ATE304279T1 - Keramischer heizer. - Google Patents
Keramischer heizer.Info
- Publication number
- ATE304279T1 ATE304279T1 AT00948352T AT00948352T ATE304279T1 AT E304279 T1 ATE304279 T1 AT E304279T1 AT 00948352 T AT00948352 T AT 00948352T AT 00948352 T AT00948352 T AT 00948352T AT E304279 T1 ATE304279 T1 AT E304279T1
- Authority
- AT
- Austria
- Prior art keywords
- ceramic heater
- ceramic
- heater
- ceramic substrate
- rmax
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22569699 | 1999-08-09 | ||
| JP2000131210A JP2001118664A (ja) | 1999-08-09 | 2000-04-28 | セラミックヒータ |
| PCT/JP2000/005156 WO2001011923A1 (en) | 1999-08-09 | 2000-08-01 | Ceramic heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE304279T1 true ATE304279T1 (de) | 2005-09-15 |
Family
ID=26526784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT00948352T ATE304279T1 (de) | 1999-08-09 | 2000-08-01 | Keramischer heizer. |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US6465763B1 (de) |
| EP (2) | EP1437917A1 (de) |
| JP (1) | JP2001118664A (de) |
| AT (1) | ATE304279T1 (de) |
| DE (1) | DE60022495T2 (de) |
| TW (1) | TW480895B (de) |
| WO (1) | WO2001011923A1 (de) |
Families Citing this family (77)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6967313B1 (en) | 1999-05-07 | 2005-11-22 | Ibiden Company, Ltd. | Hot plate and method of producing the same |
| JP2001118664A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| US6835916B2 (en) | 1999-08-09 | 2004-12-28 | Ibiden, Co., Ltd | Ceramic heater |
| JP2001118662A (ja) | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| EP1120829A4 (de) * | 1999-08-10 | 2009-05-27 | Ibiden Co Ltd | Keramische platte für halbleiterproduktionsanordnung |
| JP3381909B2 (ja) * | 1999-08-10 | 2003-03-04 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| JP3273773B2 (ja) | 1999-08-12 | 2002-04-15 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ、半導体製造・検査装置用静電チャックおよびウエハプローバ用チャックトップ |
| WO2001017927A1 (en) * | 1999-09-06 | 2001-03-15 | Ibiden Co., Ltd. | Carbon-containing aluminium nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductor |
| EP1383167A1 (de) | 1999-12-09 | 2004-01-21 | Ibiden Co., Ltd. | Keramische scheibe für ein halbleitererzeugungs/inspektionsgerät |
| JP2001237053A (ja) * | 1999-12-14 | 2001-08-31 | Ibiden Co Ltd | 半導体製造・検査装置用セラミックヒータおよび支持ピン |
| US20040222211A1 (en) * | 1999-12-28 | 2004-11-11 | Ibiden Co., Ltd. | Carbon-containing aluminum nitride sintered body, and ceramic substrate for a semiconductor producing/examining device |
| US20040011782A1 (en) * | 1999-12-29 | 2004-01-22 | Ibiden Co., Ltd | Ceramic heater |
| JP3228923B2 (ja) * | 2000-01-18 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| JP3228924B2 (ja) * | 2000-01-21 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
| EP1193233A1 (de) | 2000-02-07 | 2002-04-03 | Ibiden Co., Ltd. | Keramisches substrat zur herstellung von halbleitern/inspektions vorrichtung |
| WO2001059833A1 (en) * | 2000-02-08 | 2001-08-16 | Ibiden Co., Ltd. | Ceramic board for semiconductor production and inspection devices |
| EP1191002A4 (de) * | 2000-02-24 | 2005-01-26 | Ibiden Co Ltd | Kompakt gesintertes aluminiumnitrid, keramisches substrat, keramische heizung und elektrostatischerhalter |
| JP2001244320A (ja) * | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
| JP2001247382A (ja) * | 2000-03-06 | 2001-09-11 | Ibiden Co Ltd | セラミック基板 |
