ATE311738T1 - Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine - Google Patents

Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine

Info

Publication number
ATE311738T1
ATE311738T1 AT01850159T AT01850159T ATE311738T1 AT E311738 T1 ATE311738 T1 AT E311738T1 AT 01850159 T AT01850159 T AT 01850159T AT 01850159 T AT01850159 T AT 01850159T AT E311738 T1 ATE311738 T1 AT E311738T1
Authority
AT
Austria
Prior art keywords
component
tape
guides
sub
tape guides
Prior art date
Application number
AT01850159T
Other languages
English (en)
Inventor
Johan Bergstroem
Maria Liljegren
Johan Skaborn
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Application granted granted Critical
Publication of ATE311738T1 publication Critical patent/ATE311738T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1994—Means for delaminating from release surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Package Frames And Binding Bands (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Die Bonding (AREA)
  • Looms (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Manipulator (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Seasonings (AREA)
AT01850159T 2001-09-19 2001-09-19 Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine ATE311738T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01850159A EP1298977B1 (de) 2001-09-19 2001-09-19 Verfahren zum Handhaben von Bauteilen an einer Bauteilbestückungsmaschine

Publications (1)

Publication Number Publication Date
ATE311738T1 true ATE311738T1 (de) 2005-12-15

Family

ID=8184888

Family Applications (2)

Application Number Title Priority Date Filing Date
AT05110622T ATE464780T1 (de) 2001-09-19 2001-09-19 Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern
AT01850159T ATE311738T1 (de) 2001-09-19 2001-09-19 Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT05110622T ATE464780T1 (de) 2001-09-19 2001-09-19 Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern

Country Status (7)

Country Link
US (2) US6773542B2 (de)
EP (3) EP1298977B1 (de)
JP (2) JP4205581B2 (de)
CN (2) CN1315363C (de)
AT (2) ATE464780T1 (de)
DE (2) DE60115447T2 (de)
WO (1) WO2003026374A2 (de)

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EP1381265B1 (de) * 1998-12-22 2007-08-01 Mydata Automation AB Bandführungsvorrichtung, Magazin und Systeme für eine Bauteilbestückungsmaschine
ATE360980T1 (de) 2003-11-07 2007-05-15 Mydata Automation Ab Ein verfahren und eine anlage zur aussetzung elektronischer bauteilen
DE60315663T2 (de) * 2003-11-10 2008-06-05 Mydata Automation Ab Aussetzungsvorrichtung und Bandführungsvorrichtung für eine Bauteilbestückungsmaschine
US7850040B2 (en) * 2006-10-23 2010-12-14 Hover-Davis, Inc. Component tape feeder
JP5650428B2 (ja) * 2010-04-01 2015-01-07 株式会社日立ハイテクインスツルメンツ 電子部品供給装置
JP5538123B2 (ja) * 2010-08-03 2014-07-02 株式会社日立ハイテクインスツルメンツ フィーダ及び電子部品装着装置
USD695635S1 (en) 2010-08-06 2013-12-17 Murata Manufacturing Co., Ltd. Carrier tape
JP5701067B2 (ja) * 2011-01-06 2015-04-15 富士機械製造株式会社 部品補給時の案内装置
JP5510354B2 (ja) * 2011-02-08 2014-06-04 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
JP5846629B2 (ja) * 2011-10-28 2016-01-20 富士機械製造株式会社 テープフィーダ
JP5846630B2 (ja) * 2011-11-01 2016-01-20 富士機械製造株式会社 テープフィーダ
WO2013127676A1 (en) * 2012-02-27 2013-09-06 Micronic Mydata AB A carrier arrangement, system and method for handling component tapes
US9669980B2 (en) * 2012-03-13 2017-06-06 Fuji Machine Mfg. Co., Ltd. Feeder management system of component mounting apparatus
JP5984461B2 (ja) * 2012-03-30 2016-09-06 ヤマハ発動機株式会社 部品供給ユニット
JP5981787B2 (ja) * 2012-06-29 2016-08-31 ヤマハ発動機株式会社 部品供給ユニット、電子部品装着装置
JP5965492B2 (ja) * 2012-09-28 2016-08-03 ヤマハ発動機株式会社 部品供給ユニット
JP6245517B2 (ja) * 2013-06-14 2017-12-13 パナソニックＩｐマネジメント株式会社 部品供給装置および部品供給方法
CN105519250B (zh) * 2013-08-26 2018-12-21 株式会社富士 供料器
KR101865619B1 (ko) * 2013-11-25 2018-07-04 한화에어로스페이스 주식회사 테이프 피더
WO2015097822A1 (ja) * 2013-12-26 2015-07-02 富士機械製造株式会社 フィーダ
KR20150094357A (ko) * 2014-02-11 2015-08-19 한화테크윈 주식회사 부품 공급 테이프, 이를 이용한 전자 부품 실장 장치 및 태그 인쇄 장치
US20150259099A1 (en) * 2014-03-12 2015-09-17 Edo Segal System and method for constructing 3d objects
JP6427756B2 (ja) * 2014-03-24 2018-11-28 パナソニックＩｐマネジメント株式会社 部品実装装置における部品露出機構の照合方法および照合システム
JP6427757B2 (ja) * 2014-03-24 2018-11-28 パナソニックＩｐマネジメント株式会社 部品露出機構の照合方法および照合システム
JP2014239264A (ja) * 2014-09-26 2014-12-18 富士機械製造株式会社 電子回路部品供給装置
JP6427003B2 (ja) * 2014-12-25 2018-11-21 ヤマハ発動機株式会社 電子部品供給装置、リール装置、及び部品収納テープの補給方法
US10712729B2 (en) * 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
JP6600185B2 (ja) * 2015-07-21 2019-10-30 株式会社Ｆｕｊｉ テープフィーダ
JP6219427B2 (ja) * 2016-03-10 2017-10-25 ヤマハ発動機株式会社 電子部品の装着方法及びその装着装置
CN108781527B (zh) * 2016-03-30 2020-06-23 雅马哈发动机株式会社 元件供给装置
US11445648B2 (en) * 2016-07-08 2022-09-13 Fuji Corporation Feeder
US10716248B2 (en) * 2016-10-14 2020-07-14 Yamaha Hatsudoki Kabushiki Kaisha Component supply device
WO2019011676A1 (en) * 2017-07-12 2019-01-17 Mycronic AB METHOD AND SYSTEM FOR AUTOMATICALLY ADJUSTING AN EXPOSURE ELEMENT FOR SEPARATING THE COVER OF A BAND OF COMPONENTS
DE112017007808T5 (de) * 2017-08-01 2020-06-10 Yamaha Hatsudoki Kabushiki Kaisha Verarbeitungsverfahren für ein vorderes Ende eines Bands, Vorrichtung zur Verarbeitung eines vorderen Endes eines Bands und Verarbeitungsvorrichtung für ein vorderes Ende eines Bands
US11375649B2 (en) 2017-08-01 2022-06-28 Yamaha Hatsudoki Kabushiki Kaisha Component supply device and component mounting machine using the same
JP6480560B2 (ja) * 2017-12-27 2019-03-13 株式会社Ｆｕｊｉ フィーダ、および部品実装装置
WO2020003388A1 (ja) * 2018-06-26 2020-01-02 株式会社Ｆｕｊｉ フィーダ
EP3860328B1 (de) * 2018-09-26 2024-04-24 Fuji Corporation Bandzuführer
EP3644701A1 (de) * 2018-10-23 2020-04-29 Mycronic AB Halterungsanordnung
JP6694980B2 (ja) * 2019-02-07 2020-05-20 株式会社Ｆｕｊｉ 部品実装装置
CN113396645B (zh) * 2019-02-08 2023-03-21 松下知识产权经营株式会社 部件供给装置

