ATE335777T1 - Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat - Google Patents

Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat

Info

Publication number
ATE335777T1
ATE335777T1 AT01999592T AT01999592T ATE335777T1 AT E335777 T1 ATE335777 T1 AT E335777T1 AT 01999592 T AT01999592 T AT 01999592T AT 01999592 T AT01999592 T AT 01999592T AT E335777 T1 ATE335777 T1 AT E335777T1
Authority
AT
Austria
Prior art keywords
resin
foil
copper
insulating
copper foil
Prior art date
Application number
AT01999592T
Other languages
English (en)
Inventor
T Sato
T Asai
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of ATE335777T1 publication Critical patent/ATE335777T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT01999592T 2000-12-08 2001-12-05 Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat ATE335777T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000374070A JP2002179772A (ja) 2000-12-08 2000-12-08 プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板

Publications (1)

Publication Number Publication Date
ATE335777T1 true ATE335777T1 (de) 2006-09-15

Family

ID=18843340

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01999592T ATE335777T1 (de) 2000-12-08 2001-12-05 Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat

Country Status (10)

Country Link
US (1) US6716530B2 (de)
EP (1) EP1273609B1 (de)
JP (1) JP2002179772A (de)
KR (1) KR100538710B1 (de)
CN (1) CN1314726C (de)
AT (1) ATE335777T1 (de)
DE (1) DE60122124T2 (de)
MY (1) MY137500A (de)
TW (1) TWI288760B (de)
WO (1) WO2002046264A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3434808B2 (ja) * 2001-05-31 2003-08-11 三井金属鉱業株式会社 樹脂付銅箔及びその樹脂付銅箔を用いたプリント配線板
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
JP4895611B2 (ja) * 2003-12-16 2012-03-14 三井金属鉱業株式会社 多層プリント配線板及びその多層プリント配線板の製造方法
JP4534802B2 (ja) * 2004-03-08 2010-09-01 Ｄｉｃ株式会社 熱硬化性組成物及びその硬化物
JP4710277B2 (ja) * 2004-08-17 2011-06-29 Ｄｉｃ株式会社 エポキシ樹脂組成物およびその硬化物
EP1863038B1 (de) * 2005-03-23 2010-09-08 Murata Manufacturing Co., Ltd. Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente
US8414962B2 (en) 2005-10-28 2013-04-09 The Penn State Research Foundation Microcontact printed thin film capacitors
JP2009155354A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層用樹脂組成物
JP2009155355A (ja) * 2006-03-30 2009-07-16 Ajinomoto Co Inc 絶縁層形成用樹脂組成物
JP5088060B2 (ja) * 2006-12-04 2012-12-05 日立化成工業株式会社 熱硬化性樹脂組成物並びにこれを用いたプリプレグ、積層板及びプリント配線板
TWI451816B (zh) 2007-03-20 2014-09-01 Mitsui Mining & Smelting Co And a resin composition for insulating layer constituting a printed circuit board
JP5636159B2 (ja) * 2007-12-28 2014-12-03 三井金属鉱業株式会社 樹脂付銅箔および樹脂付銅箔の製造方法
WO2009084533A1 (ja) * 2007-12-28 2009-07-09 Mitsui Mining & Smelting Co., Ltd. 樹脂付銅箔および樹脂付銅箔の製造方法
KR100982795B1 (ko) * 2008-07-10 2010-09-16 삼성전기주식회사 전자소자 내장형 인쇄회로기판 제조방법
JP2010270229A (ja) * 2009-05-21 2010-12-02 Nippon Steel Materials Co Ltd 耐熱樹脂組成物、強化繊維プリプレグ及び強化繊維複合材料
KR101876697B1 (ko) * 2010-04-08 2018-07-09 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그 및 적층판
TWI401269B (zh) 2010-06-14 2013-07-11 Taiwan Union Technology Corp 環氧樹脂組成物及其製成的預浸材和印刷電路板
TWI617225B (zh) * 2010-12-24 2018-03-01 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法
TWI542264B (zh) * 2010-12-24 2016-07-11 Ｌｇ伊諾特股份有限公司 印刷電路板及其製造方法
KR20140048564A (ko) * 2012-10-16 2014-04-24 삼성전기주식회사 코어기판, 그의 제조방법 및 메탈 비아용 구조체
US20140119703A1 (en) * 2012-10-26 2014-05-01 Cisco Technology, Inc. Printed Circuit Board Comprising Both Conductive Metal and Optical Elements
JP6098372B2 (ja) * 2013-05-30 2017-03-22 住友ベークライト株式会社 半導体装置
CN109951964A (zh) 2013-07-23 2019-06-28 Jx日矿日石金属株式会社 表面处理铜箔、附载体铜箔、基材、及树脂基材
EP3026144A4 (de) 2013-07-24 2017-04-12 JX Nippon Mining & Metals Corp. Oberflächenbehandelte kupferfolie, kupferfolie mit träger, substrat, harzsubstrat, leiterplatte, kupferkaschiertes laminat und verfahren zur herstellung einer leiterplatte
JP6640567B2 (ja) 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
KR101852671B1 (ko) 2015-01-21 2018-06-04 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법
KR101942621B1 (ko) 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP2017193778A (ja) 2016-04-15 2017-10-26 Ｊｘ金属株式会社 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN108384236A (zh) * 2018-03-16 2018-08-10 苏州生益科技有限公司 一种树脂组合物及使用其制备的低流胶半固化片

