ATE341108T1 - Verfahren und vorrichtung zur herstellung einer rolle von antennenelementen und zur ausgabe derartiger antennenelemente - Google Patents
Verfahren und vorrichtung zur herstellung einer rolle von antennenelementen und zur ausgabe derartiger antennenelementeInfo
- Publication number
- ATE341108T1 ATE341108T1 AT99850020T AT99850020T ATE341108T1 AT E341108 T1 ATE341108 T1 AT E341108T1 AT 99850020 T AT99850020 T AT 99850020T AT 99850020 T AT99850020 T AT 99850020T AT E341108 T1 ATE341108 T1 AT E341108T1
- Authority
- AT
- Austria
- Prior art keywords
- antenna elements
- item
- protective layer
- roll
- issueing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Rolls And Other Rotary Bodies (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
- Continuous Casting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP99850020A EP1028483B1 (de) | 1999-02-10 | 1999-02-10 | Verfahren und Vorrichtung zur Herstellung einer Rolle von Antennenelementen und zur Ausgabe derartiger Antennenelemente |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE341108T1 true ATE341108T1 (de) | 2006-10-15 |
Family
ID=8243751
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06019921T ATE392726T1 (de) | 1999-02-10 | 1999-02-10 | Verfahren und vorrichtung zur herstellung einer rolle von gegenständen |
| AT99850020T ATE341108T1 (de) | 1999-02-10 | 1999-02-10 | Verfahren und vorrichtung zur herstellung einer rolle von antennenelementen und zur ausgabe derartiger antennenelemente |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06019921T ATE392726T1 (de) | 1999-02-10 | 1999-02-10 | Verfahren und vorrichtung zur herstellung einer rolle von gegenständen |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1742294B8 (de) |
| JP (1) | JP2002536939A (de) |
| KR (1) | KR100698929B1 (de) |
| CN (1) | CN1322630C (de) |
| AT (2) | ATE392726T1 (de) |
| DE (1) | DE69933356T2 (de) |
| DK (1) | DK1028483T3 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200846250A (en) * | 2007-05-18 | 2008-12-01 | Pyroswift Folding Co Ltd | Manufacture method of tag-typed integrated soft circuit board and a structure thereof |
| KR101025964B1 (ko) * | 2009-08-10 | 2011-03-30 | 삼성전기주식회사 | 안테나 패턴 프레임의 제조방법 및 제조장치 |
| KR101531383B1 (ko) * | 2014-07-07 | 2015-06-24 | 주식회사 에이티앤씨 | 스티커형 안테나 제조방법 |
| DE102023202844A1 (de) * | 2023-03-28 | 2024-10-02 | Infineon Technologies Ag | Verfahren zum Herstellen eines Substratelements, Substratelement und Vorrichtung mit einem Substratelement |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2122967A (en) * | 1982-06-18 | 1984-01-25 | Gianuario Messina | A machine for applying self- adhesive protective labels on papers, cards and the like |
| JPS62293737A (ja) * | 1986-06-13 | 1987-12-21 | Matsushita Electric Ind Co Ltd | 樹脂シ−トからの半導体小片取外し方法 |
| US4843404A (en) * | 1986-09-29 | 1989-06-27 | Monarch Marking Systems, Inc. | Tag web of spiral conductors |
| AU1712188A (en) * | 1987-04-27 | 1988-12-02 | Soundcraft, Inc. | Method for manufacture of and structure of a laminated proximity card |
| CN1014481B (zh) * | 1988-07-13 | 1991-10-23 | 徐承先 | 热压镶嵌法制造印刷电路板 |
| EP0395871A3 (de) * | 1989-05-05 | 1991-09-18 | Gould Electronics Inc. | Geschützte elektroleitende Folie und Verfahren zum Schutz einer elektrolytisch abgeschiedenen Folie während der weiteren Behandlung |
| US5391180A (en) * | 1991-08-05 | 1995-02-21 | United States Surgical Corporation | Articulating endoscopic surgical apparatus |
| JPH05211184A (ja) * | 1991-12-10 | 1993-08-20 | Nec Corp | ダイボンディング装置 |
| US5649350A (en) * | 1995-10-18 | 1997-07-22 | Ericsson Inc. | Method of mass producing printed circuit antennas |
| DE19635232A1 (de) * | 1996-08-30 | 1998-03-05 | Siemens Ag | Verfahren und Vorrichtung zur plasmachemischen Zersetzung und/oder Vernichtung von Schadstoffen |
-
1999
- 1999-02-10 AT AT06019921T patent/ATE392726T1/de not_active IP Right Cessation
- 1999-02-10 DE DE69933356T patent/DE69933356T2/de not_active Expired - Lifetime
- 1999-02-10 AT AT99850020T patent/ATE341108T1/de not_active IP Right Cessation
- 1999-02-10 DK DK99850020T patent/DK1028483T3/da active
- 1999-02-10 EP EP06019921A patent/EP1742294B8/de not_active Expired - Lifetime
-
2000
- 2000-02-10 KR KR1020017009023A patent/KR100698929B1/ko not_active Expired - Fee Related
- 2000-02-10 CN CNB008025460A patent/CN1322630C/zh not_active Expired - Lifetime
- 2000-02-10 JP JP2000599096A patent/JP2002536939A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE69933356D1 (de) | 2006-11-09 |
| KR100698929B1 (ko) | 2007-03-23 |
| ATE392726T1 (de) | 2008-05-15 |
| DK1028483T3 (da) | 2007-01-29 |
| EP1742294B8 (de) | 2010-12-22 |
| CN1322630C (zh) | 2007-06-20 |
| CN1336021A (zh) | 2002-02-13 |
| JP2002536939A (ja) | 2002-10-29 |
| EP1742294A3 (de) | 2007-06-13 |
| EP1742294A2 (de) | 2007-01-10 |
| KR20010101572A (ko) | 2001-11-14 |
| DE69933356T2 (de) | 2007-05-10 |
| EP1742294B1 (de) | 2008-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |