ATE325525T1 - Sockel und bauelement mit einer verbindungsschiene in den starkstrom- und erdleitungen zur erhöhung der stromtragfähigkeit, die eine höhere ic-stromversorgung ermöglicht - Google Patents

Sockel und bauelement mit einer verbindungsschiene in den starkstrom- und erdleitungen zur erhöhung der stromtragfähigkeit, die eine höhere ic-stromversorgung ermöglicht

Info

Publication number
ATE325525T1
ATE325525T1 AT01273029T AT01273029T ATE325525T1 AT E325525 T1 ATE325525 T1 AT E325525T1 AT 01273029 T AT01273029 T AT 01273029T AT 01273029 T AT01273029 T AT 01273029T AT E325525 T1 ATE325525 T1 AT E325525T1
Authority
AT
Austria
Prior art keywords
power
allowing
increase
component
base
Prior art date
Application number
AT01273029T
Other languages
English (en)
Inventor
Hong Xie
Brent S Stone
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE325525T1 publication Critical patent/ATE325525T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connecting Device With Holders (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Generation Of Surge Voltage And Current (AREA)
AT01273029T 2000-12-30 2001-11-27 Sockel und bauelement mit einer verbindungsschiene in den starkstrom- und erdleitungen zur erhöhung der stromtragfähigkeit, die eine höhere ic-stromversorgung ermöglicht ATE325525T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/753,327 US6992378B2 (en) 2000-12-30 2000-12-30 Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery

Publications (1)

Publication Number Publication Date
ATE325525T1 true ATE325525T1 (de) 2006-06-15

Family

ID=25030175

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01273029T ATE325525T1 (de) 2000-12-30 2001-11-27 Sockel und bauelement mit einer verbindungsschiene in den starkstrom- und erdleitungen zur erhöhung der stromtragfähigkeit, die eine höhere ic-stromversorgung ermöglicht

Country Status (10)

Country Link
US (2) US6992378B2 (de)
EP (1) EP1346618B1 (de)
JP (1) JP4122227B2 (de)
KR (1) KR100552453B1 (de)
CN (2) CN100411257C (de)
AT (1) ATE325525T1 (de)
AU (1) AU2002217955A1 (de)
DE (1) DE60119377T2 (de)
MY (1) MY130461A (de)
WO (1) WO2002054487A2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6992378B2 (en) * 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US6575766B1 (en) * 2002-02-26 2003-06-10 Intel Corporation Laminated socket contacts
US6979208B2 (en) 2002-12-19 2005-12-27 Intel Corporation Laminated socket contacts
US6969270B2 (en) * 2003-06-26 2005-11-29 Intel Corporation Integrated socket and cable connector
EP2158642A1 (de) * 2007-06-18 2010-03-03 Tyco Electronics Nederland B.V. Verbinder zum verbinden von oberflächenanbringungsbauelementen und schaltungssubstraten
GB2454228B (en) 2007-11-01 2011-08-03 Rapro Emulations Ltd Shower head and shower apparatus
US20140187058A1 (en) * 2012-12-27 2014-07-03 Hongfei Yan Modular Multiple Piece Socket For Enhanced Thermal Management
US10741945B2 (en) * 2013-08-26 2020-08-11 Fci Usa Llc Replacement electrical connectors
JP6247520B2 (ja) * 2013-12-12 2017-12-13 日本航空電子工業株式会社 薄型コネクタ
CN118689290B (zh) * 2023-03-23 2025-10-31 台达电子企业管理（上海）有限公司 供电装置、负载及电子设备
US12610453B2 (en) 2020-01-08 2026-04-21 Delta Electronics (Shanghai) Co., Ltd. Vertical power supply system and manufacturing method of connection board

