ATE342244T1 - Wärmeleitendes material - Google Patents

Wärmeleitendes material

Info

Publication number
ATE342244T1
ATE342244T1 AT01972038T AT01972038T ATE342244T1 AT E342244 T1 ATE342244 T1 AT E342244T1 AT 01972038 T AT01972038 T AT 01972038T AT 01972038 T AT01972038 T AT 01972038T AT E342244 T1 ATE342244 T1 AT E342244T1
Authority
AT
Austria
Prior art keywords
heat conducting
conducting material
sup
heat
thermal conductivity
Prior art date
Application number
AT01972038T
Other languages
English (en)
Inventor
Thommy Ekstroem
Jie Zheng
Kauthar Kloub
Sergey K Gordeev
Liya V Danchukova
Original Assignee
Skeleton Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skeleton Technologies Ag filed Critical Skeleton Technologies Ag
Application granted granted Critical
Publication of ATE342244T1 publication Critical patent/ATE342244T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT01972038T 2000-11-21 2001-09-10 Wärmeleitendes material ATE342244T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
RU2000129403A RU2206502C2 (ru) 2000-11-21 2000-11-21 Композиционный материал

Publications (1)

Publication Number Publication Date
ATE342244T1 true ATE342244T1 (de) 2006-11-15

Family

ID=20242528

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01972038T ATE342244T1 (de) 2000-11-21 2001-09-10 Wärmeleitendes material

Country Status (12)

Country Link
US (1) US6914025B2 (de)
EP (1) EP1337497B1 (de)
JP (1) JP4862169B2 (de)
KR (1) KR100758178B1 (de)
CN (1) CN1263704C (de)
AT (1) ATE342244T1 (de)
AU (1) AU9184801A (de)
DE (1) DE60123825T2 (de)
ES (1) ES2273889T3 (de)
RU (1) RU2206502C2 (de)
WO (1) WO2002042240A2 (de)
ZA (1) ZA200303525B (de)

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US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
EP1452614B1 (de) * 2001-11-09 2017-12-27 Sumitomo Electric Industries, Ltd. Gesinterter diamant mit hoher wärmeleitfähigkeit
GB0223321D0 (en) * 2002-10-08 2002-11-13 Element Six Ltd Heat spreader
US7173334B2 (en) * 2002-10-11 2007-02-06 Chien-Min Sung Diamond composite heat spreader and associated methods
AT7382U1 (de) * 2003-03-11 2005-02-25 Plansee Ag Wärmesenke mit hoher wärmeleitfähigkeit
CN100345637C (zh) * 2003-03-14 2007-10-31 攀枝花钢铁有限责任公司钢铁研究院 一种耐冲击构件及制造方法
SE0301117L (sv) * 2003-04-14 2004-10-15 Skeleton Technologies Ag Metod att tillverka en diamantkomposit
US7279023B2 (en) 2003-10-02 2007-10-09 Materials And Electrochemical Research (Mer) Corporation High thermal conductivity metal matrix composites
DE102005024790A1 (de) 2005-05-26 2006-12-07 Eos Gmbh Electro Optical Systems Strahlungsheizung zum Heizen des Aufbaumaterials in einer Lasersintervorrichtung
US7359487B1 (en) * 2005-09-15 2008-04-15 Revera Incorporated Diamond anode
US7791188B2 (en) 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
WO2010027504A1 (en) * 2008-09-08 2010-03-11 Materials And Electrochemical Research (Mer) Corporation Machinable metal/diamond metal matrix composite compound structure and method of making same
RU2406536C2 (ru) * 2008-09-17 2010-12-20 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт материалов", ФГУП "ЦНИИМ" Лекарственный контейнер и способ его изготовления
US20110027603A1 (en) * 2008-12-03 2011-02-03 Applied Nanotech, Inc. Enhancing Thermal Properties of Carbon Aluminum Composites
US20100139885A1 (en) * 2008-12-09 2010-06-10 Renewable Thermodynamics, Llc Sintered diamond heat exchanger apparatus
US20100149756A1 (en) * 2008-12-16 2010-06-17 David Rowcliffe Heat spreader
KR101005608B1 (ko) * 2008-12-26 2011-01-05 대중기계 주식회사 재단기의 재단도 높이 조정 장치
MD249Z (ro) * 2009-04-29 2011-02-28 Институт Электронной Инженерии И Промышленных Технологий Академии Наук Молдовы Procedeu de fabricare a răcitorului termoelectric pentru substratul circuitului integrat
CN101578030B (zh) * 2009-06-12 2011-10-26 陈伟恩 散热结构及其制造方法
IN2012DN00280A (de) 2009-07-10 2015-05-08 Etalim Inc
RU2413329C9 (ru) * 2009-09-08 2016-04-20 ООО "Научно-производственное предприятие "Томилинский электронный завод" Теплоотводящий элемент
WO2011049479A1 (en) * 2009-10-21 2011-04-28 Andrey Mikhailovich Abyzov Composite material having high thermal conductivity and process of fabricating same
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
US9382874B2 (en) 2010-11-18 2016-07-05 Etalim Inc. Thermal acoustic passage for a stirling cycle transducer apparatus
US8946603B2 (en) * 2011-09-16 2015-02-03 Be Aerospace, Inc. Drain/fill fitting
US9315732B1 (en) * 2014-12-12 2016-04-19 Infinitus Renewable Energy, LLC Ash filter and reboiler
EP4497739A1 (de) 2015-04-06 2025-01-29 II-VI Delaware, Inc. Gegenstand mit kontaktflächen aus ausschliesslich diamant
WO2020018285A1 (en) 2018-07-16 2020-01-23 Corning Incorporated Methods of ceramming glass articles having improved warp
US12077464B2 (en) 2018-07-16 2024-09-03 Corning Incorporated Setter plates and methods of ceramming glass articles using the same
EP3823935A1 (de) 2018-07-16 2021-05-26 Corning Incorporated Glaskeramikartikel mit verbesserten eigenschaften und verfahren zu ihrer herstellung
WO2020018408A1 (en) 2018-07-16 2020-01-23 Corning Incorporated Methods for ceramming glass with nucleation and growth density and viscosity changes
US12071367B2 (en) 2018-07-16 2024-08-27 Corning Incorporated Glass substrates including uniform parting agent coatings and methods of ceramming the same
RU2731703C1 (ru) * 2019-11-15 2020-09-08 Федеральное государственное унитарное предприятие "Центральный научно-исследовательский институт конструкционных материалов "Прометей" имени И.В. Горынина Национального исследовательского центра "Курчатовский институт" (НИЦ "Курчатовский институт" - ЦНИИ КМ "Прометей") Композиционный материал
RU2759858C1 (ru) * 2020-12-25 2021-11-18 Государственное Научное Учреждение Институт Порошковой Металлургии Имени Академика О.В. Романа Способ получения износостойкого композиционного материала на основе карбида кремния
CN112694335B (zh) * 2020-12-29 2022-09-27 北京科技大学广州新材料研究院 金刚石-碳化硅基板及其制备方法与应用
CN120590164A (zh) * 2025-06-04 2025-09-05 辽宁材料实验室 一种碳化硅-金刚石多孔复合材料及其制备方法与应用

