ES2252673T3 - Baño para deposito electrolitico de oro. - Google Patents

Baño para deposito electrolitico de oro.

Info

Publication number
ES2252673T3
ES2252673T3 ES03729763T ES03729763T ES2252673T3 ES 2252673 T3 ES2252673 T3 ES 2252673T3 ES 03729763 T ES03729763 T ES 03729763T ES 03729763 T ES03729763 T ES 03729763T ES 2252673 T3 ES2252673 T3 ES 2252673T3
Authority
ES
Spain
Prior art keywords
gold
bismuth
bath
soluble
ammonium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES03729763T
Other languages
English (en)
Spanish (es)
Inventor
Pierre Laude
Pierre-Andre Aeby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metalor Technologies International SA
Original Assignee
Metalor Technologies International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metalor Technologies International SA filed Critical Metalor Technologies International SA
Application granted granted Critical
Publication of ES2252673T3 publication Critical patent/ES2252673T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
ES03729763T 2002-07-04 2003-06-20 Baño para deposito electrolitico de oro. Expired - Lifetime ES2252673T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02405558A EP1378590A1 (de) 2002-07-04 2002-07-04 Bad für goldgalvanischen Goldüberzug
EP02405558 2002-07-04

Publications (1)

Publication Number Publication Date
ES2252673T3 true ES2252673T3 (es) 2006-05-16

Family

ID=29719808

Family Applications (1)

Application Number Title Priority Date Filing Date
ES03729763T Expired - Lifetime ES2252673T3 (es) 2002-07-04 2003-06-20 Baño para deposito electrolitico de oro.

Country Status (6)

Country Link
EP (2) EP1378590A1 (de)
AT (1) ATE307918T1 (de)
AU (1) AU2003240347A1 (de)
DE (1) DE60302074T2 (de)
ES (1) ES2252673T3 (de)
WO (1) WO2004005589A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005036133C5 (de) 2005-07-26 2017-07-13 Ivoclar Vivadent Ag Bad für die galvanische Abscheidung von Gold und Goldlegierungen und Zusatzgemisch für ein solches Bad
KR101464343B1 (ko) * 2013-04-02 2014-11-28 한밭대학교 산학협력단 범프 형성용 비시안계 금 도금욕 및 범프의 형성방법
CN103741180B (zh) * 2014-01-10 2015-11-25 哈尔滨工业大学 无氰光亮电镀金添加剂及其应用
CN103741181B (zh) * 2014-01-10 2016-01-27 哈尔滨工业大学 一种多配位剂无氰电镀金镀液及电镀金工艺
CN107299366A (zh) * 2017-08-24 2017-10-27 重庆立道表面技术有限公司 无氰镀铜电镀液

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE754151A (fr) * 1969-08-08 1970-12-31 Sel Rex Corp Bain aqueux pour le placage electrolytique d'or ou d'alliage d'or sur un article conducteur, procede de fabrication dudit bain aqueux et utilisation de celui-ci
CH530473A (fr) * 1969-08-19 1972-11-15 Sel Rex Corp Procédé pour le dépôt électrolytique d'or brillant et bain électrolytique pour la mise en oeuvre de ce proédé
DD245787A3 (de) * 1984-10-25 1987-05-20 Mikroelektronik Friedrich Enge Bad fuer die hochgeschwindigkeitsabscheidung von gold
US4795534A (en) * 1986-09-25 1989-01-03 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
DE3805627A1 (de) * 1988-02-24 1989-09-07 Wieland Edelmetalle Goldbad
DE3905705A1 (de) * 1989-02-24 1990-08-30 Degussa Bad zur galvanischen abscheidung von feingoldueberzuegen
DE4226167C2 (de) * 1992-08-07 1996-10-24 Sel Alcatel Ag Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik
DE4425110C1 (de) * 1994-07-15 1995-10-26 Heraeus Gmbh W C Wäßriges Bad für die galvanische Abscheidung von Palladiumüberzügen, Verfahren der galvanischen Abscheidung sowie Verwendung des Bades
BR0207724A (pt) * 2001-02-28 2004-03-23 Wieland Dental & Technik Gmbh Banho para a eletrodeposição de ouro e ligas de ouro e o uso do mesmo

Also Published As

Publication number Publication date
DE60302074D1 (de) 2005-12-01
EP1520063B1 (de) 2005-10-26
ATE307918T1 (de) 2005-11-15
AU2003240347A1 (en) 2004-01-23
DE60302074T2 (de) 2006-07-13
WO2004005589A1 (fr) 2004-01-15
EP1378590A1 (de) 2004-01-07
EP1520063A1 (de) 2005-04-06

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