| WO2001066488A1 (en) | 2000-03-07 | 2001-09-13 | Ibiden Co., Ltd. | Ceramic substrate for manufacture/inspection of semiconductor |
| JP2001253777A (ja) * | 2000-03-13 | 2001-09-18 | Ibiden Co Ltd | セラミック基板 |
| WO2001078456A1 (fr) * | 2000-04-07 | 2001-10-18 | Ibiden Co., Ltd. | Element ceramique chauffant |
| WO2001078454A1 (fr) * | 2000-04-07 | 2001-10-18 | Ibiden Co., Ltd. | Dispositif chauffant ceramique |
| JP3565496B2 (ja) * | 2000-04-13 | 2004-09-15 | イビデン株式会社 | セラミックヒータ、静電チャックおよびウエハプローバ |
| JP2001302330A (ja) * | 2000-04-24 | 2001-10-31 | Ibiden Co Ltd | セラミック基板 |
| US6677557B2 (en) * | 2000-05-02 | 2004-01-13 | Ibiden Co., Ltd. | Ceramic heater |
| JP2002025758A (ja) * | 2000-05-02 | 2002-01-25 | Ibiden Co Ltd | ホットプレートユニット |
| EP1211725A4 (de) | 2000-05-10 | 2003-02-26 | Ibiden Co Ltd | Elektrostatische haltevorrichtung |
| US7071551B2 (en) * | 2000-05-26 | 2006-07-04 | Ibiden Co., Ltd. | Device used to produce or examine semiconductors |
| JP3618640B2 (ja) * | 2000-06-15 | 2005-02-09 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
| JP3516392B2 (ja) | 2000-06-16 | 2004-04-05 | イビデン株式会社 | 半導体製造・検査装置用ホットプレート |
| US6897414B2 (en) * | 2000-07-03 | 2005-05-24 | Ibiden Co., Ltd. | Ceramic heater for semiconductor manufacturing/testing apparatus |
| EP1229572A1 (de) * | 2000-07-04 | 2002-08-07 | Ibiden Co., Ltd. | Heisse platte für die verarbeitung und das testen von halbleitern |
| WO2002007195A1 (fr) * | 2000-07-19 | 2002-01-24 | Ibiden Co., Ltd. | Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs, son procede de fabrication, et son systeme de fabrication |
| TW512645B (en) * | 2000-07-25 | 2002-12-01 | Ibiden Co Ltd | Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clamp holder, and substrate for wafer prober |
| WO2002019400A1 (en) | 2000-08-30 | 2002-03-07 | Ibiden Co., Ltd. | Ceramic heater for semiconductor manufacturing and inspecting equipment |
| JP2002076102A (ja) * | 2000-08-31 | 2002-03-15 | Ibiden Co Ltd | セラミック基板 |
| US20040035846A1 (en) * | 2000-09-13 | 2004-02-26 | Yasuji Hiramatsu | Ceramic heater for semiconductor manufacturing and inspecting equipment |
| JP2002160974A (ja) * | 2000-11-22 | 2002-06-04 | Ibiden Co Ltd | 窒化アルミニウム焼結体、窒化アルミニウム焼結体の製造方法、セラミック基板およびセラミック基板の製造方法 |
| US6924464B2 (en) | 2000-11-24 | 2005-08-02 | Ibiden Co., Ltd. | Ceramic heater and manufacturing method of ceramic heater |
| US6960743B2 (en) * | 2000-12-05 | 2005-11-01 | Ibiden Co., Ltd. | Ceramic substrate for semiconductor manufacturing, and method of manufacturing the ceramic substrate |
| EP1391919A1 (de) * | 2001-04-11 | 2004-02-25 | Ibiden Co., Ltd. | Keramisches heizelement für eine halbleiterherstellungs-/-untersuchungsvorrichtung |
| JP2002313890A (ja) * | 2001-04-11 | 2002-10-25 | Sumitomo Electric Ind Ltd | 被加熱物搭載用ヒータ部材およびそれを用いた基板処理装置 |
| IL154264A0 (en) * | 2001-06-06 | 2003-09-17 | Ibiden Co Ltd | Wafer prober |
| CN1473452A (zh) * | 2001-07-09 | 2004-02-04 | IBIDEN�ɷ�����˾ | 陶瓷加热器与陶瓷接合体 |
| WO2003015157A1 (en) | 2001-08-10 | 2003-02-20 | Ibiden Co., Ltd. | Ceramic joint body |
| JP3982674B2 (ja) * | 2001-11-19 | 2007-09-26 | 日本碍子株式会社 | セラミックヒーター、その製造方法および半導体製造装置用加熱装置 |
| JP2004146567A (ja) * | 2002-10-24 | 2004-05-20 | Sumitomo Electric Ind Ltd | 半導体製造装置用セラミックスヒーター |
| US7347901B2 (en) * | 2002-11-29 | 2008-03-25 | Tokyo Electron Limited | Thermally zoned substrate holder assembly |
