 2012-06-13 应用材料公司 抛光仓
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US20080014532A1 (en) * 2006-07-14 2008-01-17 3M Innovative Properties Company Laminate body, and method for manufacturing thin substrate using the laminate body
JP4941735B2 (ja) * 2007-03-30 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4888905B2 (ja) * 2007-03-30 2012-02-29 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5004701B2 (ja) * 2007-07-11 2012-08-22 株式会社荏原製作所 研磨装置
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
US20090017323A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
US8357286B1 (en) 2007-10-29 2013-01-22 Semcon Tech, Llc Versatile workpiece refining
WO2009070352A1 (en) * 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
JP5596030B2 (ja) 2008-06-26 2014-09-24 スリーエム イノベイティブ プロパティズ カンパニー 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法
US8226737B2 (en) * 2008-07-03 2012-07-24 3M Innovative Properties Company Fixed abrasive particles and articles made therefrom
EP2323808B1 (de) * 2008-07-18 2015-09-30 3M Innovative Properties Company Polierkissen mit schwimmenden elementen und herstellungs- und verwendungsverfahren dafür
EP2147745A1 (de) * 2008-07-25 2010-01-27 Supfina Grieshaber GmbH & Co. KG Superfinishmaschine mit Schleifband und Verfahren zum Betrieben einer Superfinishmaschine
JP5351967B2 (ja) 2008-08-28 2013-11-27 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品、その製造方法、及びウエハの平坦化における使用
US20100112919A1 (en) * 2008-11-03 2010-05-06 Applied Materials, Inc. Monolithic linear polishing sheet
CN102458771A (zh) * 2009-04-17 2012-05-16 3M创新有限公司 采用转移制品制造的平面磨料制品及其制造方法
CN102148178A (zh) * 2009-12-16 2011-08-10 第一毛织株式会社 电路小片粘性膜、卷筒、安装设备和电子产品
CN102686362A (zh) 2009-12-30 2012-09-19 3M创新有限公司 包括分相共混聚合物的抛光垫及其制备和使用方法
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8641476B2 (en) 2011-10-06 2014-02-04 Wayne O. Duescher Coplanar alignment apparatus for rotary spindles
US8602842B2 (en) * 2010-03-12 2013-12-10 Wayne O. Duescher Three-point fixed-spindle floating-platen abrasive system
US8758088B2 (en) 2011-10-06 2014-06-24 Wayne O. Duescher Floating abrading platen configuration
US8647171B2 (en) * 2010-03-12 2014-02-11 Wayne O. Duescher Fixed-spindle floating-platen workpiece loader apparatus
US8647172B2 (en) 2010-03-12 2014-02-11 Wayne O. Duescher Wafer pads for fixed-spindle floating-platen lapping
US8500515B2 (en) * 2010-03-12 2013-08-06 Wayne O. Duescher Fixed-spindle and floating-platen abrasive system using spherical mounts
US8696405B2 (en) 2010-03-12 2014-04-15 Wayne O. Duescher Pivot-balanced floating platen lapping machine
US8740668B2 (en) * 2010-03-12 2014-06-03 Wayne O. Duescher Three-point spindle-supported floating abrasive platen
US8647170B2 (en) 2011-10-06 2014-02-11 Wayne O. Duescher Laser alignment apparatus for rotary spindles
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8337280B2 (en) 2010-09-14 2012-12-25 Duescher Wayne O High speed platen abrading wire-driven rotary workholder
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8430717B2 (en) 2010-10-12 2013-04-30 Wayne O. Duescher Dynamic action abrasive lapping workholder
RU2577572C2 (ru) 2011-02-24 2016-03-20 Зм Инновейтив Пропертиз Компани Абразивное изделие с покрытием на вспененной подложке и способ его изготовления
CN102689270B (zh) * 2011-03-22 2015-04-01 中芯国际集成电路制造(上海)有限公司 固结磨料抛光垫及其制备方法
JP6432497B2 (ja) * 2015-12-10 2018-12-05 信越半導体株式会社 研磨方法
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
WO2019022961A1 (en) * 2017-07-28 2019-01-31 Applied Materials, Inc. METHOD FOR IDENTIFYING AND MONITORING ROLLER ROLL POLISHING PAD MATERIALS DURING PROCESSING
EP3691830A4 (de) 2017-10-04 2021-11-17 Saint-Gobain Abrasives, Inc. Schleifartikel und verfahren zur herstellung davon
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
EP3948702A4 (de) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. Lösungen für leistungsschleifen
WO2020206382A1 (en) 2019-04-03 2020-10-08 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03234467A (ja) * 1990-02-05 1991-10-18 Canon Inc スタンパの金型取付面の研磨方法およびその研磨機
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
US5219462A (en) * 1992-01-13 1993-06-15 Minnesota Mining And Manufacturing Company Abrasive article having abrasive composite members positioned in recesses
US5437754A (en) * 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US5499733A (en) 1992-09-17 1996-03-19 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US5658183A (en) 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5433651A (en) 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5607345A (en) * 1994-01-13 1997-03-04 Minnesota Mining And Manufacturing Company Abrading apparatus
JP3270282B2 (ja) * 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
DE69635816T2 (de) 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US5964643A (en) 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
KR100494605B1 (ko) * 1997-03-07 2005-06-10 미네소타 마이닝 앤드 매뉴팩춰링 캄파니 유리상에 투명한 표면 마무리 상태를 제공하기 위한 연마용품
DE19720623C1 (de) 1997-05-16 1998-11-05 Siemens Ag Poliervorrichtung und Poliertuch
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6111634A (en) 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US5985679A (en) 1997-06-12 1999-11-16 Lsi Logic Corporation Automated endpoint detection system during chemical-mechanical polishing
TW374050B (en) 1997-10-31 1999-11-11 Applied Materials Inc Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing
TW421620B (en) 1997-12-03 2001-02-11 Siemens Ag Device and method to control an end-point during polish of components (especially semiconductor components)
US6068539A (en) 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US5897426A (en) * 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
JP3825220B2 (ja) * 1999-02-04 2006-09-27 アプライド マテリアルズ インコーポレイテッド 移動研磨シートを用いたケミカルメカニカルポリシング
JP2000271854A (ja) * 1999-03-25 2000-10-03 Hitachi Ltd 加工方法及びその装置並びに半導体基板の加工方法

Also Published As

Publication number Publication date
TW564202B (en) 2003-12-01
CN1238161C (zh) 2006-01-25
US20020072296A1 (en) 2002-06-13
US20030022598A1 (en) 2003-01-30
EP1337380B1 (de) 2006-03-22
CA2430377A1 (en) 2002-06-06
JP2004516947A (ja) 2004-06-10
DE60134797D1 (de) 2008-08-21
MY126929A (en) 2006-10-31
EP1655103B1 (de) 2008-07-09
AU2001253382A1 (en) 2002-06-11
US6786810B2 (en) 2004-09-07
DE60118171D1 (de) 2006-05-11
EP1655103A1 (de) 2006-05-10
KR20030048484A (ko) 2003-06-19
DE60118171T2 (de) 2007-01-25
EP1337380A1 (de) 2003-08-27
WO2002043925A1 (en) 2002-06-06
IL155856A0 (en) 2003-12-23
ATE320881T1 (de) 2006-04-15
US20030064663A1 (en) 2003-04-03
CN1476368A (zh) 2004-02-18
US6604985B2 (en) 2003-08-12
KR100711160B1 (ko) 2007-05-16

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