ATE316988T1 - Elektrisch leitfähige silikonkautschukzusammensetzung - Google Patents
Elektrisch leitfähige silikonkautschukzusammensetzungInfo
- Publication number
- ATE316988T1 ATE316988T1 AT03745402T AT03745402T ATE316988T1 AT E316988 T1 ATE316988 T1 AT E316988T1 AT 03745402 T AT03745402 T AT 03745402T AT 03745402 T AT03745402 T AT 03745402T AT E316988 T1 ATE316988 T1 AT E316988T1
- Authority
- AT
- Austria
- Prior art keywords
- weight
- parts
- electrically conductive
- silicone rubber
- rubber composition
- Prior art date
Links
- 229920002379 silicone rubber Polymers 0.000 title abstract 3
- 239000004945 silicone rubber Substances 0.000 title abstract 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000011231 conductive filler Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002101146A JP3999994B2 (ja) | 2002-04-03 | 2002-04-03 | 導電性シリコーンゴム組成物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE316988T1 true ATE316988T1 (de) | 2006-02-15 |
Family
ID=28672097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03745402T ATE316988T1 (de) | 2002-04-03 | 2003-03-03 | Elektrisch leitfähige silikonkautschukzusammensetzung |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7537712B2 (de) |
| EP (1) | EP1490437B1 (de) |
| JP (1) | JP3999994B2 (de) |
| KR (1) | KR100987915B1 (de) |
| CN (1) | CN1276028C (de) |
| AT (1) | ATE316988T1 (de) |
| AU (1) | AU2003210007A1 (de) |
| DE (1) | DE60303451T2 (de) |
| TW (1) | TWI318228B (de) |
| WO (1) | WO2003082983A1 (de) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7393547B2 (en) * | 2001-04-11 | 2008-07-01 | Helix Medical, Llc | Antimicrobial elastomer composition and method for making |
| US7520897B2 (en) | 2001-04-11 | 2009-04-21 | Helix Medical, Llc | Medical devices having antimicrobial properties |
| US8317861B2 (en) | 2001-04-11 | 2012-11-27 | Helix Medical, Llc | Antimicrobial indwelling voice prosthesis |
| JP2004031203A (ja) * | 2002-06-27 | 2004-01-29 | Shin Etsu Polymer Co Ltd | 導電接点素子及び電気コネクタ |
| JP3846575B2 (ja) * | 2002-06-27 | 2006-11-15 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
| JP3686649B2 (ja) * | 2002-11-07 | 2005-08-24 | 北川工業株式会社 | 導電性熱伝導シート及びその製造方法 |
| ES2287749T3 (es) * | 2003-08-08 | 2007-12-16 | Sumitomo Electric Industries, Ltd. | Pastas electricamente conductoras. |
| JP4803350B2 (ja) * | 2005-06-03 | 2011-10-26 | 信越化学工業株式会社 | 圧着性異方導電性樹脂組成物及び微細電極の接続方法 |
| US20070131912A1 (en) * | 2005-07-08 | 2007-06-14 | Simone Davide L | Electrically conductive adhesives |
| JP4839041B2 (ja) | 2005-08-29 | 2011-12-14 | 東レ・ダウコーニング株式会社 | 絶縁性液状ダイボンディング剤および半導体装置 |
| US7309734B2 (en) * | 2005-09-30 | 2007-12-18 | Industrial Control Development, Inc. | Silicone-coated architectural glass |
| US7850116B2 (en) * | 2006-05-26 | 2010-12-14 | The Boeing Company | Ducted open rotor apparatus and method |
| KR100774440B1 (ko) * | 2007-01-17 | 2007-11-08 | 조인셋 주식회사 | 전도성 점착테이프 |
| JP5864828B2 (ja) * | 2007-08-31 | 2016-02-17 | 東レ・ダウコーニング株式会社 | シリコーンゴムパウダーおよびその製造方法 |
| US8044330B2 (en) | 2008-01-17 | 2011-10-25 | E.I. Du Pont De Nemours And Company | Electrically conductive adhesive |
| JP4656340B2 (ja) * | 2008-03-03 | 2011-03-23 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| JP5539688B2 (ja) * | 2009-09-14 | 2014-07-02 | 東レ・ダウコーニング株式会社 | エマルジョン、その製造方法、およびシリコーンオイル組成物 |
| CA2785459A1 (en) * | 2009-12-29 | 2011-07-28 | Saint-Gobain Performance Plastics Corporation | A flexible tubing material and method of forming the material |
| CN102250472B (zh) * | 2011-05-18 | 2013-07-24 | 杨福河 | 一种高性能硅基导电橡胶及其制备方法 |
| CN102153869B (zh) * | 2011-05-18 | 2012-08-15 | 天津大学 | 低密度高强度导电橡胶及其制备方法 |
| JP5621819B2 (ja) * | 2011-12-20 | 2014-11-12 | Jsr株式会社 | 硬化性組成物、硬化物および光半導体装置 |
| CN102604388B (zh) * | 2012-03-22 | 2013-11-13 | 北京化工大学 | 一种低压缩变形高导电橡胶复合材料及其制备方法 |
| JP2015520264A (ja) | 2012-06-06 | 2015-07-16 | サン−ゴバン パフォーマンス プラスティックス コーポレイション | 熱可塑性エラストマーチューブ材料ならびにこれを製造および使用する方法 |
| US20150189867A1 (en) * | 2012-06-22 | 2015-07-09 | Dow Corning Corporation | Silver-Loaded Microparticles and Loading of Same Into Silicones |
| JP5321723B1 (ja) * | 2012-10-29 | 2013-10-23 | 横浜ゴム株式会社 | 導電性組成物および太陽電池セル |
| JP2014201627A (ja) * | 2013-04-02 | 2014-10-27 | 三菱化学株式会社 | 熱硬化性シリコーン樹脂組成物、シリコーン樹脂成形体の製造方法、およびシリコーン樹脂成形体 |
| JP5943485B2 (ja) * | 2013-05-09 | 2016-07-05 | 信越化学工業株式会社 | シリコーンエラストマー粒子および該シリコーンエラストマー粒子を含む水分散液 |
| KR101640218B1 (ko) * | 2014-06-26 | 2016-07-18 | 파낙스 이텍(주) | 전도성 실리콘 수지 조성물 및 이로부터 제조된 전자파 차폐용 가스켓 |
| JP6437873B2 (ja) * | 2015-04-15 | 2018-12-12 | 信越ポリマー株式会社 | 押出成形品及びその製造方法並びに押出成形用成形原料及びその製造方法 |
| JP6610491B2 (ja) * | 2016-10-03 | 2019-11-27 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| KR102203924B1 (ko) * | 2016-10-31 | 2021-01-18 | 다우 도레이 캄파니 리미티드 | 1액 경화형 열 전도성 실리콘 그리스 조성물 및 전자/전장 부품 |
| EP3952026A4 (de) * | 2019-03-29 | 2022-12-21 | Sekisui Polymatech Co., Ltd. | Elektrisches verbindungselement und an der klemme befestigte glasplattenstruktur |
| WO2020218520A1 (ja) | 2019-04-26 | 2020-10-29 | 積水ポリマテック株式会社 | 電気接続部材、及び端子付きガラス板構造 |
| EP4045135A1 (de) * | 2019-10-14 | 2022-08-24 | Ecole Polytechnique Fédérale de Lausanne (EPFL) | Hybrides weich-starres elektrisches verbindungssystem |
| US20210249150A1 (en) * | 2020-02-11 | 2021-08-12 | TE Connectivity Services Gmbh | Elastomeric Conductive Composite Interconnect |
| CN112852342B (zh) * | 2021-01-08 | 2021-09-28 | 深圳市维美德材料科技有限公司 | 一种用于5g频谱的超软导电胶及其制备方法 |
| CN114058326B (zh) * | 2021-11-22 | 2023-05-23 | 烟台德邦科技股份有限公司 | 一种粘接及可靠性优异的有机聚硅氧烷组合物及其制备方法 |
| DE102022205565A1 (de) | 2022-06-01 | 2023-12-07 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Heizelements und Heizelement |
| WO2024057911A1 (ja) * | 2022-09-16 | 2024-03-21 | 三井化学株式会社 | 導電性シリコーンゴム組成物及び異方導電性シート |
| US12300888B2 (en) | 2023-02-02 | 2025-05-13 | Microsonic, Inc. | System and method for attenuating radiation emissions from earpiece devices |
| CN116102890B (zh) * | 2023-02-09 | 2024-08-13 | 广州回天新材料有限公司 | 一种有机硅橡胶组合物及其制备方法 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5945356A (ja) * | 1982-09-08 | 1984-03-14 | Toray Silicone Co Ltd | 導電性シリコ−ンゴム組成物 |
| JPS62243621A (ja) * | 1986-04-17 | 1987-10-24 | Toray Silicone Co Ltd | シリコ−ンゴム粒状物の製造方法 |
| JPS62257939A (ja) * | 1986-05-02 | 1987-11-10 | Shin Etsu Chem Co Ltd | シリコ−ンエラストマ−球状微粉末の製造方法 |
| US4766176A (en) * | 1987-07-20 | 1988-08-23 | Dow Corning Corporation | Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts |
| JPH0674332B2 (ja) * | 1987-08-27 | 1994-09-21 | 東レ・ダウコーニング・シリコーン株式会社 | シリコ−ンゴム粒状物およびその製造方法 |
| GB2222171B (en) * | 1988-06-17 | 1992-01-29 | Shinetsu Polymer Co | Method for the preparation of an integral rubber article having electrically insulating and conductive parts |
| JPH02102263A (ja) * | 1988-10-11 | 1990-04-13 | Shin Etsu Chem Co Ltd | 導電性シリコーンゴム組成物 |
| JP2808296B2 (ja) * | 1989-02-28 | 1998-10-08 | 東芝シリコーン株式会社 | プライマー組成物 |
| JPH0791464B2 (ja) * | 1989-10-31 | 1995-10-04 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物およびその硬化物 |
| JP2974700B2 (ja) * | 1989-11-30 | 1999-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性接着剤 |
| US5182318A (en) * | 1991-01-10 | 1993-01-26 | Savin Roland R | Coating composition containing metal-coated microspheres exhibiting improved resistance to environmental attack of metallic substrates |
| US5371139A (en) * | 1991-06-21 | 1994-12-06 | Dow Corning Toray Silicone Co., Ltd. | Silicone rubber microsuspension and method for its preparation |
| JP2787737B2 (ja) * | 1991-06-28 | 1998-08-20 | 東レ・ダウコーニング・シリコーン 株式会社 | 水性塗料組成物の製造方法 |
| DE9201910U1 (de) * | 1992-02-14 | 1992-06-11 | Siemens AG, 8000 München | Schaltungsanordnung zum Regeln der Frequenz der von einem Quarzoszillator abgegebenen Oszillatortaktsignale |
| JP2894526B2 (ja) * | 1992-02-28 | 1999-05-24 | 東レ・ダウコーニング・シリコーン 株式会社 | ロール用導電性シリコーンゴム組成物 |
| JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
| JP2897098B2 (ja) * | 1993-06-30 | 1999-05-31 | 信越化学工業株式会社 | シリコーンゴム組成物 |
| ES2113023T3 (es) * | 1993-10-06 | 1998-04-16 | Dow Corning Toray Silicone | Composiciones organosiloxanos electroconductoras cargadas de plata. |
| JP2832143B2 (ja) * | 1993-12-28 | 1998-12-02 | 信越化学工業株式会社 | シリコーン微粒子およびその製造方法 |
| JP2907000B2 (ja) * | 1994-04-27 | 1999-06-21 | 信越化学工業株式会社 | 導電性シリコーンゴム発泡組成物及び導電性スポンジロール |
| US5837793A (en) * | 1996-03-22 | 1998-11-17 | Dow Corning Toray Silicone Co., Ltd. | Silicone rubber powder and method for the preparation thereof |
