ATE321438T1 - Elektronischer schaltungsmodul und verfahren zu dessen bestückung - Google Patents

Elektronischer schaltungsmodul und verfahren zu dessen bestückung

Info

Publication number
ATE321438T1
ATE321438T1 AT02790654T AT02790654T ATE321438T1 AT E321438 T1 ATE321438 T1 AT E321438T1 AT 02790654 T AT02790654 T AT 02790654T AT 02790654 T AT02790654 T AT 02790654T AT E321438 T1 ATE321438 T1 AT E321438T1
Authority
AT
Austria
Prior art keywords
circuit module
boat
electronic circuit
equipping
baseplate
Prior art date
Application number
AT02790654T
Other languages
English (en)
Inventor
Reinhold Schmitt
Willibald Konrath
Klaus Scholl
Original Assignee
Marconi Comm Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Comm Gmbh filed Critical Marconi Comm Gmbh
Application granted granted Critical
Publication of ATE321438T1 publication Critical patent/ATE321438T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Credit Cards Or The Like (AREA)
  • Automatic Assembly (AREA)
AT02790654T 2001-12-06 2002-12-06 Elektronischer schaltungsmodul und verfahren zu dessen bestückung ATE321438T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10160041A DE10160041A1 (de) 2001-12-06 2001-12-06 Elektronisches Schaltungsmodul und Verfahren zu dessen Montage

Publications (1)

Publication Number Publication Date
ATE321438T1 true ATE321438T1 (de) 2006-04-15

Family

ID=7708313

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02790654T ATE321438T1 (de) 2001-12-06 2002-12-06 Elektronischer schaltungsmodul und verfahren zu dessen bestückung

Country Status (7)

Country Link
US (2) US20050128692A1 (de)
EP (1) EP1464211B8 (de)
CN (1) CN100475000C (de)
AT (1) ATE321438T1 (de)
AU (1) AU2002365778A1 (de)
DE (2) DE10160041A1 (de)
WO (1) WO2003049513A1 (de)

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DE10327767A1 (de) * 2003-06-18 2005-01-05 Marconi Communications Gmbh Schaltungsbaugruppe und Herstellungsverfahren dafür
DE102006021569A1 (de) * 2006-02-09 2007-08-16 Rohde & Schwarz Gmbh & Co. Kg Prüfsystem für einen Schaltungsträger
USD570307S1 (en) * 2006-11-30 2008-06-03 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD576577S1 (en) * 2006-11-30 2008-09-09 Kabushiki Kaisha Toshiba Portion of a printed circuit board
USD597504S1 (en) * 2006-11-30 2009-08-04 Kabushiki Kaisha Toshiba Portion of a printed circuit board
CA144822S (en) * 2011-10-27 2012-11-15 Sumitomo Electric Industries Semiconductor module for power conversion
USD693444S1 (en) * 2011-12-05 2013-11-12 Cps Technologies Corp Bowed baseplate for heat generating device
USD693913S1 (en) * 2011-12-05 2013-11-19 Cps Technologies Corp Bowed baseplate for heat generating device
USD693445S1 (en) * 2011-12-05 2013-11-12 Cps Technologies Corp Bowed baseplate for heat generating device
EP2635097B1 (de) * 2012-02-28 2021-07-07 Electrolux Home Products Corporation N.V. Elektrischer und/oder elektronischer Schaltkreis mit Leiterplatte, einer separaten Leiterplatte und einem Netzanschluss
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
US8872328B2 (en) * 2012-12-19 2014-10-28 General Electric Company Integrated power module package
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
TWD189065S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD190983S (zh) * 2017-02-17 2018-06-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189071S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189070S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189067S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189066S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189069S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189068S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
USD894018S1 (en) 2017-05-31 2020-08-25 D6 Inc. Container
USD848383S1 (en) * 2017-07-13 2019-05-14 Fat Shark Technology SEZC Printed circuit board
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
AU201815958S (en) * 2018-04-09 2018-11-06 Samsung Electronics Co Ltd SSD Storage Device
USD915310S1 (en) * 2019-02-12 2021-04-06 Analog Devices, Inc. Circuit board
USD918836S1 (en) * 2019-06-17 2021-05-11 Sang Hoon Shin Ionizing coil frame locating ribs
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board
USD1087043S1 (en) * 2022-09-06 2025-08-05 Marvell Asia Pte. Ltd. Integrated circuit substrate
US20250008656A1 (en) * 2023-06-27 2025-01-02 Meta Platforms Technologies, Llc Wire bonding for miniaturizing printed circuit interconnection

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DE3113031A1 (de) * 1981-04-01 1982-10-21 Hagenuk GmbH, 2300 Kiel "handhabungsvorrichtung fuer leiterplatten"
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
US5044615A (en) * 1991-02-08 1991-09-03 International Business Machines Corporation Dual purpose work board holder
US5142239A (en) * 1991-05-20 1992-08-25 Motorola, Inc. High frequency linear amplifier assembly
US6219908B1 (en) * 1991-06-04 2001-04-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
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US5479694A (en) * 1993-04-13 1996-01-02 Micron Technology, Inc. Method for mounting integrated circuits onto printed circuit boards and testing
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
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JP3225457B2 (ja) * 1995-02-28 2001-11-05 株式会社日立製作所 半導体装置
DE19511486A1 (de) * 1995-03-29 1996-10-02 Bosch Gmbh Robert Verfahren zur Herstellung einer Leiterplattenanordnung
JP2001244279A (ja) * 2000-02-25 2001-09-07 Nec Niigata Ltd 基板の供給方法、基板供給装置、チップ供給装置およびチップ実装装置
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JP2004119637A (ja) * 2002-09-25 2004-04-15 Fuji Mach Mfg Co Ltd 電子部品実装方法、電子部品実装装置および電子部品実装プログラム

Also Published As

Publication number Publication date
AU2002365778A1 (en) 2003-06-17
US20070294889A1 (en) 2007-12-27
US20050128692A1 (en) 2005-06-16
CN100475000C (zh) 2009-04-01
DE60210135D1 (de) 2006-05-11
EP1464211B8 (de) 2006-08-16
EP1464211A1 (de) 2004-10-06
CN1618261A (zh) 2005-05-18
DE10160041A1 (de) 2003-09-25
DE60210135T2 (de) 2007-04-12
WO2003049513A1 (en) 2003-06-12
EP1464211B1 (de) 2006-03-22

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties