ATE341100T1 - Tragbarer silizium chip - Google Patents

Tragbarer silizium chip

Info

Publication number
ATE341100T1
ATE341100T1 AT03735886T AT03735886T ATE341100T1 AT E341100 T1 ATE341100 T1 AT E341100T1 AT 03735886 T AT03735886 T AT 03735886T AT 03735886 T AT03735886 T AT 03735886T AT E341100 T1 ATE341100 T1 AT E341100T1
Authority
AT
Austria
Prior art keywords
silicon chip
semiconductor die
portable silicon
portable
package body
Prior art date
Application number
AT03735886T
Other languages
English (en)
Inventor
George Marmaropoulos
Heerden Clive Van
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE341100T1 publication Critical patent/ATE341100T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • A—HUMAN NECESSITIES
    • A41—WEARING APPAREL
    • A41D—OUTERWEAR; PROTECTIVE GARMENTS; ACCESSORIES
    • A41D1/00—Garments
    • A41D1/002—Garments adapted to accommodate electronic equipment

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Led Device Packages (AREA)
  • Measuring Fluid Pressure (AREA)
AT03735886T 2002-06-28 2003-06-06 Tragbarer silizium chip ATE341100T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/184,510 US6646336B1 (en) 2002-06-28 2002-06-28 Wearable silicon chip

Publications (1)

Publication Number Publication Date
ATE341100T1 true ATE341100T1 (de) 2006-10-15

Family

ID=29400894

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03735886T ATE341100T1 (de) 2002-06-28 2003-06-06 Tragbarer silizium chip

Country Status (9)

Country Link
US (1) US6646336B1 (de)
EP (1) EP1520296B1 (de)
JP (1) JP4704749B2 (de)
KR (1) KR100992001B1 (de)
CN (1) CN100511654C (de)
AT (1) ATE341100T1 (de)
AU (1) AU2003236971A1 (de)
DE (1) DE60308682T2 (de)
WO (1) WO2004003999A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2905518B1 (fr) * 2006-08-29 2008-12-26 Commissariat Energie Atomique Puce microelectronique a faces laterales munies de rainures et procede de fabrication
JP5519217B2 (ja) * 2009-08-31 2014-06-11 帝人デュポンフィルム株式会社 偏光子支持基材用フィルム
WO2012145865A1 (zh) * 2011-04-29 2012-11-01 Yang Chang-Ming 布料电子化的产品及方法
WO2019224575A1 (en) 2018-05-22 2019-11-28 Tyco Fire & Security Gmbh Elongate flexible tag
US12223814B2 (en) 2019-09-16 2025-02-11 Sensormatic Electronics, LLC Security tag for textiles using conductive thread
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US12524640B2 (en) 2019-11-27 2026-01-13 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US12288736B2 (en) 2019-11-28 2025-04-29 Prevayl Innovations Limited Sensor package, article comprising the same and manufacturing method thereof
GB2589359A (en) 2019-11-28 2021-06-02 Prevayl Ltd Sensor device, system and wearable article
GB2589568B (en) 2019-11-28 2025-10-10 Prevayl Innovations Ltd Sensor device, system and wearable article
GB2593479B (en) * 2020-03-24 2024-04-03 Prevayl Innovations Ltd Article with semiconductor package and method
US11694057B2 (en) 2020-01-03 2023-07-04 Sensormatic Electronics, LLC RFID tag and method of making same
WO2021170994A1 (en) 2020-02-26 2021-09-02 Prevayl Limited Signal measuring apparatus and system
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article
US12536401B2 (en) 2022-08-31 2026-01-27 Sensormatic Electronics, LLC Security tag

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3414666A (en) * 1963-10-14 1968-12-03 Electromechanical Devices Inc Weaved electronic equipment
JPH01191455A (ja) * 1988-01-27 1989-08-01 Hitachi Ltd 半導体装置
JPH06268101A (ja) * 1993-03-17 1994-09-22 Hitachi Ltd 半導体装置及びその製造方法、電子装置、リ−ドフレ−ム並びに実装基板
ATE227407T1 (de) * 1993-05-28 2002-11-15 Andrew R Ferber Licht, audio und stromähnliche zusammensetzungen, befestigungen und vorrichtungen mit leitbaren zusammensetzungen
US5592408A (en) * 1994-01-03 1997-01-07 Security People, Inc. Identification card and access control device
JPH08139258A (ja) * 1994-11-08 1996-05-31 Hitachi Ltd 半導体装置
JPH09232467A (ja) * 1996-02-26 1997-09-05 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2891665B2 (ja) * 1996-03-22 1999-05-17 株式会社日立製作所 半導体集積回路装置およびその製造方法
EP1005671A2 (de) * 1996-11-01 2000-06-07 ViA, Inc. Biegsamer tragbarer rechner
KR100280398B1 (ko) 1997-09-12 2001-02-01 김영환 적층형 반도체 패키지 모듈의 제조 방법
US6180881B1 (en) * 1998-05-05 2001-01-30 Harlan Ruben Isaak Chip stack and method of making same
IT1304379B1 (it) * 1998-09-08 2001-03-15 Renato Guerra Giacca o tuta sportiva o da lavoro od indumento in genere dotata disegnaletica luminosa intermittente direzionale.
US6393745B1 (en) * 1998-09-24 2002-05-28 Emiko Miki Display media back pack and method of visual display
RU2134465C1 (ru) * 1998-12-08 1999-08-10 Таран Александр Иванович Однокристальный модуль ис
US6493933B1 (en) * 1999-10-18 2002-12-17 Massachusetts Institute Of Technology Method of making flexible electronic circuitry
JP3471690B2 (ja) * 1999-12-16 2003-12-02 沖電気工業株式会社 半導体素子の実装方法
JP3723565B2 (ja) * 2003-10-21 2005-12-07 広瀬 秀男 電子衣料

Also Published As

Publication number Publication date
EP1520296A1 (de) 2005-04-06
WO2004003999A1 (en) 2004-01-08
DE60308682T2 (de) 2007-08-30
CN1666333A (zh) 2005-09-07
EP1520296B1 (de) 2006-09-27
JP2005531925A (ja) 2005-10-20
US6646336B1 (en) 2003-11-11
JP4704749B2 (ja) 2011-06-22
DE60308682D1 (de) 2006-11-09
KR20050024423A (ko) 2005-03-10
CN100511654C (zh) 2009-07-08
KR100992001B1 (ko) 2010-11-04
AU2003236971A1 (en) 2004-01-19

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Legal Events

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