ATE302099T1 - Verfahren und vorrichtung zum schneiden von vorimprägnat - Google Patents

Verfahren und vorrichtung zum schneiden von vorimprägnat

Info

Publication number
ATE302099T1
ATE302099T1 AT02013961T AT02013961T ATE302099T1 AT E302099 T1 ATE302099 T1 AT E302099T1 AT 02013961 T AT02013961 T AT 02013961T AT 02013961 T AT02013961 T AT 02013961T AT E302099 T1 ATE302099 T1 AT E302099T1
Authority
AT
Austria
Prior art keywords
prepreg
resin
softened
cut
cuts
Prior art date
Application number
AT02013961T
Other languages
English (en)
Inventor
Yoshiyuki Kaji
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Application granted granted Critical
Publication of ATE302099T1 publication Critical patent/ATE302099T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/16—Bands or sheets of indefinite length

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Laser Beam Processing (AREA)
  • Details Of Cutting Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Disintegrating Or Milling (AREA)
AT02013961T 2001-12-25 2002-06-25 Verfahren und vorrichtung zum schneiden von vorimprägnat ATE302099T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001392113A JP3687607B2 (ja) 2001-12-25 2001-12-25 プリプレグの切断方法

Publications (1)

Publication Number Publication Date
ATE302099T1 true ATE302099T1 (de) 2005-09-15

Family

ID=19188591

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02013961T ATE302099T1 (de) 2001-12-25 2002-06-25 Verfahren und vorrichtung zum schneiden von vorimprägnat

Country Status (8)

Country Link
US (1) US6621046B2 (de)
EP (1) EP1323505B1 (de)
JP (1) JP3687607B2 (de)
KR (1) KR100488752B1 (de)
CN (1) CN1239364C (de)
AT (1) ATE302099T1 (de)
DE (1) DE60205571T2 (de)
TW (1) TW541235B (de)

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JP2004066327A (ja) * 2002-08-09 2004-03-04 Tdk Corp レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
US6885108B2 (en) * 2003-03-18 2005-04-26 Micron Technology, Inc. Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
US9150342B2 (en) 2003-04-16 2015-10-06 Intercontinental Great Brands Llc Resealable tray container
EP1931495A4 (de) * 2005-10-03 2009-08-26 Aradigm Corp Verfahren und system zur laserbearbeitung
US7963413B2 (en) 2006-05-23 2011-06-21 Kraft Foods Global Brands Llc Tamper evident resealable closure
US8308363B2 (en) 2006-05-23 2012-11-13 Kraft Foods Global Brands Llc Package integrity indicator for container closure
US8114451B2 (en) 2006-12-27 2012-02-14 Kraft Foods Global Brands Llc Resealable closure with package integrity feature
US8408792B2 (en) 2007-03-30 2013-04-02 Kraft Foods Global Brands Llc Package integrity indicating closure
JP4950932B2 (ja) * 2007-04-12 2012-06-13 タツタ電線株式会社 光ファイバーグレーティング部のアニール方法
DE102007020748A1 (de) * 2007-05-03 2008-11-13 Clean-Lasersysteme Gmbh Vorrichtung und Verfahren zum Bearbeiten einer Oberfläche eines Werkstücks mittels Laserstrahlung
CN100574959C (zh) * 2007-06-01 2009-12-30 深圳市大族激光科技股份有限公司 一种pp片切割设备及其方法
JP2009018389A (ja) * 2007-07-12 2009-01-29 Fujifilm Corp カッタ装置の製造方法
KR100969946B1 (ko) * 2007-07-24 2010-07-14 주식회사 이오테크닉스 레이저 빔 분할을 이용한 레이저 가공 장치 및 방법
US20100018974A1 (en) 2008-07-24 2010-01-28 Deborah Lyzenga Package integrity indicating closure
GB0819200D0 (en) 2008-10-20 2008-11-26 Cadbury Holdings Ltd Packaging
JP5399129B2 (ja) * 2009-05-11 2014-01-29 北川精機株式会社 切断装置
DK2347971T3 (da) 2010-01-26 2012-09-17 Gen Biscuit Genlukkelig emballage til fødevarer og fremgangsmåde til fremstilling
US8814430B2 (en) * 2010-02-23 2014-08-26 Kraft Foods R&D, Inc. Food package having opening feature
ES2390568T3 (es) 2010-03-23 2012-11-14 Generale Biscuit Envase que se puede volver a cerrar para productos alimenticios y método de fabricación
PL2571766T3 (pl) 2010-05-18 2015-02-27 Intercontinental Great Brands Llc Elastyczne opakowanie z możliwością wielokrotnego zamykania oraz sposoby jego wytwarzania
US9656783B2 (en) 2010-05-18 2017-05-23 Intercontinental Great Brands Llc Reclosable flexible packaging and methods for manufacturing same
CN102510788B (zh) * 2010-06-14 2014-12-24 三菱电机株式会社 激光加工装置以及激光加工方法
CN102001547A (zh) * 2010-12-08 2011-04-06 无锡八一塑料有限公司 一种塑料装饰条的切割机
EP3109172B1 (de) 2011-03-17 2018-08-15 Intercontinental Great Brands LLC Wiederverschliessbare flexible folienverpackungsprodukte und verfahren zur herstellung
KR101638890B1 (ko) * 2011-12-27 2016-07-12 제이에프이 스틸 가부시키가이샤 방향성 전자 강판의 철손 개선 장치
CN102658425A (zh) * 2012-04-24 2012-09-12 北京中鼎高科自动化技术有限公司 一层以上胶粘制品的在线连续激光加工装置
US8940123B2 (en) * 2012-04-27 2015-01-27 Web Industries, Inc. Prepreg tape slitting apparatus and method
CN103624838B (zh) * 2013-10-30 2015-10-21 胜宏科技（惠州）股份有限公司 一种半固化片裁切装置及裁切方法
DE102015002106A1 (de) * 2015-02-23 2016-08-25 Basf Se Prozessanordnung sowie Verfahren zur Herstellung eines faserverstärkten Kunststoffbauteils
JP6306659B1 (ja) * 2016-10-19 2018-04-04 ファナック株式会社 ビーム分配器
JP6814033B2 (ja) * 2016-11-25 2021-01-13 リンテック株式会社 切断装置および切断方法
CN106698056A (zh) * 2016-12-15 2017-05-24 池州市新辰包装科技有限公司 一种裁片机
US11813694B2 (en) * 2018-02-02 2023-11-14 Jsw Aktina System Co., Ltd Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatus
US11701839B2 (en) * 2018-06-14 2023-07-18 Airbus Operations Gmbh Method and system for joining two components of a meltable material
JP2020066168A (ja) * 2018-10-24 2020-04-30 三菱重工業株式会社 プリプレグ自動積層装置
CN111003565B (zh) * 2019-11-29 2021-07-02 杨林 一种方便纸筒对位的薄膜分切装置
CN115041833A (zh) * 2022-06-01 2022-09-13 深圳市海目星激光智能装备股份有限公司 一种激光切割装置及电池生产系统
CN115246036B (zh) * 2022-08-11 2024-08-06 沈阳航远航空技术有限公司 一种脆性或高强度材料双束激光辅助冲压方法