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5707749A (en) * 1990-11-30 1998-01-13 Hitachi, Ltd. Method for producing thin film multilayer wiring board
JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JP3327039B2 (ja) 1995-03-17 2002-09-24 大日本インキ化学工業株式会社 エポキシ樹脂組成物
US6165617A (en) 1995-07-04 2000-12-26 Mitsui Mining & Smelting Co., Ltd. Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
CN1085931C (zh) * 1995-07-04 2002-05-29 三井金属矿业株式会社 有树脂的多层印刷电路板用铜箔及用它的多层印刷电路板
JPH09324108A (ja) * 1996-06-07 1997-12-16 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた積層板
JPH1095898A (ja) * 1996-09-25 1998-04-14 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた積層板
JPH115828A (ja) 1997-06-17 1999-01-12 Mitsui Mining & Smelting Co Ltd 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板
JP3184485B2 (ja) * 1997-11-06 2001-07-09 三井金属鉱業株式会社 銅張積層板用樹脂組成物、樹脂付き銅箔、多層銅張り積層板および多層プリント配線板

Also Published As

Publication number Publication date
EP1273609A4 (de) 2004-10-06
KR20020080377A (ko) 2002-10-23
KR100538710B1 (ko) 2005-12-23
TWI288760B (en) 2007-10-21
JP2002179772A (ja) 2002-06-26
CN1398274A (zh) 2003-02-19
EP1273609B1 (de) 2006-08-09
MY137500A (en) 2009-02-27
US20020106516A1 (en) 2002-08-08
DE60122124T2 (de) 2007-02-15
DE60122124D1 (de) 2006-09-21
EP1273609A1 (de) 2003-01-08
US6716530B2 (en) 2004-04-06
WO2002046264A1 (en) 2002-06-13
CN1314726C (zh) 2007-05-09

Similar Documents

Publication Publication Date Title
ATE335777T1 (de) Harzkomponente zum formen einer isolierenden zwischenschicht in einer gedruckten leiterplatte, harzfolie und kupferfolie mit einem harz zur herstellung einer isolierschicht unter verwendung des harzes sowie diese verwendendes kupferkaschiertes laminat
EP1553626A4 (de) Mehrschichtige leiterplatte
EP3112422A1 (de) Halogenfreie flammhemmende harzzusammensetzung
EP0844272A3 (de) Prepregs, davon abgeleitete Laminate und Verfahren für die Herstellung von damit hergestellten gedrückten Leiterplatten
EP1229772A4 (de) Leiterplatte, ihre herstellungsmethode und elektronische appartur mit einer solchen
WO2002008338A1 (en) Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof
JP2019182932A (ja) 硬化性樹脂組成物及び積層体
MY140754A (en) Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
TW200518928A (en) Laminates having a low dielectric, low dissipation factor bond core and method of making same
TW200745211A (en) Resin composition for forming insulating layer
KR101202241B1 (ko) 에폭시 수지 조성물, 프리프레그, 금속 클래드 적층판, 다층 인쇄 배선판
TW200620334A (en) Multi-layer insulated wire, processes for preparing the same, and its applications
JP2008053362A (ja) プリント配線板及びその製造方法
JPS6450592A (en) Super-heat dissipation type composite circuit board
WO2008114674A1 (ja) 絶縁性複合体、その製造方法、および絶縁性複合体の利用
JP4802541B2 (ja) 金属箔張り積層板および多層プリント配線板の製造方法
JP2009105283A (ja) 多層プリント配線板用樹脂付き銅箔及びそれを用いて作製される多層プリント配線板
CN202283801U (zh) 一种led用 cem-3覆铜板
KR20080062285A (ko) 금속 베이스 동박적층판
JPH01264811A (ja) 電気積層板の製造方法
KR20140002354A (ko) 에폭시 수지 조성물, 이로부터 제조된 절연필름 및 이를 구비한 다층 인쇄회로기판
JPH0294697A (ja) 多層プリント回路板およびその製法
JPH06326430A (ja) 多層プリント配線板およびその製造方法
KR20130120008A (ko) 플라즈마 용사 방식의 금속 베이스 동박적층판 제조방법 및 이에 의하여 제조된 금속 베이스 동박적층판
TH52682A (th) สารประกอบเรซินสำหรับประกอบเป็นไดอิเล็กตริกชั้นกั้นของแผงเดินไฟแบบพิมพ์ แผ่นเรซินและแผ่นทองแดงทาด้วยเรซิน สำหรับทำชั้นฉนวนที่ใช้สารประกอบเรซินดังกล่าวและแผ่นลามิเนตหุ้มทองแดงที่ใช้สารประกอบดังกล่าว

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties