ATE344830T1 - Cmp-polierzusammensetzung für metall - Google Patents

Cmp-polierzusammensetzung für metall

Info

Publication number
ATE344830T1
ATE344830T1 AT01950299T AT01950299T ATE344830T1 AT E344830 T1 ATE344830 T1 AT E344830T1 AT 01950299 T AT01950299 T AT 01950299T AT 01950299 T AT01950299 T AT 01950299T AT E344830 T1 ATE344830 T1 AT E344830T1
Authority
AT
Austria
Prior art keywords
metal
polishing composition
cmp polishing
compositions
tantalum
Prior art date
Application number
AT01950299T
Other languages
English (en)
Inventor
Shumin Wang
Steven K Grumbine
Christopher C Streinz
Eric W G Hoglund
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE344830T1 publication Critical patent/ATE344830T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT01950299T 2000-07-05 2001-06-14 Cmp-polierzusammensetzung für metall ATE344830T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/609,882 US6592776B1 (en) 1997-07-28 2000-07-05 Polishing composition for metal CMP

Publications (1)

Publication Number Publication Date
ATE344830T1 true ATE344830T1 (de) 2006-11-15

Family

ID=24442734

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01950299T ATE344830T1 (de) 2000-07-05 2001-06-14 Cmp-polierzusammensetzung für metall

Country Status (9)

Country Link
US (2) US6592776B1 (de)
EP (1) EP1299489B1 (de)
JP (1) JP4510374B2 (de)
CN (1) CN1216953C (de)
AT (1) ATE344830T1 (de)
AU (1) AU2001271308A1 (de)
DE (1) DE60124404T2 (de)
TW (1) TWI261063B (de)
WO (1) WO2002002706A1 (de)

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US20080148652A1 (en) * 2006-12-21 2008-06-26 Junaid Ahmed Siddiqui Compositions for chemical mechanical planarization of copper
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TWI555830B (zh) * 2010-11-08 2016-11-01 福吉米股份有限公司 研磨用組成物及利用其的半導體基板的研磨方法
US8524540B2 (en) * 2011-02-01 2013-09-03 Nilesh Kapadia Adhesion promoting composition for metal leadframes
CN104371551B (zh) * 2013-08-14 2018-01-12 安集微电子（上海）有限公司 一种碱性阻挡层化学机械抛光液
CN103484876B (zh) * 2013-09-23 2016-01-13 无锡阳工机械制造有限公司 一种除锈浆料
CN103526207B (zh) * 2013-09-23 2016-01-20 无锡阳工机械制造有限公司 一种除锈浆料
CN103498160B (zh) * 2013-09-23 2016-01-20 无锡阳工机械制造有限公司 一种抛光浆料
CN103498161B (zh) * 2013-09-23 2016-01-20 无锡阳工机械制造有限公司 一种金属抛光防腐浆料
CN104745087B (zh) * 2013-12-25 2018-07-24 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
US9385000B2 (en) * 2014-01-24 2016-07-05 United Microelectronics Corp. Method of performing etching process
KR102463341B1 (ko) 2015-01-13 2022-11-04 씨엠씨 머티리얼즈, 인코포레이티드 Cmp 후 반도체 웨이퍼 세정용 세정 조성물 및 방법
CN105369273A (zh) * 2015-10-15 2016-03-02 当涂县维思共创工业产品设计有限公司 一种铝型材表面清洗抛光剂
CN105331992A (zh) * 2015-10-15 2016-02-17 当涂县维思共创工业产品设计有限公司 一种铝表面脱脂除油剂
US10586914B2 (en) 2016-10-14 2020-03-10 Applied Materials, Inc. Method of forming ultra-smooth bottom electrode surface for depositing magnetic tunnel junctions
US10037889B1 (en) * 2017-03-29 2018-07-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cationic particle containing slurries and methods of using them for CMP of spin-on carbon films
KR102619857B1 (ko) * 2020-05-20 2023-12-29 삼성에스디아이 주식회사 텅스텐 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 연마 방법

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Also Published As

Publication number Publication date
DE60124404D1 (de) 2006-12-21
EP1299489B1 (de) 2006-11-08
TWI261063B (en) 2006-09-01
WO2002002706A1 (en) 2002-01-10
JP4510374B2 (ja) 2010-07-21
CN1436225A (zh) 2003-08-13
CN1216953C (zh) 2005-08-31
US20030203635A1 (en) 2003-10-30
EP1299489A1 (de) 2003-04-09
DE60124404T2 (de) 2007-08-23
AU2001271308A1 (en) 2002-01-14
JP2004502823A (ja) 2004-01-29
US6592776B1 (en) 2003-07-15
US6767476B2 (en) 2004-07-27

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