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JPS62144255U (de) * 1986-02-28 1987-09-11
JP2662948B2 (ja) * 1986-10-30 1997-10-15 ニツト− システム テクノロジ− インコ−ポレ−テツド チップテープのトップテープ除去装置
JPH07114319B2 (ja) * 1991-01-22 1995-12-06 松下電器産業株式会社 チップ形電子部品の供給装置
JP2714294B2 (ja) * 1991-12-19 1998-02-16 三洋電機株式会社 部品供給装置
JPH06232591A (ja) * 1993-02-05 1994-08-19 Sumitomo Electric Ind Ltd 自動実装機
JPH06302992A (ja) * 1993-04-14 1994-10-28 Toshiba Corp 部品実装機のカートリッジ構造及び部品実装機の管理システム
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
JP3935579B2 (ja) * 1997-10-29 2007-06-27 富士機械製造株式会社 カバーテープ送り装置，カバーテープ処理装置およびフィーダユニット
DE69923599T2 (de) * 1998-12-22 2006-03-23 Mydata Automation Ab Verfahren zur übertragung von bauteilträgerband-informationen zu einem bauteil-bestückungsapparat und vorrichtung dafür
EP1381265B1 (de) 1998-12-22 2007-08-01 Mydata Automation AB Bandführungsvorrichtung, Magazin und Systeme für eine Bauteilbestückungsmaschine
US6402452B1 (en) * 1999-04-26 2002-06-11 Hover-Davis, Inc. Carrier tape feeder with cover tape parting
US6619526B1 (en) 2000-01-26 2003-09-16 Tyco Electronics Logistics Ag High-speed tape feeder for pick and place machines
US6368045B1 (en) * 2000-04-05 2002-04-09 Delaware Capital Formation, Inc. Multiple index tape feeder and method

Also Published As

Publication number Publication date
EP1626618B1 (de) 2011-11-30
CN101018478B (zh) 2011-06-08
JP4205581B2 (ja) 2009-01-07
WO2003026374A3 (en) 2003-10-09
EP1626618A3 (de) 2008-04-30
JP2005503677A (ja) 2005-02-03
DE60115447D1 (de) 2006-01-05
EP1624742A2 (de) 2006-02-08
CN101018478A (zh) 2007-08-15
CN1557117A (zh) 2004-12-22
EP1624742B1 (de) 2010-04-14
EP1298977A1 (de) 2003-04-02
ATE464780T1 (de) 2010-04-15
EP1626618A2 (de) 2006-02-15
DE60115447T2 (de) 2006-06-14
EP1624742A3 (de) 2007-10-03
EP1298977B1 (de) 2005-11-30
US6773542B2 (en) 2004-08-10
CN1315363C (zh) 2007-05-09
US20050000650A1 (en) 2005-01-06
US20030051821A1 (en) 2003-03-20
US6948541B2 (en) 2005-09-27
JP2008288609A (ja) 2008-11-27
JP4463862B2 (ja) 2010-05-19
DE60141861D1 (de) 2010-05-27
WO2003026374A2 (en) 2003-03-27

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