ATE464780T1 - Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern - Google Patents

Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern

Info

Publication number
ATE464780T1
ATE464780T1 AT05110622T AT05110622T ATE464780T1 AT E464780 T1 ATE464780 T1 AT E464780T1 AT 05110622 T AT05110622 T AT 05110622T AT 05110622 T AT05110622 T AT 05110622T AT E464780 T1 ATE464780 T1 AT E464780T1
Authority
AT
Austria
Prior art keywords
component
tape
guides
sub
tape guides
Prior art date
Application number
AT05110622T
Other languages
English (en)
Inventor
Johan Bergstroem
Johan Skaborn
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Application granted granted Critical
Publication of ATE464780T1 publication Critical patent/ATE464780T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1994—Means for delaminating from release surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Package Frames And Binding Bands (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Die Bonding (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Seasonings (AREA)
  • Manipulator (AREA)
  • Looms (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
AT05110622T 2001-09-19 2001-09-19 Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern ATE464780T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01850159A EP1298977B1 (de) 2001-09-19 2001-09-19 Verfahren zum Handhaben von Bauteilen an einer Bauteilbestückungsmaschine

Publications (1)

Publication Number Publication Date
ATE464780T1 true ATE464780T1 (de) 2010-04-15

Family

ID=8184888

Family Applications (2)

Application Number Title Priority Date Filing Date
AT05110622T ATE464780T1 (de) 2001-09-19 2001-09-19 Bandführungsvorrichtung, anordnung und system zur führung von komponentenbändern
AT01850159T ATE311738T1 (de) 2001-09-19 2001-09-19 Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT01850159T ATE311738T1 (de) 2001-09-19 2001-09-19 Verfahren zum handhaben von bauteilen an einer bauteilbestückungsmaschine

Country Status (7)

Country Link
US (2) US6773542B2 (de)
EP (3) EP1626618B1 (de)
JP (2) JP4205581B2 (de)
CN (2) CN1315363C (de)
AT (2) ATE464780T1 (de)
DE (2) DE60115447T2 (de)
WO (1) WO2003026374A2 (de)

