ATE327876T1 - Verfahren und vorrichtung zum schneiden von stabwerkstücken - Google Patents

Verfahren und vorrichtung zum schneiden von stabwerkstücken

Info

Publication number
ATE327876T1
ATE327876T1 AT01101454T AT01101454T ATE327876T1 AT E327876 T1 ATE327876 T1 AT E327876T1 AT 01101454 T AT01101454 T AT 01101454T AT 01101454 T AT01101454 T AT 01101454T AT E327876 T1 ATE327876 T1 AT E327876T1
Authority
AT
Austria
Prior art keywords
grindstone
metal
ingot
bonded
electrodes
Prior art date
Application number
AT01101454T
Other languages
English (en)
Inventor
Hitoshi Ohmori
Masahi Shigeto
Nobuyuki Nagato
Original Assignee
Riken
Showa Denko Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Riken, Showa Denko Kk filed Critical Riken
Application granted granted Critical
Publication of ATE327876T1 publication Critical patent/ATE327876T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/001—Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/687—By tool reciprocable along elongated edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Accessories And Tools For Shearing Machines (AREA)
AT01101454T 2000-01-26 2001-01-23 Verfahren und vorrichtung zum schneiden von stabwerkstücken ATE327876T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000016518A JP4258592B2 (ja) 2000-01-26 2000-01-26 インゴット切断装置とその方法

Publications (1)

Publication Number Publication Date
ATE327876T1 true ATE327876T1 (de) 2006-06-15

Family

ID=18543642

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01101454T ATE327876T1 (de) 2000-01-26 2001-01-23 Verfahren und vorrichtung zum schneiden von stabwerkstücken

Country Status (5)

Country Link
US (1) US6539932B2 (de)
EP (1) EP1120217B1 (de)
JP (1) JP4258592B2 (de)
AT (1) ATE327876T1 (de)
DE (1) DE60120001T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1634225A4 (de) * 2004-03-10 2008-01-16 Nice Systems Ltd Vorrichtung und verfahren zum erzeugen eines follow-up auf inhaltsbasis
JP2007118581A (ja) * 2005-09-28 2007-05-17 Hiroshi Ishizuka 硬脆性材料の薄板及びその製造方法
JP5217918B2 (ja) * 2008-11-07 2013-06-19 信越半導体株式会社 インゴット切断装置及び切断方法
DE102010018570B4 (de) * 2010-04-28 2017-06-08 Siltronic Ag Verfahren zur Herstellung einer Vielzahl von Halbleiterscheiben durch Bearbeiten eines Einkristalls
KR101137534B1 (ko) * 2011-05-23 2012-04-20 주식회사동아쏠라 슬림 로드 커터
CN103182749A (zh) * 2011-12-29 2013-07-03 北京有色金属研究总院 一种薄板状多晶材料的切割方法
JP2017503692A (ja) * 2013-12-30 2017-02-02 ビーピー・コーポレーション・ノース・アメリカ・インコーポレーテッド 岩石特性の直接数値シミュレーションのためのサンプル準備装置
JP6270921B2 (ja) * 2016-06-28 2018-01-31 株式会社リード ブレードのドレッシング機構を備えた切削装置
EP3346017B1 (de) * 2017-01-10 2021-09-15 Heraeus Deutschland GmbH & Co. KG Verfahren zum schneiden von refraktärmetallen
CN108406451B (zh) * 2018-05-21 2024-05-14 浙江工业大学 一种球形面抛光精磨装置及方法
CN110303609B (zh) * 2019-07-12 2021-08-03 芯盟科技有限公司 晶圆切削机台及晶圆边缘切削方法
CN110653949A (zh) * 2019-09-30 2020-01-07 泽鼎石业(天津)有限公司 一种石材开槽机

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4160397A (en) * 1977-10-17 1979-07-10 Milo Bertini Saw blade construction and method of making same
JPS5859566A (ja) 1981-10-02 1983-04-08 Yuasa Battery Co Ltd 鉛蓄電池
DE3446564A1 (de) * 1984-12-20 1986-07-03 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen Verfahren zum herstellen von klingenpaketen fuer das zertrennen von kristallstaeben in scheiben
JPS62264869A (ja) 1986-05-12 1987-11-17 Matsushita Electric Ind Co Ltd 精密加工用砥石
US4920946A (en) * 1987-03-03 1990-05-01 Applied Magnetic Lab. Co., Ltd. Blade cutting apparatus for hard brittle material
JPH01175166A (ja) 1987-12-28 1989-07-11 Shin Kobe Electric Mach Co Ltd 鉛蓄電池用極柱の製造方法
DE3931837C1 (de) * 1989-09-23 1991-03-14 Peter G Werner
JP2616149B2 (ja) * 1990-06-12 1997-06-04 日本電気株式会社 電解ドレッシング研削装置
JP3008560B2 (ja) * 1991-06-28 2000-02-14 日本電気株式会社 研削切断装置
JPH05104438A (ja) * 1991-10-17 1993-04-27 Toyo A Tec Kk スライシング装置における目立てドレス方法及びその装置
JPH05104437A (ja) * 1991-10-17 1993-04-27 Toyo A Tec Kk スライシング装置における反り制御方法及びその装置
CH691673A5 (de) * 1995-09-08 2001-09-14 Tokyo Seimitsu Co Ltd Vorrichtung zur Erfassung eines Drahtführungsfehlers an einer Drahtsäge.
JPH09187815A (ja) 1996-01-09 1997-07-22 Olympus Optical Co Ltd 液中切断方法および装置

Also Published As

Publication number Publication date
US6539932B2 (en) 2003-04-01
DE60120001D1 (de) 2006-07-06
EP1120217B1 (de) 2006-05-31
JP2001205623A (ja) 2001-07-31
EP1120217A3 (de) 2004-03-03
JP4258592B2 (ja) 2009-04-30
DE60120001T2 (de) 2006-09-21
EP1120217A2 (de) 2001-08-01
US20010017130A1 (en) 2001-08-30

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties