MY138595A - Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device - Google Patents

Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device

Info

Publication number
MY138595A
MY138595A MYPI20051891A MYPI20051891A MY138595A MY 138595 A MY138595 A MY 138595A MY PI20051891 A MYPI20051891 A MY PI20051891A MY PI20051891 A MYPI20051891 A MY PI20051891A MY 138595 A MY138595 A MY 138595A
Authority
MY
Malaysia
Prior art keywords
resin composition
epoxy resin
semiconductor
semiconductor device
encapsulation
Prior art date
Application number
MYPI20051891A
Other languages
English (en)
Inventor
Keisuke Yoshikawa
Kazuhito Hosokawa
Takuji Okeyui
Kazuhiro Ikemura
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY138595A publication Critical patent/MY138595A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
    • B62B1/00—Hand carts having only one axis carrying one or more transport wheels; Equipment therefor
    • B62B1/10—Hand carts having only one axis carrying one or more transport wheels; Equipment therefor in which the load is intended to be transferred totally to the wheels
    • B62B1/14—Hand carts having only one axis carrying one or more transport wheels; Equipment therefor in which the load is intended to be transferred totally to the wheels involving means for grappling or securing in place objects to be carried; Loading or unloading equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/05—Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
    • C09K2323/055—Epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Transportation (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
MYPI20051891A 2004-04-30 2005-04-28 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device MY138595A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004136137 2004-04-30
JP2004229715A JP4421972B2 (ja) 2004-04-30 2004-08-05 半導体装置の製法

Publications (1)

Publication Number Publication Date
MY138595A true MY138595A (en) 2009-07-31

Family

ID=34935769

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20051891A MY138595A (en) 2004-04-30 2005-04-28 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device

Country Status (9)

Country Link
US (1) US7262514B2 (de)
EP (1) EP1591465B1 (de)
JP (1) JP4421972B2 (de)
KR (1) KR100880968B1 (de)
AT (1) ATE337350T1 (de)
DE (1) DE602005000085T2 (de)
MY (1) MY138595A (de)
SG (1) SG116646A1 (de)
TW (1) TWI366574B (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4562118B2 (ja) * 2003-12-19 2010-10-13 日東電工株式会社 半導体装置の製造方法
JP4421972B2 (ja) * 2004-04-30 2010-02-24 日東電工株式会社 半導体装置の製法
JP4426917B2 (ja) * 2004-07-16 2010-03-03 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4494912B2 (ja) * 2004-09-13 2010-06-30 日東電工株式会社 半導体装置、ならびに半導体装置の製法
CN101310379B (zh) * 2005-11-17 2010-09-15 富士通半导体股份有限公司 半导体器件
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
KR20070090108A (ko) * 2006-03-01 2007-09-05 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 캡슐화 에폭시 수지 조성물 및 반도체 장치
JP4171499B2 (ja) * 2006-04-10 2008-10-22 日立電線株式会社 電子装置用基板およびその製造方法、並びに電子装置およびその製造方法
KR101370245B1 (ko) * 2006-05-23 2014-03-05 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체장치의 제조방법
DE102006033701B4 (de) * 2006-07-20 2012-02-23 Infineon Technologies Ag Herstellungsverfahren für ein elektronisches Bauelement in VQFN-Bauweise
US7993732B2 (en) * 2006-07-28 2011-08-09 Ricoh Company, Ltd. Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material
CN101118895A (zh) * 2006-08-03 2008-02-06 飞思卡尔半导体公司 具有内置热沉的半导体器件
US20090001611A1 (en) * 2006-09-08 2009-01-01 Takeshi Matsumura Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method
JP2008072010A (ja) * 2006-09-15 2008-03-27 Nitto Denko Corp 片面封止型光半導体装置の製造方法およびそれにより得られる片面封止型光半導体装置
JP2008108890A (ja) * 2006-10-25 2008-05-08 Three M Innovative Properties Co 回路基板の接続方法及び接続構造体
KR20080047990A (ko) * 2006-11-27 2008-05-30 린텍 가부시키가이샤 점접착제 조성물, 점접착 시트 및 반도체 장치의 제조방법
US20080237842A1 (en) * 2007-03-29 2008-10-02 Manepalli Rahul N Thermally conductive molding compounds for heat dissipation in semiconductor packages
JP2008247936A (ja) * 2007-03-29 2008-10-16 Lintec Corp 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
KR100836746B1 (ko) 2007-04-17 2008-06-10 주식회사 나노인터페이스 테크놀로지 전자기파 차폐 방열 시트 및 이의 제조방법
KR100899720B1 (ko) * 2008-01-10 2009-05-27 엘에스엠트론 주식회사 다이 접착 필름과 이를 위한 수지 조성물
JP4939574B2 (ja) 2008-08-28 2012-05-30 日東電工株式会社 熱硬化型ダイボンドフィルム
JP5715747B2 (ja) * 2008-09-30 2015-05-13 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 回路装置およびその製造方法
JP5527330B2 (ja) * 2010-01-05 2014-06-18 富士電機株式会社 半導体装置用ユニットおよび半導体装置
US9070628B2 (en) * 2010-05-28 2015-06-30 Sumitomo Bakelite Co., Ltd. Method of manufacturing esterified substance
TWI401755B (zh) * 2010-08-10 2013-07-11 群成科技股份有限公司 四邊扁平無接腳封裝方法
JP5868043B2 (ja) 2011-07-04 2016-02-24 ルネサスエレクトロニクス株式会社 半導体装置
US8525312B2 (en) * 2011-08-12 2013-09-03 Tessera, Inc. Area array quad flat no-lead (QFN) package
CN103827162B (zh) 2011-09-29 2016-06-15 日立化成株式会社 环氧树脂组合物及电子部件装置
JP5971501B2 (ja) * 2012-01-06 2016-08-17 エルジー・ケム・リミテッド 電子装置の製造方法
JP5948881B2 (ja) * 2012-01-16 2016-07-06 大日本印刷株式会社 半導体装置用リードフレーム
KR101961952B1 (ko) * 2012-02-29 2019-07-17 에스케이하이닉스 주식회사 다이 어태치 접착제 및 반도체 장치
JP5991712B2 (ja) * 2012-10-26 2016-09-14 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
CN104465418B (zh) * 2014-12-24 2017-12-19 通富微电子股份有限公司 一种扇出晶圆级封装方法
US9595501B1 (en) 2015-10-30 2017-03-14 Automated Assembly Corporation Wire bonded electronic devices to round wire
DE102016000051A1 (de) * 2016-01-05 2017-07-06 Siltectra Gmbh Verfahren und Vorrichtung zum planaren Erzeugen von Modifikationen in Festkörpern
WO2017162800A1 (de) * 2016-03-24 2017-09-28 Siltectra Gmbh Polymer-hybrid-material zur verwendung in einem splitting-verfahren
JP6918445B2 (ja) * 2016-06-24 2021-08-11 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
JP6864505B2 (ja) 2016-06-24 2021-04-28 日東電工株式会社 加熱接合用シート及びダイシングテープ付き加熱接合用シート
US10381325B1 (en) 2017-08-04 2019-08-13 Automated Assembly Corporation Guide posts for wire bonding
EP3511977B1 (de) 2018-01-16 2021-11-03 Infineon Technologies AG Halbleitermodul und verfahren zur herstellung desselben
US10171133B1 (en) 2018-02-20 2019-01-01 Automated Assembly Corporation Transponder arrangement
KR102455146B1 (ko) * 2020-02-10 2022-10-17 주식회사 나노인 기판의 구조충진을 위한 가역적 코팅 방법 및 봉지 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1591465B1 (de) * 2004-04-30 2006-08-23 Nitto Denko Corporation Epoxidharzzusammensetzung zum einkapseln von Halbleitern, Halbleiter davon und Herstellungsverfahren von Halbleitern

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1083851C (zh) * 1995-01-05 2002-05-01 东丽株式会社 环氧树脂组合物
JPH09252014A (ja) * 1996-03-15 1997-09-22 Nissan Motor Co Ltd 半導体素子の製造方法
EP0827159B1 (de) * 1996-08-29 2003-05-21 Mitsubishi Denki Kabushiki Kaisha Epoxidharzzusammensetzung und damit eingekapselte Halbleiteranordnungen
JP3469446B2 (ja) * 1996-11-29 2003-11-25 株式会社東芝 樹脂組成物およびこれを用いた樹脂封止型半導体装置の製造方法
US6143423A (en) * 1997-04-07 2000-11-07 Shin-Etsu Chemical Co., Ltd. Flame retardant epoxy resin compositions
KR100562454B1 (ko) * 1998-07-21 2006-03-21 신에쓰 가가꾸 고교 가부시끼가이샤 반도체 봉지용 에폭시 수지 조성물 및 반도체 장치
KR100894208B1 (ko) * 2000-03-31 2009-04-22 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착 필름,반도체 탑재용 기판 및 반도체 장치
CN1269198C (zh) * 2000-09-29 2006-08-09 日立化成工业株式会社 树脂密封型半导体装置及使用的芯片焊接材料和密封材料
US6794481B2 (en) * 2001-06-28 2004-09-21 Mitsubishi Gas Chemical Company, Inc. Bifunctional phenylene ether oligomer, its derivatives, its use and process for the production thereof
US6835785B2 (en) * 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1591465B1 (de) * 2004-04-30 2006-08-23 Nitto Denko Corporation Epoxidharzzusammensetzung zum einkapseln von Halbleitern, Halbleiter davon und Herstellungsverfahren von Halbleitern

Also Published As

Publication number Publication date
DE602005000085T2 (de) 2006-12-28
SG116646A1 (en) 2005-11-28
TWI366574B (en) 2012-06-21
TW200600523A (en) 2006-01-01
KR100880968B1 (ko) 2009-02-03
EP1591465A1 (de) 2005-11-02
KR20060047646A (ko) 2006-05-18
US20050253286A1 (en) 2005-11-17
ATE337350T1 (de) 2006-09-15
US7262514B2 (en) 2007-08-28
DE602005000085D1 (de) 2006-10-05
JP2005340746A (ja) 2005-12-08
JP4421972B2 (ja) 2010-02-24
EP1591465B1 (de) 2006-08-23

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