DK1028483T3 - Fremgangsmåde og apparat til fremstilling af en rulle antenneelement - Google Patents

Fremgangsmåde og apparat til fremstilling af en rulle antenneelement

Info

Publication number
DK1028483T3
DK1028483T3 DK99850020T DK99850020T DK1028483T3 DK 1028483 T3 DK1028483 T3 DK 1028483T3 DK 99850020 T DK99850020 T DK 99850020T DK 99850020 T DK99850020 T DK 99850020T DK 1028483 T3 DK1028483 T3 DK 1028483T3
Authority
DK
Denmark
Prior art keywords
item
protective layer
roll
making
antenna element
Prior art date
Application number
DK99850020T
Other languages
English (en)
Inventor
Stefan Moren
Original Assignee
Amc Centurion Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amc Centurion Ab filed Critical Amc Centurion Ab
Priority claimed from EP99850020A external-priority patent/EP1028483B1/en
Application granted granted Critical
Publication of DK1028483T3 publication Critical patent/DK1028483T3/da

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Rolls And Other Rotary Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Wire Bonding (AREA)
  • Continuous Casting (AREA)
  • Bending Of Plates, Rods, And Pipes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DK99850020T 1999-02-10 1999-02-10 Fremgangsmåde og apparat til fremstilling af en rulle antenneelement DK1028483T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99850020A EP1028483B1 (en) 1999-02-10 1999-02-10 Method and device for manufacturing a roll of antenna elements and for dispensing said antenna elements

Publications (1)

Publication Number Publication Date
DK1028483T3 true DK1028483T3 (da) 2007-01-29

Family

ID=8243751

Family Applications (1)

Application Number Title Priority Date Filing Date
DK99850020T DK1028483T3 (da) 1999-02-10 1999-02-10 Fremgangsmåde og apparat til fremstilling af en rulle antenneelement

Country Status (7)

Country Link
EP (1) EP1742294B8 (da)
JP (1) JP2002536939A (da)
KR (1) KR100698929B1 (da)
CN (1) CN1322630C (da)
AT (2) ATE341108T1 (da)
DE (1) DE69933356T2 (da)
DK (1) DK1028483T3 (da)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200846250A (en) * 2007-05-18 2008-12-01 Pyroswift Folding Co Ltd Manufacture method of tag-typed integrated soft circuit board and a structure thereof
KR101025964B1 (ko) * 2009-08-10 2011-03-30 삼성전기주식회사 안테나 패턴 프레임의 제조방법 및 제조장치
KR101531383B1 (ko) * 2014-07-07 2015-06-24 주식회사 에이티앤씨 스티커형 안테나 제조방법
DE102023202844A1 (de) * 2023-03-28 2024-10-02 Infineon Technologies Ag Verfahren zum Herstellen eines Substratelements, Substratelement und Vorrichtung mit einem Substratelement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2122967A (en) * 1982-06-18 1984-01-25 Gianuario Messina A machine for applying self- adhesive protective labels on papers, cards and the like
JPS62293737A (ja) * 1986-06-13 1987-12-21 Matsushita Electric Ind Co Ltd 樹脂シ−トからの半導体小片取外し方法
US4843404A (en) * 1986-09-29 1989-06-27 Monarch Marking Systems, Inc. Tag web of spiral conductors
WO1988008592A1 (en) * 1987-04-27 1988-11-03 Soundcraft, Inc. Method for the manufacture of and structure of a laminated proximity card
CN1014481B (zh) * 1988-07-13 1991-10-23 徐承先 热压镶嵌法制造印刷电路板
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
US5391180A (en) * 1991-08-05 1995-02-21 United States Surgical Corporation Articulating endoscopic surgical apparatus
JPH05211184A (ja) * 1991-12-10 1993-08-20 Nec Corp ダイボンディング装置
US5649350A (en) * 1995-10-18 1997-07-22 Ericsson Inc. Method of mass producing printed circuit antennas
DE19635232A1 (de) * 1996-08-30 1998-03-05 Siemens Ag Verfahren und Vorrichtung zur plasmachemischen Zersetzung und/oder Vernichtung von Schadstoffen

Also Published As

Publication number Publication date
KR100698929B1 (ko) 2007-03-23
CN1336021A (zh) 2002-02-13
KR20010101572A (ko) 2001-11-14
JP2002536939A (ja) 2002-10-29
EP1742294A2 (en) 2007-01-10
CN1322630C (zh) 2007-06-20
EP1742294B1 (en) 2008-04-16
DE69933356T2 (de) 2007-05-10
ATE341108T1 (de) 2006-10-15
EP1742294A3 (en) 2007-06-13
ATE392726T1 (de) 2008-05-15
EP1742294B8 (en) 2010-12-22
DE69933356D1 (de) 2006-11-09

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