| JP4569077B2 (ja) | 2003-06-05 | 2010-10-27 | 住友電気工業株式会社 | 半導体あるいは液晶製造装置用保持体およびそれを搭載した半導体あるいは液晶製造装置 |
| KR100506315B1 (ko) * | 2003-08-22 | 2005-08-05 | 삼성전자주식회사 | 웨이퍼 베이크 시스템 및 그 동작 방법 |
| JP2005166354A (ja) * | 2003-12-01 | 2005-06-23 | Ngk Insulators Ltd | セラミックヒーター |
| CN100525547C (zh) * | 2004-02-23 | 2009-08-05 | 京瓷株式会社 | 陶瓷加热器、晶片加热装置以及半导体基板的制造方法 |
| US8071916B2 (en) * | 2004-06-28 | 2011-12-06 | Kyocera Corporation | Wafer heating apparatus and semiconductor manufacturing apparatus |
| US20060060145A1 (en) * | 2004-09-17 | 2006-03-23 | Van Den Berg Jannes R | Susceptor with surface roughness for high temperature substrate processing |
| US20060088692A1 (en) * | 2004-10-22 | 2006-04-27 | Ibiden Co., Ltd. | Ceramic plate for a semiconductor producing/examining device |
| TWI281833B (en) * | 2004-10-28 | 2007-05-21 | Kyocera Corp | Heater, wafer heating apparatus and method for manufacturing heater |
| JP2007053280A (ja) * | 2005-08-19 | 2007-03-01 | Sumitomo Electric Ind Ltd | 半導体加熱ヒータ用容器 |
| ES2278539B1 (es) * | 2006-01-31 | 2008-07-16 | Celaya, Emparanza Y Galdos, Internacional, S.A. | Suela de plancha y plancha que la contiene. |
| US8226769B2 (en) * | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
| JP2006279061A (ja) * | 2006-05-22 | 2006-10-12 | Sumitomo Electric Ind Ltd | 半導体製造装置用セラミックスヒーター |
| US7926209B2 (en) * | 2007-02-13 | 2011-04-19 | Advanced Materials Enterprises Company Limited | Electric iron |
| US8252410B2 (en) * | 2007-09-05 | 2012-08-28 | Applied Materials, Inc. | Ceramic cover wafers of aluminum nitride or beryllium oxide |
| TWI459851B (zh) * | 2007-09-10 | 2014-11-01 | 日本碍子股份有限公司 | heating equipment |
| FR2927218B1 (fr) * | 2008-02-06 | 2010-03-05 | Hydromecanique & Frottement | Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu |
| KR101316804B1 (ko) * | 2008-12-25 | 2013-10-11 | 가부시키가이샤 알박 | 정전척용의 척 플레이트의 제조 방법 |
| WO2010090948A1 (en) * | 2009-02-04 | 2010-08-12 | Mattson Technology, Inc. | Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate |
| JP5915026B2 (ja) * | 2011-08-26 | 2016-05-11 | 住友大阪セメント株式会社 | 温度測定用板状体及びそれを備えた温度測定装置 |
| FR2992313B1 (fr) * | 2012-06-21 | 2014-11-07 | Eurokera | Article vitroceramique et procede de fabrication |
| US9088085B2 (en) * | 2012-09-21 | 2015-07-21 | Novellus Systems, Inc. | High temperature electrode connections |
| EP3262677B1 (de) * | 2015-02-23 | 2025-11-26 | II-VI Delaware, Inc. | Filmelektrode für elektrostatischen chuck |
| JP6401638B2 (ja) * | 2015-03-17 | 2018-10-10 | 株式会社Kelk | 加熱装置 |
| JP6804828B2 (ja) * | 2015-04-20 | 2020-12-23 | 日本特殊陶業株式会社 | セラミックヒータ及び静電チャック |
| JP6758143B2 (ja) * | 2016-09-29 | 2020-09-23 | 日本特殊陶業株式会社 | 加熱装置 |
| WO2019131115A1 (ja) * | 2017-12-28 | 2019-07-04 | 住友大阪セメント株式会社 | 静電チャック装置 |
| CN110645794B (zh) * | 2019-08-30 | 2021-04-06 | 西安工业大学 | 半密闭非真空氮气保护电路模块烧结系统 |
| KR102932772B1 (ko) * | 2021-12-09 | 2026-03-04 | 삼성전자주식회사 | 웨이퍼 베이킹 장치 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US242402A (en) * | 1881-05-31 | Broadcast seed-sower | ||
| US247451A (en) * | 1881-09-20 | Territory | ||
| US246590A (en) * | 1881-09-06 | Elmee e | ||
| US248168A (en) * | 1881-10-11 | harvey | ||
| US246909A (en) * | 1881-09-13 | Apparatus for operating fans | ||
| US215240A (en) * | 1879-05-13 | Improvement in stoves | ||
| US225895A (en) * | 1880-03-23 | Extension cutting-blade handle | ||
