ATE307918T1 - Bad für galvanischen goldniederschlag - Google Patents

Bad für galvanischen goldniederschlag

Info

Publication number
ATE307918T1
ATE307918T1 AT03729763T AT03729763T ATE307918T1 AT E307918 T1 ATE307918 T1 AT E307918T1 AT 03729763 T AT03729763 T AT 03729763T AT 03729763 T AT03729763 T AT 03729763T AT E307918 T1 ATE307918 T1 AT E307918T1
Authority
AT
Austria
Prior art keywords
bath
bismuth
soluble
liter
gold deposition
Prior art date
Application number
AT03729763T
Other languages
English (en)
Inventor
Pierre Laude
Pierre-Andre Aeby
Original Assignee
Metalor Technologies Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Technologies Int filed Critical Metalor Technologies Int
Application granted granted Critical
Publication of ATE307918T1 publication Critical patent/ATE307918T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
AT03729763T 2002-07-04 2003-06-20 Bad für galvanischen goldniederschlag ATE307918T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02405558A EP1378590A1 (de) 2002-07-04 2002-07-04 Bad für goldgalvanischen Goldüberzug
PCT/CH2003/000400 WO2004005589A1 (fr) 2002-07-04 2003-06-20 Bain pour depôt electrolytique d’or

Publications (1)

Publication Number Publication Date
ATE307918T1 true ATE307918T1 (de) 2005-11-15

Family

ID=29719808

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03729763T ATE307918T1 (de) 2002-07-04 2003-06-20 Bad für galvanischen goldniederschlag

Country Status (6)

Country Link
EP (2) EP1378590A1 (de)
AT (1) ATE307918T1 (de)
AU (1) AU2003240347A1 (de)
DE (1) DE60302074T2 (de)
ES (1) ES2252673T3 (de)
WO (1) WO2004005589A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005036133C5 (de) 2005-07-26 2017-07-13 Ivoclar Vivadent Ag Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad
KR101464343B1 (ko) * 2013-04-02 2014-11-28 한밭대학교 산학협력단 범프 형성용 비시안계 금 도금욕 및 범프의 형성방법
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
CN103741181B (zh) * 2014-01-10 2016-01-27 哈尔滨工业大学 一种多配位剂无氰电镀金镀液及电镀金工艺
CN107299366A (zh) * 2017-08-24 2017-10-27 重庆立道表面技术有限公司 无氰镀铜电镀液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754151A (fr) * 1969-08-08 1970-12-31 Sel Rex Corp Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH530473A (fr) * 1969-08-19 1972-11-15 Sel Rex Corp Procédé pour le dépôt électrolytique d'or brillant et bain électrolytique pour la mise en oeuvre de ce proédé
DD245787A3 (de) * 1984-10-25 1987-05-20 Mikroelektronik Friedrich Enge Bad fuer die hochgeschwindigkeitsabscheidung von gold
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
DE3805627A1 (de) * 1988-02-24 1989-09-07 Wieland Edelmetalle Goldbad
DE3905705A1 (de) * 1989-02-24 1990-08-30 Degussa Bad zur galvanischen abscheidung von feingoldueberzuegen
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
DE4425110C1 (de) * 1994-07-15 1995-10-26 Heraeus Gmbh W C Wäßriges Bad für die galvanische Abscheidung von Palladiumüberzügen, Verfahren der galvanischen Abscheidung sowie Verwendung des Bades
BR0207724A (pt) * 2001-02-28 2004-03-23 Wieland Dental & Technik Gmbh Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo

Also Published As

Publication number Publication date
DE60302074D1 (de) 2005-12-01
EP1520063B1 (de) 2005-10-26
AU2003240347A1 (en) 2004-01-23
DE60302074T2 (de) 2006-07-13
ES2252673T3 (es) 2006-05-16
WO2004005589A1 (fr) 2004-01-15
EP1378590A1 (de) 2004-01-07
EP1520063A1 (de) 2005-04-06

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties