ATE338100T1 - Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen - Google Patents

Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen

Info

Publication number
ATE338100T1
ATE338100T1 AT00943380T AT00943380T ATE338100T1 AT E338100 T1 ATE338100 T1 AT E338100T1 AT 00943380 T AT00943380 T AT 00943380T AT 00943380 T AT00943380 T AT 00943380T AT E338100 T1 ATE338100 T1 AT E338100T1
Authority
AT
Austria
Prior art keywords
abrasive particles
composition containing
containing silane
cmp composition
modified abrasive
Prior art date
Application number
AT00943380T
Other languages
English (en)
Inventor
Steven K Grumbine
Christopher C Streinz
Shumin Wang
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE338100T1 publication Critical patent/ATE338100T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Disintegrating Or Milling (AREA)
AT00943380T 1999-07-07 2000-07-05 Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen ATE338100T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07

Publications (1)

Publication Number Publication Date
ATE338100T1 true ATE338100T1 (de) 2006-09-15

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00943380T ATE338100T1 (de) 1999-07-07 2000-07-05 Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen

Country Status (14)

Country Link
US (2) US6582623B1 (de)
EP (1) EP1200532B1 (de)
JP (2) JP2003520283A (de)
KR (1) KR100590665B1 (de)
CN (1) CN1209429C (de)
AT (1) ATE338100T1 (de)
AU (1) AU5785700A (de)
CA (1) CA2378492A1 (de)
DE (1) DE60030444T2 (de)
HK (1) HK1046151A1 (de)
IL (1) IL147039A0 (de)
MY (1) MY126717A (de)
TW (1) TW538110B (de)
WO (1) WO2001004226A2 (de)

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KR20230055586A (ko) * 2021-10-19 2023-04-26 에스케이하이닉스 주식회사 보론 실리콘 화합물 연마용 cmp 슬러리 조성물과 이를 이용한 cmp 방법 및 반도체 소자의 제조 방법
KR102765056B1 (ko) * 2021-10-21 2025-02-06 한남대학교 산학협력단 화학-기계적 연마 슬러리용 무기산화물 입자의 산화제 기능화를 위한 실란 링커의 제조방법
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IL147039A0 (en) 2002-08-14
AU5785700A (en) 2001-01-30
DE60030444D1 (de) 2006-10-12
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DE60030444T2 (de) 2006-12-14
KR20020026940A (ko) 2002-04-12
US20030209522A1 (en) 2003-11-13
WO2001004226A2 (en) 2001-01-18
US6582623B1 (en) 2003-06-24
KR100590665B1 (ko) 2006-06-19
JP2007088499A (ja) 2007-04-05
HK1046151A1 (zh) 2002-12-27
TW538110B (en) 2003-06-21
CA2378492A1 (en) 2001-01-18
MY126717A (en) 2006-10-31
EP1200532B1 (de) 2006-08-30
WO2001004226A3 (en) 2002-10-03
EP1200532A1 (de) 2002-05-02
CN1209429C (zh) 2005-07-06

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