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3582865A (en) * 1969-12-16 1971-06-01 Ibm Microcircuit module and connector
US4035046A (en) * 1976-01-15 1977-07-12 Amp Incorporated Miniature electrical connector for parallel panel members
JPS582054A (ja) * 1981-06-26 1983-01-07 Fujitsu Ltd 半導体装置
FR2552590B1 (fr) * 1983-09-23 1986-03-28 Nalbanti Georges Support de boitier de circuit integre
US4630875A (en) * 1984-07-02 1986-12-23 Amp Incorporated Chip carrier socket which requires low insertion force for the chip carrier
US4814857A (en) * 1987-02-25 1989-03-21 International Business Machines Corporation Circuit module with separate signal and power connectors
JPS63280432A (ja) * 1987-05-12 1988-11-17 Fujitsu Ltd Ｉｃパツケ−ジ
US5043845A (en) * 1989-10-16 1991-08-27 Eastman Kodak Company High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact
JPH04236480A (ja) * 1991-01-21 1992-08-25 Seiko Epson Corp 半導体パッケージのソルダレス実装接合構造及びその半導体パッケージ
US5158470A (en) * 1991-05-23 1992-10-27 Amp Incorporated Solderless system for retention and connection of a contact with a plastic circuit element
US5205742A (en) * 1991-08-22 1993-04-27 Augat Inc. High density grid array test socket
US5365686A (en) * 1992-12-29 1994-11-22 Scott James G Picture holder with a recorder/playback integrated circuit
US5348489A (en) * 1993-11-09 1994-09-20 Nextronics Engineering Co., Ltd. Socket assembly for an integrated circuit chip
US5448449A (en) * 1993-12-20 1995-09-05 The Whitaker Corporation Retainer for securing a heat sink to a socket
JPH0823149A (ja) * 1994-05-06 1996-01-23 Seiko Epson Corp 半導体装置及びその製造方法
FR2722334B1 (fr) * 1994-07-06 1997-01-17 Barbin Jean Philippe Support actif pour circuit integre, notamment pour un processeur
US5489217A (en) * 1994-10-11 1996-02-06 Methode Electronics, Inc. Zero insertion force pin grid array socket
JP2710218B2 (ja) * 1994-11-10 1998-02-10 日本電気株式会社 半導体チップおよび半導体チップ用ソケットの組合せ構造
US5610801A (en) * 1995-03-20 1997-03-11 Intel Corporation Motherboard assembly which has a single socket that can accept a single integrated circuit package or multiple integrated circuit packages
US5578870A (en) * 1995-08-03 1996-11-26 Precision Connector Designs, Inc. Top loading test socket for ball grid arrays
US5892275A (en) * 1995-08-29 1999-04-06 Intel Corporation High performance power and ground edge connect IC package
US5721673A (en) * 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
RU2172083C2 (ru) * 1996-01-25 2001-08-10 Сименс Акциенгезелльшафт Блок управления, в частности, для транспортного средства
US5864478A (en) * 1996-06-28 1999-01-26 Intel Corporation Power pod/power delivery system
US5980267A (en) * 1996-06-28 1999-11-09 Intel Corporation Connector scheme for a power pod power delivery system
JP3996668B2 (ja) * 1997-05-27 2007-10-24 富士通株式会社 半導体装置用ソケット
US5994774A (en) * 1997-10-30 1999-11-30 Stmicroelectronics, Inc. Surface mountable integrated circuit package with detachable module and interposer
KR100265461B1 (ko) * 1997-11-21 2000-09-15 윤종용 더미본딩와이어를포함하는반도체집적회로소자
US6191474B1 (en) * 1997-12-31 2001-02-20 Micron Technology, Inc. Vertically mountable interposer assembly and method
US6789146B1 (en) * 1998-02-12 2004-09-07 Micron Technology, Inc. Socket for receiving a single-chip video controller and circuit board containing the same
US6210175B1 (en) * 1998-02-20 2001-04-03 Hewlett-Packard Company Socket rails for stacking integrated circuit components
US6381836B1 (en) * 1998-02-23 2002-05-07 Intel Corporation Clip and pin field for IC packaging
KR100276826B1 (ko) * 1998-04-20 2001-01-15 윤종용 패키지되지않은칩을테스트하기위한케리어
US5967802A (en) * 1998-04-22 1999-10-19 Methode Electronics, Inc. Ultra-low-profile SCSI terminator
TW468258B (en) * 1998-10-21 2001-12-11 Hitachi Ltd Semiconductor device and method of manufacturing the same
US6224404B1 (en) * 1998-11-24 2001-05-01 Berg Technology, Inc. Apparatus for removing electrical component
US6219241B1 (en) * 1999-06-11 2001-04-17 Intel Coroporation Advanced zero-insertion force (ZIF) socket with heat sink alignment and retention mechanisms
US6297654B1 (en) * 1999-07-14 2001-10-02 Cerprobe Corporation Test socket and method for testing an IC device in a dead bug orientation
JP3728147B2 (ja) * 1999-07-16 2005-12-21 キヤノン株式会社 光電気混載配線基板
TW453628U (en) * 1999-09-03 2001-09-01 Foxconn Prec Components Co Ltd Assembly of heat dissipation device
JP2001133514A (ja) * 1999-11-05 2001-05-18 Mitsubishi Electric Corp Ｄｕｔボード及びそれを用いるテスト方法
JP2001185640A (ja) * 1999-12-24 2001-07-06 Nec Corp 表面実装型パッケージ及び電子部品並びに電子部品の製造方法
US6629181B1 (en) * 2000-03-16 2003-09-30 Tektronix, Inc. Incremental bus structure for modular electronic equipment
US6672912B2 (en) * 2000-03-31 2004-01-06 Intel Corporation Discrete device socket and method of fabrication therefor
US6476477B2 (en) * 2000-12-04 2002-11-05 Intel Corporation Electronic assembly providing shunting of electrical current
US6416332B1 (en) * 2000-12-20 2002-07-09 Nortel Networks Limited Direct BGA socket for high speed use
US6992378B2 (en) * 2000-12-30 2006-01-31 Intel Corporation Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management

Also Published As

Publication number Publication date
DE60119377D1 (de) 2006-06-08
US20020089045A1 (en) 2002-07-11
KR20030066787A (ko) 2003-08-09
CN1493180A (zh) 2004-04-28
US20050208791A1 (en) 2005-09-22
HK1058284A1 (en) 2004-05-07
CN100338982C (zh) 2007-09-19
JP4122227B2 (ja) 2008-07-23
CN100411257C (zh) 2008-08-13
AU2002217955A1 (en) 2002-07-16
JP2004517450A (ja) 2004-06-10
EP1346618A2 (de) 2003-09-24
WO2002054487A2 (en) 2002-07-11
KR100552453B1 (ko) 2006-02-20
MY130461A (en) 2007-06-29
US6992378B2 (en) 2006-01-31
US7161243B2 (en) 2007-01-09
WO2002054487A3 (en) 2002-09-06
EP1346618B1 (de) 2006-05-03
DE60119377T2 (de) 2006-09-21
CN1829008A (zh) 2006-09-06

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