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US4151686A (en) 1978-01-09 1979-05-01 General Electric Company Silicon carbide and silicon bonded polycrystalline diamond body and method of making it
US4220455A (en) 1978-10-24 1980-09-02 General Electric Company Polycrystalline diamond and/or cubic boron nitride body and process for making said body
US4242106A (en) 1979-01-02 1980-12-30 General Electric Company Composite of polycrystalline diamond and/or cubic boron nitride body/silicon carbide substrate
BR8108688A (pt) 1980-07-09 1982-05-25 Gen Electric Processo para a preparacao de um artigo composto de carbureto de silicio e produto composto resultante do processo
AU7919682A (en) 1981-01-21 1982-07-29 General Electric Company Silicon carbide-diamond/boron nitride composite
US4381271A (en) 1981-02-02 1983-04-26 General Electric Company Use of fired fibrous graphite in fabricating polycrystalline diamond and/or cubic boron nitride/silicon carbide/silicon composite bodies
US5010043A (en) * 1987-03-23 1991-04-23 The Australian National University Production of diamond compacts consisting essentially of diamond crystals bonded by silicon carbide
EP0383861B1 (de) * 1988-08-17 1993-08-18 The Australian National University Kompaktierter diamant mit niedrigem elektrischem spezifischem widerstand
JPH06199571A (ja) 1991-06-20 1994-07-19 Nippon Seratetsuku:Kk 耐摩耗性セラミックス材料およびその製造方法
RU2036779C1 (ru) 1992-12-08 1995-06-09 Акционерное общество закрытого типа "Карбид" Способ получения алмазосодержащего материала
US6264882B1 (en) 1994-05-20 2001-07-24 The Regents Of The University Of California Process for fabricating composite material having high thermal conductivity
JP3617232B2 (ja) * 1997-02-06 2005-02-02 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法ならびにそれを用いた半導体パッケージ
JP3893681B2 (ja) 1997-08-19 2007-03-14 住友電気工業株式会社 半導体用ヒートシンクおよびその製造方法
RU2151126C1 (ru) * 1997-09-05 2000-06-20 Акционерное общество закрытого типа "Карбид" Конструкционный материал
RU2132268C1 (ru) * 1997-09-05 1999-06-27 Акционерное общество закрытого типа "Карбид" Способ получения абразивных зерен
JP4225684B2 (ja) 1997-09-05 2009-02-18 エレメント シックス リミテッド ダイヤモンド−炭化ケイ素−ケイ素複合材料の製造法
US6447852B1 (en) * 1999-03-04 2002-09-10 Ambler Technologies, Inc. Method of manufacturing a diamond composite and a composite produced by same
AU759804B2 (en) * 1998-09-28 2003-05-01 Skeleton Technologies Ag Method of manufacturing a diamond composite and a composite produced by same
RU2147982C1 (ru) * 1998-09-28 2000-04-27 Акционерное общество закрытого типа "Карбид" Способ получения алмазосодержащего материала

Also Published As

Publication number Publication date
ZA200303525B (en) 2004-03-30
HK1072929A1 (en) 2005-09-16
EP1337497A2 (de) 2003-08-27
KR100758178B1 (ko) 2007-09-12
EP1337497B1 (de) 2006-10-11
ES2273889T3 (es) 2007-05-16
US20040053039A1 (en) 2004-03-18
AU9184801A (en) 2002-06-03
RU2206502C2 (ru) 2003-06-20
DE60123825D1 (de) 2006-11-23
CN1575265A (zh) 2005-02-02
JP2004525050A (ja) 2004-08-19
CN1263704C (zh) 2006-07-12
KR20030074623A (ko) 2003-09-19
US6914025B2 (en) 2005-07-05
JP4862169B2 (ja) 2012-01-25
WO2002042240A3 (en) 2002-10-10
WO2002042240A2 (en) 2002-05-30
DE60123825T2 (de) 2007-05-16

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Legal Events

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