ATE343314T1 - Apparat und methode zur herstellung von mehrschichtigen leiterplatten - Google Patents

Apparat und methode zur herstellung von mehrschichtigen leiterplatten

Info

Publication number
ATE343314T1
ATE343314T1 AT00950063T AT00950063T ATE343314T1 AT E343314 T1 ATE343314 T1 AT E343314T1 AT 00950063 T AT00950063 T AT 00950063T AT 00950063 T AT00950063 T AT 00950063T AT E343314 T1 ATE343314 T1 AT E343314T1
Authority
AT
Austria
Prior art keywords
conductor
laminated sheet
sheet covered
prepreg
circuit boards
Prior art date
Application number
AT00950063T
Other languages
English (en)
Inventor
Tadahiro Ohmi
Hidetoshi Murakami
Higashiiwai-Gun Miyanowaki
Original Assignee
Daishodenshi Kk
Tadahiro Ohmi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daishodenshi Kk, Tadahiro Ohmi filed Critical Daishodenshi Kk
Application granted granted Critical
Publication of ATE343314T1 publication Critical patent/ATE343314T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
AT00950063T 1999-08-13 2000-08-11 Apparat und methode zur herstellung von mehrschichtigen leiterplatten ATE343314T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22952299A JP4455696B2 (ja) 1999-08-13 1999-08-13 多層プリント配線基板の製造方法及び製造装置

Publications (1)

Publication Number Publication Date
ATE343314T1 true ATE343314T1 (de) 2006-11-15

Family

ID=16893497

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00950063T ATE343314T1 (de) 1999-08-13 2000-08-11 Apparat und methode zur herstellung von mehrschichtigen leiterplatten

Country Status (8)

Country Link
US (1) US7185421B1 (de)
EP (1) EP1213953B1 (de)
JP (1) JP4455696B2 (de)
KR (1) KR20020060691A (de)
AT (1) ATE343314T1 (de)
DE (1) DE60031424T2 (de)
TW (1) TWI224556B (de)
WO (1) WO2001013688A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2009307761B2 (en) * 2008-10-22 2014-10-23 Cytec Technology Corp. Improved processing of polymer matrix composites
RU2474985C1 (ru) * 2011-07-27 2013-02-10 Открытое акционерное общество "Федеральный научно-производственный центр Нижегородский научно-исследовательский институт радиотехники" Способ изготовления многослойных печатных плат
CN105163486A (zh) * 2015-10-07 2015-12-16 江西景旺精密电路有限公司 一种高层厚铜电路板及制作工艺
CN109526138B (zh) * 2018-11-27 2024-04-12 惠州市金百泽电路科技有限公司 一种刚性无玻纤光电印制板及其加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3344515A (en) * 1961-04-21 1967-10-03 Litton Systems Inc Multilayer laminated wiring
JPS60258996A (ja) * 1984-03-09 1985-12-20 アール．ダブリュ．キュー．インコ． 多層プリント配線板の積層方法および装置
US5064583A (en) * 1989-08-01 1991-11-12 Zycon Corporation Method for applying mold release coating to separator plates for molding printed circuit boards
CA2023713A1 (en) * 1989-10-23 1991-04-24 Mark S. O'brien Gaseous isostatic lamination process
JPH0732898B2 (ja) 1990-04-13 1995-04-12 株式会社日立製作所 シートの清浄装置およびその清浄方法
JP2555231B2 (ja) * 1991-05-21 1996-11-20 富士通株式会社 窒化アルミニウム多層回路基板の製造方法
JPH05261718A (ja) 1992-03-19 1993-10-12 Ngk Insulators Ltd グリーンシート積層体の異物除去装置
JP3365511B2 (ja) * 1993-04-05 2003-01-14 セイコーエプソン株式会社 ろう材による接合方法及び装置
US5571337A (en) * 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
JP3296479B2 (ja) 1997-05-29 2002-07-02 トヨタ車体株式会社 ダクトの固定構造
JP3359540B2 (ja) 1997-06-27 2002-12-24 京セラ株式会社 多層プリント配線基板の製造方法

Also Published As

Publication number Publication date
JP2001053442A (ja) 2001-02-23
KR20020060691A (ko) 2002-07-18
EP1213953A4 (de) 2004-10-06
EP1213953B1 (de) 2006-10-18
TWI224556B (en) 2004-12-01
JP4455696B2 (ja) 2010-04-21
EP1213953A1 (de) 2002-06-12
WO2001013688A1 (fr) 2001-02-22
DE60031424T2 (de) 2007-08-30
DE60031424D1 (de) 2006-11-30
US7185421B1 (en) 2007-03-06

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