ATE337350T1 - Epoxidharzzusammensetzung zum einkapseln von halbleitern, halbleiter davon und herstellungsverfahren von halbleitern - Google Patents

Epoxidharzzusammensetzung zum einkapseln von halbleitern, halbleiter davon und herstellungsverfahren von halbleitern

Info

Publication number
ATE337350T1
ATE337350T1 AT05009138T AT05009138T ATE337350T1 AT E337350 T1 ATE337350 T1 AT E337350T1 AT 05009138 T AT05009138 T AT 05009138T AT 05009138 T AT05009138 T AT 05009138T AT E337350 T1 ATE337350 T1 AT E337350T1
Authority
AT
Austria
Prior art keywords
semiconductors
resin composition
epoxy resin
encapsulating
substrate
Prior art date
Application number
AT05009138T
Other languages
English (en)
Inventor
Keisuke Yoshikawa
Kazuhito Hosokawa
Takuji Okeyui
Kazuhiro Ikemura
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE337350T1 publication Critical patent/ATE337350T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
    • B62B1/00—Hand carts having only one axis carrying one or more transport wheels; Equipment therefor
    • B62B1/10—Hand carts having only one axis carrying one or more transport wheels; Equipment therefor in which the load is intended to be transferred totally to the wheels
    • B62B1/14—Hand carts having only one axis carrying one or more transport wheels; Equipment therefor in which the load is intended to be transferred totally to the wheels involving means for grappling or securing in place objects to be carried; Loading or unloading equipment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Transportation (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT05009138T 2004-04-30 2005-04-26 Epoxidharzzusammensetzung zum einkapseln von halbleitern, halbleiter davon und herstellungsverfahren von halbleitern ATE337350T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004136137 2004-04-30
JP2004229715A JP4421972B2 (ja) 2004-04-30 2004-08-05 半導体装置の製法

Publications (1)

Publication Number Publication Date
ATE337350T1 true ATE337350T1 (de) 2006-09-15

Family

ID=34935769

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05009138T ATE337350T1 (de) 2004-04-30 2005-04-26 Epoxidharzzusammensetzung zum einkapseln von halbleitern, halbleiter davon und herstellungsverfahren von halbleitern

Country Status (9)

Country Link
US (1) US7262514B2 (de)
EP (1) EP1591465B1 (de)
JP (1) JP4421972B2 (de)
KR (1) KR100880968B1 (de)
AT (1) ATE337350T1 (de)
DE (1) DE602005000085T2 (de)
MY (1) MY138595A (de)
SG (1) SG116646A1 (de)
TW (1) TWI366574B (de)

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JP4426917B2 (ja) * 2004-07-16 2010-03-03 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4494912B2 (ja) * 2004-09-13 2010-06-30 日東電工株式会社 半導体装置、ならびに半導体装置の製法
CN101310379B (zh) * 2005-11-17 2010-09-15 富士通半导体股份有限公司 半导体器件
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
KR20070090108A (ko) * 2006-03-01 2007-09-05 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 캡슐화 에폭시 수지 조성물 및 반도체 장치
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KR20080047990A (ko) * 2006-11-27 2008-05-30 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법
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JP4939574B2 (ja) 2008-08-28 2012-05-30 日東電工株式会社 熱硬化型ダイボンドフィルム
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JP5527330B2 (ja) * 2010-01-05 2014-06-18 富士電機株式会社 半導体装置用ユニットおよび半導体装置
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Also Published As

Publication number Publication date
DE602005000085T2 (de) 2006-12-28
SG116646A1 (en) 2005-11-28
TWI366574B (en) 2012-06-21
TW200600523A (en) 2006-01-01
MY138595A (en) 2009-07-31
KR100880968B1 (ko) 2009-02-03
EP1591465A1 (de) 2005-11-02
KR20060047646A (ko) 2006-05-18
US20050253286A1 (en) 2005-11-17
US7262514B2 (en) 2007-08-28
DE602005000085D1 (de) 2006-10-05
JP2005340746A (ja) 2005-12-08
JP4421972B2 (ja) 2010-02-24
EP1591465B1 (de) 2006-08-23

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