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US4017012A (en) * 1973-06-04 1977-04-12 Brock Reginald L Severing apparatus for plastic material
US4613742A (en) * 1985-03-11 1986-09-23 The Mead Corporation Method for cutting imaging sheets containing photosensitive microcapsules
US4639572A (en) * 1985-11-25 1987-01-27 Ibm Corporation Laser cutting of composite materials
FR2607444B1 (fr) * 1986-12-02 1989-02-10 Saint Gobain Vitrage Dispositif de decoupe de feuilles de matiere plastique
JPH0798935B2 (ja) 1987-11-25 1995-10-25 有限会社野々川商事 品質劣化防止剤
JPH0394988A (ja) 1989-09-05 1991-04-19 Mitsubishi Electric Corp プリプレグの切断加工方法
JPH05235504A (ja) 1992-02-24 1993-09-10 Matsushita Electric Works Ltd プリプレグの切断方法
JPH05235503A (ja) 1992-02-24 1993-09-10 Matsushita Electric Works Ltd プリプレグの切断方法
JPH1032179A (ja) * 1996-07-15 1998-02-03 Teikoku T-Pingu Syst Kk シリコンウエハー加工用マスキングシートの切断方法
CA2259700C (en) * 1998-01-21 2007-05-08 Clive G. Whittenbury Laser-assisted cutting device
JP3536751B2 (ja) * 1999-11-18 2004-06-14 松下電工株式会社 プリプレグの製造方法

Also Published As

Publication number Publication date
EP1323505B1 (de) 2005-08-17
CN1239364C (zh) 2006-02-01
JP2003191197A (ja) 2003-07-08
US6621046B2 (en) 2003-09-16
EP1323505A3 (de) 2004-01-02
DE60205571T2 (de) 2006-06-14
EP1323505A2 (de) 2003-07-02
TW541235B (en) 2003-07-11
DE60205571D1 (de) 2005-09-22
US20030116545A1 (en) 2003-06-26
JP3687607B2 (ja) 2005-08-24
CN1428284A (zh) 2003-07-09
KR20030055083A (ko) 2003-07-02
KR100488752B1 (ko) 2005-05-11

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