| JP3607430B2 (ja) * | 1996-08-28 | 2005-01-05 | 東レ・ダウコーニング・シリコーン株式会社 | 粉状シリコーン硬化物の製造方法 |
| JP3576748B2 (ja) * | 1997-04-30 | 2004-10-13 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化シリコーン粉末の製造方法 |
| TWI222455B (en) * | 1998-02-13 | 2004-10-21 | Kanegafuchi Chemical Ind | Aqueous emulsion containing silicone rubber particles and process for preparing the same |
| US6017587A (en) * | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
| TWI257410B (en) * | 1999-03-25 | 2006-07-01 | Shinetsu Chemical Co | Conductive silicone rubber composition and low-resistance connector |
| JP2001131415A (ja) * | 1999-07-19 | 2001-05-15 | Dow Corning Toray Silicone Co Ltd | シリコーンゴムスポンジ形成性組成物、シリコーンゴムスポンジおよびシリコーンゴムスポンジの製造方法 |
| JP3603945B2 (ja) * | 1999-10-06 | 2004-12-22 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
| JP4727017B2 (ja) * | 1999-11-15 | 2011-07-20 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| US6281279B1 (en) * | 1999-12-30 | 2001-08-28 | Nex Press Solutions Llc | Method for producing micron sized silicone rubber particles |
| JP3922332B2 (ja) * | 2000-01-17 | 2007-05-30 | 信越化学工業株式会社 | 導電性液状シリコーンゴム組成物 |
| JP4469052B2 (ja) | 2000-02-29 | 2010-05-26 | 東レ・ダウコーニング株式会社 | 架橋シリコーン粒子の製造方法 |
| US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
| JP3705344B2 (ja) * | 2000-08-17 | 2005-10-12 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
-
2002
- 2002-04-03 JP JP2002101146A patent/JP3999994B2/ja not_active Expired - Lifetime
-
2003
- 2003-03-03 US US10/509,267 patent/US7537712B2/en not_active Expired - Lifetime
- 2003-03-03 CN CNB038098970A patent/CN1276028C/zh not_active Expired - Lifetime
- 2003-03-03 EP EP03745402A patent/EP1490437B1/de not_active Expired - Lifetime
- 2003-03-03 WO PCT/JP2003/002444 patent/WO2003082983A1/en not_active Ceased
- 2003-03-03 AT AT03745402T patent/ATE316988T1/de not_active IP Right Cessation
- 2003-03-03 DE DE60303451T patent/DE60303451T2/de not_active Expired - Lifetime
- 2003-03-03 KR KR1020047015699A patent/KR100987915B1/ko not_active Expired - Lifetime
- 2003-03-03 AU AU2003210007A patent/AU2003210007A1/en not_active Abandoned
- 2003-04-03 TW TW092107625A patent/TWI318228B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE60303451T2 (de) | 2006-09-14 |
| DE60303451D1 (de) | 2006-04-13 |
| AU2003210007A1 (en) | 2003-10-13 |
| EP1490437A1 (de) | 2004-12-29 |
| US7537712B2 (en) | 2009-05-26 |
| TWI318228B (en) | 2009-12-11 |
| KR20050006138A (ko) | 2005-01-15 |
| US20050239940A1 (en) | 2005-10-27 |
| WO2003082983A1 (en) | 2003-10-09 |
| EP1490437B1 (de) | 2006-02-01 |
| JP2003292781A (ja) | 2003-10-15 |
| JP3999994B2 (ja) | 2007-10-31 |
| KR100987915B1 (ko) | 2010-10-18 |
| TW200401008A (en) | 2004-01-16 |
| CN1649963A (zh) | 2005-08-03 |
| CN1276028C (zh) | 2006-09-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |