ATE342244T1 - Wärmeleitendes material - Google Patents

Wärmeleitendes material

Info

Publication number
ATE342244T1
ATE342244T1 AT01972038T AT01972038T ATE342244T1 AT E342244 T1 ATE342244 T1 AT E342244T1 AT 01972038 T AT01972038 T AT 01972038T AT 01972038 T AT01972038 T AT 01972038T AT E342244 T1 ATE342244 T1 AT E342244T1
Authority
AT
Austria
Prior art keywords
heat conducting
conducting material
sup
heat
thermal conductivity
Prior art date
Application number
AT01972038T
Other languages
English (en)
Inventor
Thommy Ekstroem
Jie Zheng
Kauthar Kloub
Sergey K Gordeev
Liya V Danchukova
Original Assignee
Skeleton Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skeleton Technologies Ag filed Critical Skeleton Technologies Ag
Application granted granted Critical
Publication of ATE342244T1 publication Critical patent/ATE342244T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Carbon And Carbon Compounds (AREA)
AT01972038T 2000-11-21 2001-09-10 Wärmeleitendes material ATE342244T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2000129403A RU2206502C2 (ru) 2000-11-21 2000-11-21 Композиционный материал

Publications (1)

Publication Number Publication Date
ATE342244T1 true ATE342244T1 (de) 2006-11-15

Family

ID=20242528

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01972038T ATE342244T1 (de) 2000-11-21 2001-09-10 Wärmeleitendes material

Country Status (12)

Country Link
US (1) US6914025B2 (de)
EP (1) EP1337497B1 (de)
JP (1) JP4862169B2 (de)
KR (1) KR100758178B1 (de)
CN (1) CN1263704C (de)
AT (1) ATE342244T1 (de)
AU (1) AU9184801A (de)
DE (1) DE60123825T2 (de)
ES (1) ES2273889T3 (de)
RU (1) RU2206502C2 (de)
WO (1) WO2002042240A2 (de)
ZA (1) ZA200303525B (de)

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WO2003040420A1 (fr) * 2001-11-09 2003-05-15 Sumitomo Electric Industries, Ltd. Diamant fritte presentant une conductivite thermique elevee et procede de production d'un tel diamant et puits thermique utilisant un tel diamant
GB0223321D0 (en) * 2002-10-08 2002-11-13 Element Six Ltd Heat spreader
US7173334B2 (en) * 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
AT7382U1 (de) * 2003-03-11 2005-02-25 Plansee Ag Wärmesenke mit hoher wärmeleitfähigkeit
CN100345637C (zh) * 2003-03-14 2007-10-31 攀枝花钢铁有限责任公司钢铁研究院 一种耐冲击构件及制造方法
SE0301117L (sv) * 2003-04-14 2004-10-15 Skeleton Technologies Ag Metod att tillverka en diamantkomposit
US7279023B2 (en) 2003-10-02 2007-10-09 Materials And Electrochemical Research (Mer) Corporation High thermal conductivity metal matrix composites
DE102005024790A1 (de) 2005-05-26 2006-12-07 Eos Gmbh Electro Optical Systems Strahlungsheizung zum Heizen des Aufbaumaterials in einer Lasersintervorrichtung
US7359487B1 (en) * 2005-09-15 2008-04-15 Revera Incorporated Diamond anode
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
WO2010027504A1 (en) * 2008-09-08 2010-03-11 Materials And Electrochemical Research (Mer) Corporation Machinable metal/diamond metal matrix composite compound structure and method of making same
RU2406536C2 (ru) * 2008-09-17 2010-12-20 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт материалов", ФГУП "ЦНИИМ" Лекарственный контейнер и способ его изготовления
US20110027603A1 (en) * 2008-12-03 2011-02-03 Applied Nanotech, Inc. Enhancing Thermal Properties of Carbon Aluminum Composites
US20100139885A1 (en) * 2008-12-09 2010-06-10 Renewable Thermodynamics, Llc Sintered diamond heat exchanger apparatus
US20100149756A1 (en) * 2008-12-16 2010-06-17 David Rowcliffe Heat spreader
KR101005608B1 (ko) * 2008-12-26 2011-01-05 대중기계 주식회사 재단기의 재단도 높이 조정 장치
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
CN101578030B (zh) * 2009-06-12 2011-10-26 陈伟恩 散热结构及其制造方法
JP5519788B2 (ja) 2009-07-10 2014-06-11 エタリム インコーポレイテッド 熱エネルギーと機械エネルギーとの間の変換を行うスターリングサイクル変換器
RU2413329C9 (ru) * 2009-09-08 2016-04-20 ООО "Научно-производственное предприятие "Томилинский электронный завод" Теплоотводящий элемент
WO2011049479A1 (en) * 2009-10-21 2011-04-28 Andrey Mikhailovich Abyzov Composite material having high thermal conductivity and process of fabricating same
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
WO2012040373A2 (en) 2010-09-21 2012-03-29 Ritedia Corporation Diamond particle mololayer heat spreaders and associated methods
CN103562535A (zh) 2010-11-18 2014-02-05 埃塔里姆有限公司 斯特林循环换能装置
US8946603B2 (en) * 2011-09-16 2015-02-03 Be Aerospace, Inc. Drain/fill fitting
US9315732B1 (en) * 2014-12-12 2016-04-19 Infinitus Renewable Energy, LLC Ash filter and reboiler
WO2016164498A1 (en) * 2015-04-06 2016-10-13 M Cubed Technologies, Inc. Article having diamond-only contact surfaces
WO2020018285A1 (en) 2018-07-16 2020-01-23 Corning Incorporated Methods of ceramming glass articles having improved warp
JP7116243B2 (ja) 2018-07-16 2022-08-09 コーニング インコーポレイテッド 改善された特性を有するガラスセラミックス物品およびその製造方法
CN119797767A (zh) 2018-07-16 2025-04-11 康宁股份有限公司 具有增加的抗破碎性的玻璃陶瓷制品及其制造方法
US12071367B2 (en) 2018-07-16 2024-08-27 Corning Incorporated Glass substrates including uniform parting agent coatings and methods of ceramming the same
WO2020018290A1 (en) * 2018-07-16 2020-01-23 Corning Incorporated Setter plates and methods of ceramming glass articles using the same
CN115403256B (zh) 2018-07-16 2024-12-24 康宁股份有限公司 利用成核和生长密度以及粘度变化对玻璃进行陶瓷化的方法
RU2731703C1 (ru) * 2019-11-15 2020-09-08 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт конструкционных материалов "Прометей" имени И.В. Горынина Национального исследовательского центра "Курчатовский институт" (НИЦ "Курчатовский институт" - ЦНИИ КМ "Прометей") Композиционный материал
RU2759858C1 (ru) * 2020-12-25 2021-11-18 Государственное Научное Учреждение Институт Порошковой Металлургии Имени Академика О.В. Романа Способ получения износостойкого композиционного материала на основе карбида кремния
CN112694335B (zh) * 2020-12-29 2022-09-27 北京科技大学广州新材料研究院 金刚石-碳化硅基板及其制备方法与应用
CN120590164A (zh) * 2025-06-04 2025-09-05 辽宁材料实验室 一种碳化硅-金刚石多孔复合材料及其制备方法与应用

