ATE320460T1 - Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen - Google Patents

Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen

Info

Publication number
ATE320460T1
ATE320460T1 AT98937187T AT98937187T ATE320460T1 AT E320460 T1 ATE320460 T1 AT E320460T1 AT 98937187 T AT98937187 T AT 98937187T AT 98937187 T AT98937187 T AT 98937187T AT E320460 T1 ATE320460 T1 AT E320460T1
Authority
AT
Austria
Prior art keywords
component
semiconductor device
home
resin compositions
circuit board
Prior art date
Application number
AT98937187T
Other languages
English (en)
Inventor
Mark Konarski
Zbigniew A Szczepaniak
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE320460T1 publication Critical patent/ATE320460T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT98937187T 1997-07-24 1998-07-22 Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen ATE320460T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5359297P 1997-07-24 1997-07-24

Publications (1)

Publication Number Publication Date
ATE320460T1 true ATE320460T1 (de) 2006-04-15

Family

ID=21985312

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98937187T ATE320460T1 (de) 1997-07-24 1998-07-22 Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen

Country Status (13)

Country Link
US (1) US6342577B1 (de)
EP (1) EP0929592B1 (de)
JP (1) JP2001506313A (de)
KR (1) KR100571334B1 (de)
CN (1) CN1197893C (de)
AT (1) ATE320460T1 (de)
AU (1) AU728193B2 (de)
BR (1) BR9806065A (de)
CA (1) CA2266314A1 (de)
DE (1) DE69833865T2 (de)
ID (1) ID21928A (de)
RU (1) RU2195474C2 (de)
WO (1) WO1999005196A1 (de)

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US6617399B2 (en) * 1999-12-17 2003-09-09 Henkel Loctite Corporation Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners
US20050288458A1 (en) 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
JP3711842B2 (ja) * 2000-06-01 2005-11-02 ソニーケミカル株式会社 異方性導電接続材料及び接続構造体
US6548575B2 (en) 2000-12-13 2003-04-15 National Starch And Chemical Investment Holding Corporation High temperature underfilling material with low exotherm during use
JP3566680B2 (ja) * 2001-09-11 2004-09-15 富士通株式会社 半導体装置の製造方法
JP3866591B2 (ja) * 2001-10-29 2007-01-10 富士通株式会社 電極間接続構造体の形成方法および電極間接続構造体
US6893736B2 (en) * 2001-11-19 2005-05-17 Henkel Corporation Thermosetting resin compositions useful as underfill sealants
US6951907B1 (en) 2001-11-19 2005-10-04 Henkel Corporation Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex
US6833629B2 (en) 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
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RU2320040C1 (ru) * 2006-10-13 2008-03-20 ЗАО "Электроизолит" Электроизоляционный пропиточный лак
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US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
US20130101863A1 (en) * 2010-04-21 2013-04-25 Mitsubishi Gas Chemical Company, Inc. Heat curable composition
RU2447093C1 (ru) * 2011-01-19 2012-04-10 Открытое акционерное общество "Институт пластмасс имени Г.С. Петрова" Способ получения орто-крезолноволачной эпоксидной смолы и полимерная композиция на ее основе
CN102559119A (zh) * 2011-12-13 2012-07-11 北京海斯迪克新材料有限公司 一种具有良好流变稳定性的单组份环氧包封胶及制备方法
RU2492549C1 (ru) * 2012-03-20 2013-09-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) Способ сборки трехмерного электронного модуля
TWI568764B (zh) * 2012-06-08 2017-02-01 Adeka股份有限公司 硬化性樹脂組成物、樹脂組成物、使用此等而成之樹脂片、及此等之硬化物
JP6202857B2 (ja) 2013-04-02 2017-09-27 株式会社東芝 電気機器用コーティング材
RU2597916C2 (ru) * 2014-11-18 2016-09-20 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Полимерный матричный материал для кондиционирования низко- и среднеактивных отработанных ионообменных смол
JP6710434B2 (ja) 2015-03-31 2020-06-17 三菱瓦斯化学株式会社 シアン酸エステル化合物、該化合物を含む硬化性樹脂組成物及びその硬化物
CN105356479B (zh) * 2015-11-13 2017-12-08 湖南大学 一种c型串联滤波式级联svg及其负序补偿控制方法
KR102246076B1 (ko) * 2015-11-17 2021-05-03 한국전자통신연구원 반도체 패키지의 제조 방법
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Also Published As

Publication number Publication date
DE69833865D1 (de) 2006-05-11
AU728193B2 (en) 2001-01-04
CN1237186A (zh) 1999-12-01
AU8595998A (en) 1999-02-16
CA2266314A1 (en) 1999-02-04
BR9806065A (pt) 1999-08-31
WO1999005196A1 (en) 1999-02-04
JP2001506313A (ja) 2001-05-15
EP0929592B1 (de) 2006-03-15
RU2195474C2 (ru) 2002-12-27
EP0929592A4 (de) 2000-09-13
KR20000068623A (ko) 2000-11-25
DE69833865T2 (de) 2006-10-05
ID21928A (id) 1999-08-12
KR100571334B1 (ko) 2006-04-14
US6342577B1 (en) 2002-01-29
CN1197893C (zh) 2005-04-20
EP0929592A1 (de) 1999-07-21

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