ATE309547T1 - Inspektionsverfahren und -vorrichtung durch sinterung - Google Patents

Inspektionsverfahren und -vorrichtung durch sinterung

Info

Publication number
ATE309547T1
ATE309547T1 AT01119644T AT01119644T ATE309547T1 AT E309547 T1 ATE309547 T1 AT E309547T1 AT 01119644 T AT01119644 T AT 01119644T AT 01119644 T AT01119644 T AT 01119644T AT E309547 T1 ATE309547 T1 AT E309547T1
Authority
AT
Austria
Prior art keywords
inspection method
inspection electrode
sintering
inspection
image
Prior art date
Application number
AT01119644T
Other languages
English (en)
Inventor
Shinji Iino
Kiyoshi Takekoshi
Tadatomo Suga
Toshihiro Itoh
Kenichi Kataoka
Original Assignee
Tokyo Electron Ltd
Tadatomo Suga
Toshihiro Itoh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26598157&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE309547(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Tokyo Electron Ltd, Tadatomo Suga, Toshihiro Itoh filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of ATE309547T1 publication Critical patent/ATE309547T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Pathology (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Molecular Biology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
AT01119644T 2000-08-21 2001-08-21 Inspektionsverfahren und -vorrichtung durch sinterung ATE309547T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000249702 2000-08-21
JP2001093303A JP4841737B2 (ja) 2000-08-21 2001-03-28 検査方法及び検査装置

Publications (1)

Publication Number Publication Date
ATE309547T1 true ATE309547T1 (de) 2005-11-15

Family

ID=26598157

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01119644T ATE309547T1 (de) 2000-08-21 2001-08-21 Inspektionsverfahren und -vorrichtung durch sinterung

Country Status (7)

Country Link
US (4) US6777967B2 (de)
EP (1) EP1182460B1 (de)
JP (1) JP4841737B2 (de)
KR (5) KR20020015294A (de)
AT (1) ATE309547T1 (de)
DE (1) DE60114730T2 (de)
TW (1) TW497194B (de)

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JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
JP2004265942A (ja) * 2003-02-20 2004-09-24 Okutekku:Kk プローブピンのゼロ点検出方法及びプローブ装置
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
JP2004319840A (ja) * 2003-04-17 2004-11-11 E-Beam Corp ウェハのチャキング装置およびチャキング方法
JP4387125B2 (ja) * 2003-06-09 2009-12-16 東京エレクトロン株式会社 検査方法及び検査装置
JP2005037199A (ja) * 2003-07-18 2005-02-10 Yamaha Corp プローブユニット、導通試験方法及びその製造方法
DE10355296B3 (de) * 2003-11-27 2005-06-09 Infineon Technologies Ag Testeinrichtung zum Wafertest von digitalen Halbleiterschaltungen
JP2006010572A (ja) * 2004-06-28 2006-01-12 Sharp Corp 電子部品の電気特性の測定方法およびその測定装置
US7084648B2 (en) * 2004-09-29 2006-08-01 Agere Systems Inc. Semiconductor testing
EP1870714A4 (de) * 2005-03-31 2010-05-19 Octec Inc Mikrostruktur-sondenkarte und mikrostruktur-untersuchungseinrichtung, verfahren und computerprogramm
JP4573794B2 (ja) * 2005-03-31 2010-11-04 東京エレクトロン株式会社 プローブカードおよび微小構造体の検査装置
JP2006319209A (ja) * 2005-05-13 2006-11-24 Tokyo Electron Ltd パワーデバイス用の検査装置
JP5011661B2 (ja) * 2005-06-03 2012-08-29 富士電機株式会社 半導体素子の試験方法
WO2007018186A1 (ja) * 2005-08-11 2007-02-15 Tokyo Electron Limited 微小構造体の検査装置，検査方法および検査プログラム
JP2007147575A (ja) * 2005-11-30 2007-06-14 Tokyo Electron Ltd ホイートストンブリッジの抵抗測定システム、抵抗測定回路、抵抗測定方法及びコンピュータプログラム
JP5048942B2 (ja) * 2005-12-06 2012-10-17 東京エレクトロン株式会社 プローブピン，プローブカード及びプローブ装置
JP5108238B2 (ja) * 2006-02-24 2012-12-26 東京エレクトロン株式会社 検査方法、検査装置及び制御プログラム
JP2008157818A (ja) * 2006-12-25 2008-07-10 Tokyo Electron Ltd 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP5020261B2 (ja) * 2006-12-27 2012-09-05 東京エレクトロン株式会社 検査方法、検査装置及びプログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP4664334B2 (ja) * 2007-07-20 2011-04-06 東京エレクトロン株式会社 検査方法
US8451015B2 (en) * 2009-07-30 2013-05-28 Medtronic, Inc. Method for making electrical test probe contacts
JP5089721B2 (ja) * 2010-03-24 2012-12-05 株式会社荏原製作所 ウェハのチャッキング装置およびチャッキング方法
DE102012109208B4 (de) 2012-09-28 2019-05-23 Osram Oled Gmbh Verfahren zum Bearbeiten einer Vorrichtung mit wenigstens einer elektrischen Schichtenstruktur und Bauelementanordnung hierfür
JP6155725B2 (ja) * 2013-03-19 2017-07-05 富士電機株式会社 半導体装置の検査方法及びその方法を用いた半導体装置の製造方法
JP6247055B2 (ja) * 2013-09-03 2017-12-13 株式会社富士通テレコムネットワークス福島 充放電試験装置
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法
EP3593151B1 (de) * 2017-03-07 2023-07-05 Capres A/S Sonde zum testen einer elektrischen eigenschaft einer testprobe
CN109239575B (zh) * 2018-08-01 2020-12-29 上海移远通信技术股份有限公司 一种检测装置、检测方法及自动化检测系统
CN110187255B (zh) * 2019-04-15 2021-10-15 上海华力集成电路制造有限公司 一种建立探针测试程式时确定过驱动量的方法
US12529724B2 (en) * 2023-05-19 2026-01-20 Fei Company Capacitance-based detection of probe contact

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Also Published As

Publication number Publication date
US7304489B2 (en) 2007-12-04
KR20100018603A (ko) 2010-02-17
US7061259B2 (en) 2006-06-13
US20040174177A1 (en) 2004-09-09
JP4841737B2 (ja) 2011-12-21
KR101132904B1 (ko) 2012-04-03
US20060192578A1 (en) 2006-08-31
KR20110004346A (ko) 2011-01-13
EP1182460A3 (de) 2003-08-20
KR20080077952A (ko) 2008-08-26
EP1182460A2 (de) 2002-02-27
DE60114730T2 (de) 2006-07-20
DE60114730D1 (de) 2005-12-15
KR20060066165A (ko) 2006-06-15
EP1182460B1 (de) 2005-11-09
US7319339B2 (en) 2008-01-15
US20020021142A1 (en) 2002-02-21
JP2002139542A (ja) 2002-05-17
KR20020015294A (ko) 2002-02-27
US6777967B2 (en) 2004-08-17
TW497194B (en) 2002-08-01
US20070229101A1 (en) 2007-10-04

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Legal Events

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