| DE69111493T2 (de) * | 1990-03-12 | 1996-03-21 | Ngk Insulators Ltd | Wafer-Heizgeräte für Apparate, zur Halbleiterherstellung Heizanlage mit diesen Heizgeräten und Herstellung von Heizgeräten. |
| JPH0432184A (ja) | 1990-05-25 | 1992-02-04 | Toshiba Lighting & Technol Corp | 赤外線ヒータ |
| JPH0665629B2 (ja) * | 1990-07-20 | 1994-08-24 | 日本碍子株式会社 | 半導体製造装置用セラミックス材およびその製造方法 |
| EP0506391B1 (de) * | 1991-03-26 | 2002-02-27 | Ngk Insulators, Ltd. | Verwendung eines Korrosion beständiger Substratshalter aus Aluminiumnitrid |
| EP1120817B8 (de) * | 1991-03-26 | 2007-10-10 | Ngk Insulators, Ltd. | Verwendung eines korrosion beständigen Substratshalters |
| JP3133961B2 (ja) * | 1991-05-28 | 2001-02-13 | 日本碍子株式会社 | 耐蝕性部材、その使用方法およびその製造方法 |
| FR2692828B1 (fr) | 1992-06-24 | 1996-06-21 | Celes | Dispositif de securite de modules de chauffage ou de rechauffage inductif de produits metallurgiques. |
| US5800618A (en) * | 1992-11-12 | 1998-09-01 | Ngk Insulators, Ltd. | Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof |
| JP3589684B2 (ja) | 1993-10-07 | 2004-11-17 | 株式会社デンソー | セラミックグロープラグ |
| JPH07307377A (ja) * | 1993-12-27 | 1995-11-21 | Shin Etsu Chem Co Ltd | 静電チャック付セラミックスヒーター |
| JP3158829B2 (ja) | 1993-12-31 | 2001-04-23 | 東京エレクトロン株式会社 | 熱処理装置及び熱処理方法 |
| JP2647799B2 (ja) * | 1994-02-04 | 1997-08-27 | 日本碍子株式会社 | セラミックスヒーター及びその製造方法 |
| JPH07280462A (ja) * | 1994-04-11 | 1995-10-27 | Shin Etsu Chem Co Ltd | 均熱セラミックスヒーター |
| JP3851692B2 (ja) | 1996-09-30 | 2006-11-29 | 日本特殊陶業株式会社 | ヒータ内蔵型セラミックセンサ |
| EP0853444B1 (de) * | 1997-01-10 | 2005-11-23 | E.G.O. ELEKTRO-GERÄTEBAU GmbH | Kochsystem mit einer Kontaktwärme übertragenden Elektro-Kochplatte |
| JP3165396B2 (ja) * | 1997-07-19 | 2001-05-14 | イビデン株式会社 | ヒーターおよびその製造方法 |
| JPH11204238A (ja) * | 1998-01-08 | 1999-07-30 | Ngk Insulators Ltd | セラミックスヒーター |
| JP2000156277A (ja) * | 1998-04-24 | 2000-06-06 | Canon Inc | 加熱装置及び加熱方法 |
| KR20020073158A (ko) | 1999-06-09 | 2002-09-19 | 이비덴 가부시키가이샤 | 세라믹히터 및 그 제조방법 |
| JP2001118664A (ja) * | 1999-08-09 | 2001-04-27 | Ibiden Co Ltd | セラミックヒータ |
| JP2001244320A (ja) | 2000-02-25 | 2001-09-07 | Ibiden Co Ltd | セラミック基板およびその製造方法 |
-
2000
- 2000-04-28 JP JP2000131210A patent/JP2001118664A/ja active Pending
- 2000-08-01 EP EP20030028824 patent/EP1437917A1/de not_active Withdrawn
- 2000-08-01 DE DE60022495T patent/DE60022495T2/de not_active Expired - Lifetime
- 2000-08-01 EP EP00948352A patent/EP1185145B1/de not_active Expired - Lifetime
- 2000-08-01 WO PCT/JP2000/005156 patent/WO2001011923A1/ja not_active Ceased
- 2000-08-01 AT AT00948352T patent/ATE304279T1/de not_active IP Right Cessation
- 2000-08-01 US US09/926,261 patent/US6465763B1/en not_active Expired - Lifetime
- 2000-08-09 TW TW089115975A patent/TW480895B/zh not_active IP Right Cessation
-
2002
- 2002-04-10 US US10/118,967 patent/US6710307B2/en not_active Expired - Lifetime
-
2003
- 2003-09-10 US US10/658,454 patent/US6861620B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US20040045951A1 (en) | 2004-03-11 |
| US6710307B2 (en) | 2004-03-23 |
| US6861620B2 (en) | 2005-03-01 |
| US20020158061A1 (en) | 2002-10-31 |
| DE60022495D1 (de) | 2005-10-13 |
| DE60022495T2 (de) | 2006-06-29 |
| EP1185145B1 (de) | 2005-09-07 |
| EP1437917A1 (de) | 2004-07-14 |
| WO2001011923A1 (en) | 2001-02-15 |
| JP2001118664A (ja) | 2001-04-27 |
| EP1185145A1 (de) | 2002-03-06 |
| EP1185145A4 (de) | 2003-01-15 |
| TW480895B (en) | 2002-03-21 |
| US6465763B1 (en) | 2002-10-15 |
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