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US4220455A (en) 1978-10-24 1980-09-02 General Electric Company Polycrystalline diamond and/or cubic boron nitride body and process for making said body
US4242106A (en) 1979-01-02 1980-12-30 General Electric Company Composite of polycrystalline diamond and/or cubic boron nitride body/silicon carbide substrate
WO1982000140A1 (en) 1980-07-09 1982-01-21 Gen Electric Silicon carbide composite and process for production
AU7919682A (en) 1981-01-21 1982-07-29 General Electric Company Silicon carbide-diamond/boron nitride composite
US4381271A (en) 1981-02-02 1983-04-26 General Electric Company Use of fired fibrous graphite in fabricating polycrystalline diamond and/or cubic boron nitride/silicon carbide/silicon composite bodies
EP0308440B1 (de) * 1987-03-23 1991-06-05 The Australian National University Presskörper aus diamant
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JPH06199571A (ja) 1991-06-20 1994-07-19 Nippon Seratetsuku:Kk 耐摩耗性セラミックス材料およびその製造方法
RU2036779C1 (ru) 1992-12-08 1995-06-09 Акционерное общество закрытого типа "Карбид" Способ получения алмазосодержащего материала
US6264882B1 (en) 1994-05-20 2001-07-24 The Regents Of The University Of California Process for fabricating composite material having high thermal conductivity
JP3617232B2 (ja) 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP3893681B2 (ja) 1997-08-19 2007-03-14 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法
RU2132268C1 (ru) * 1997-09-05 1999-06-27 Акционерное общество закрытого типа "Карбид" Способ получения абразивных зерен
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Also Published As

Publication number Publication date
JP4862169B2 (ja) 2012-01-25
HK1072929A1 (en) 2005-09-16
DE60123825T2 (de) 2007-05-16
US20040053039A1 (en) 2004-03-18
EP1337497A2 (de) 2003-08-27
CN1263704C (zh) 2006-07-12
EP1337497B1 (de) 2006-10-11
KR20030074623A (ko) 2003-09-19
DE60123825D1 (de) 2006-11-23
CN1575265A (zh) 2005-02-02
AU9184801A (en) 2002-06-03
JP2004525050A (ja) 2004-08-19
ES2273889T3 (es) 2007-05-16
RU2206502C2 (ru) 2003-06-20
US6914025B2 (en) 2005-07-05
WO2002042240A2 (en) 2002-05-30
ZA200303525B (en) 2004-03-30
WO2002042240A3 (en) 2002-10-10
KR100758178B1 (ko) 2007-09-12

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Legal Events

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