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DE60313464T2 (de) * 2003-11-07 2008-01-10 Mydata Automation Ab Ein Verfahren und eine Anlage zur Aussetzung elektronischer Bauteilen
ATE370640T1 (de) * 2003-11-10 2007-09-15 Mydata Automation Ab Aussetzungsvorrichtung und bandführungsvorrichtung für eine bauteilbestückungsmaschine
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JP5538123B2 (ja) * 2010-08-03 2014-07-02 株式会社日立ハイテクインスツルメンツ フィーダ及び電子部品装着装置
USD695635S1 (en) 2010-08-06 2013-12-17 Murata Manufacturing Co., Ltd. Carrier tape
JP5701067B2 (ja) * 2011-01-06 2015-04-15 富士機械製造株式会社 部品補給時の案内装置
JP5510354B2 (ja) * 2011-02-08 2014-06-04 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
JP5846629B2 (ja) * 2011-10-28 2016-01-20 富士機械製造株式会社 テープフィーダ
JP5846630B2 (ja) * 2011-11-01 2016-01-20 富士機械製造株式会社 テープフィーダ
CN104206049B (zh) * 2012-02-27 2017-10-13 麦克罗尼克迈达塔有限责任公司 用于处理部件带的承载器设备、系统和方法
US9669980B2 (en) * 2012-03-13 2017-06-06 Fuji Machine Mfg. Co., Ltd. Feeder management system of component mounting apparatus
JP5984461B2 (ja) * 2012-03-30 2016-09-06 ヤマハ発動機株式会社 部品供給ユニット
JP5981787B2 (ja) * 2012-06-29 2016-08-31 ヤマハ発動機株式会社 部品供給ユニット、電子部品装着装置
JP5965492B2 (ja) * 2012-09-28 2016-08-03 ヤマハ発動機株式会社 部品供給ユニット
JP6245517B2 (ja) * 2013-06-14 2017-12-13 パナソニックＩｐマネジメント株式会社 部品供給装置および部品供給方法
JP6271563B2 (ja) * 2013-08-26 2018-01-31 富士機械製造株式会社 フィーダ、および部品実装装置
KR101865619B1 (ko) * 2013-11-25 2018-07-04 한화에어로스페이스 주식회사 테이프 피더
JP6194017B2 (ja) * 2013-12-26 2017-09-06 富士機械製造株式会社 フィーダ
KR20150094357A (ko) * 2014-02-11 2015-08-19 한화테크윈 주식회사 부품 공급 테이프, 이를 이용한 전자 부품 실장 장치 및 태그 인쇄 장치
US10052858B2 (en) * 2014-03-12 2018-08-21 Edo Segal Interlocking object construction units
JP6427756B2 (ja) * 2014-03-24 2018-11-28 パナソニックＩｐマネジメント株式会社 部品実装装置における部品露出機構の照合方法および照合システム
JP6427757B2 (ja) * 2014-03-24 2018-11-28 パナソニックＩｐマネジメント株式会社 部品露出機構の照合方法および照合システム
JP2014239264A (ja) * 2014-09-26 2014-12-18 富士機械製造株式会社 電子回路部品供給装置
JP6427003B2 (ja) * 2014-12-25 2018-11-21 ヤマハ発動機株式会社 電子部品供給装置、リール装置、及び部品収納テープの補給方法
US10712729B2 (en) * 2015-04-09 2020-07-14 Panasonic Intellectual Property Management Co., Ltd. Setting support system for setting operational parameter
JP6600185B2 (ja) * 2015-07-21 2019-10-30 株式会社Ｆｕｊｉ テープフィーダ
JP6219427B2 (ja) * 2016-03-10 2017-10-25 ヤマハ発動機株式会社 電子部品の装着方法及びその装着装置
CN108781527B (zh) * 2016-03-30 2020-06-23 雅马哈发动机株式会社 元件供给装置
EP3484257B1 (de) * 2016-07-08 2022-03-23 Fuji Corporation Zuführer
US10716248B2 (en) * 2016-10-14 2020-07-14 Yamaha Hatsudoki Kabushiki Kaisha Component supply device
WO2019011676A1 (en) * 2017-07-12 2019-01-17 Mycronic AB METHOD AND SYSTEM FOR AUTOMATICALLY ADJUSTING AN EXPOSURE ELEMENT FOR SEPARATING THE COVER OF A BAND OF COMPONENTS
JP6824416B2 (ja) 2017-08-01 2021-02-03 ヤマハ発動機株式会社 部品供給装置及びこれを備えた部品実装機
CN110832961B (zh) * 2017-08-01 2021-04-27 雅马哈发动机株式会社 料带远端处理方法和料带远端处理用夹具以及料带远端处理装置
JP6480560B2 (ja) * 2017-12-27 2019-03-13 株式会社Ｆｕｊｉ フィーダ、および部品実装装置
JP6960057B2 (ja) * 2018-06-26 2021-11-05 株式会社Fuji フィーダ
WO2020065754A1 (ja) * 2018-09-26 2020-04-02 株式会社Ｆｕｊｉ テープフィーダ
EP3644701A1 (de) * 2018-10-23 2020-04-29 Mycronic AB Halterungsanordnung
JP6694980B2 (ja) * 2019-02-07 2020-05-20 株式会社Ｆｕｊｉ 部品実装装置
JP7170190B2 (ja) * 2019-02-08 2022-11-14 パナソニックＩｐマネジメント株式会社 部品供給装置

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Also Published As

Publication number Publication date
JP2005503677A (ja) 2005-02-03
EP1626618B1 (de) 2011-11-30
CN101018478A (zh) 2007-08-15
JP2008288609A (ja) 2008-11-27
EP1626618A3 (de) 2008-04-30
JP4463862B2 (ja) 2010-05-19
EP1298977B1 (de) 2005-11-30
CN1557117A (zh) 2004-12-22
US6948541B2 (en) 2005-09-27
EP1626618A2 (de) 2006-02-15
DE60141861D1 (de) 2010-05-27
US20050000650A1 (en) 2005-01-06
CN1315363C (zh) 2007-05-09
ATE311738T1 (de) 2005-12-15
US20030051821A1 (en) 2003-03-20
CN101018478B (zh) 2011-06-08
DE60115447D1 (de) 2006-01-05
US6773542B2 (en) 2004-08-10
WO2003026374A2 (en) 2003-03-27
EP1624742A3 (de) 2007-10-03
DE60115447T2 (de) 2006-06-14
EP1298977A1 (de) 2003-04-02
JP4205581B2 (ja) 2009-01-07
EP1624742A2 (de) 2006-02-08
WO2003026374A3 (en) 2003-10-09
EP1624742B1 (de) 2010-04-14

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