ATE338100T1 - Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen - Google Patents

Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen

Info

Publication number
ATE338100T1
ATE338100T1 AT00943380T AT00943380T ATE338100T1 AT E338100 T1 ATE338100 T1 AT E338100T1 AT 00943380 T AT00943380 T AT 00943380T AT 00943380 T AT00943380 T AT 00943380T AT E338100 T1 ATE338100 T1 AT E338100T1
Authority
AT
Austria
Prior art keywords
abrasive particles
composition containing
containing silane
cmp composition
modified abrasive
Prior art date
Application number
AT00943380T
Other languages
English (en)
Inventor
Steven K Grumbine
Christopher C Streinz
Shumin Wang
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE338100T1 publication Critical patent/ATE338100T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Disintegrating Or Milling (AREA)
AT00943380T 1999-07-07 2000-07-05 Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen ATE338100T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14270699P 1999-07-07 1999-07-07

Publications (1)

Publication Number Publication Date
ATE338100T1 true ATE338100T1 (de) 2006-09-15

Family

ID=22500954

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00943380T ATE338100T1 (de) 1999-07-07 2000-07-05 Cmp-zusammensetzung enthaltend silanmodifizierte- schleifteilchen

Country Status (14)

Country Link
US (2) US6582623B1 (de)
EP (1) EP1200532B1 (de)
JP (2) JP2003520283A (de)
KR (1) KR100590665B1 (de)
CN (1) CN1209429C (de)
AT (1) ATE338100T1 (de)
AU (1) AU5785700A (de)
CA (1) CA2378492A1 (de)
DE (1) DE60030444T2 (de)
HK (1) HK1046151A1 (de)
IL (1) IL147039A0 (de)
MY (1) MY126717A (de)
TW (1) TW538110B (de)
WO (1) WO2001004226A2 (de)

Families Citing this family (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6592776B1 (en) * 1997-07-28 2003-07-15 Cabot Microelectronics Corporation Polishing composition for metal CMP
IL147039A0 (en) * 1999-07-07 2002-08-14 Cabot Microelectronics Corp Cmp composition containing silane modified abrasive particles
WO2001057150A1 (en) 2000-02-02 2001-08-09 Rodel Holdings, Inc. Polishing composition
US6646348B1 (en) * 2000-07-05 2003-11-11 Cabot Microelectronics Corporation Silane containing polishing composition for CMP
CN1255854C (zh) * 2001-01-16 2006-05-10 卡伯特微电子公司 含有草酸铵的抛光系统及方法
US6656241B1 (en) * 2001-06-14 2003-12-02 Ppg Industries Ohio, Inc. Silica-based slurry
US6953389B2 (en) * 2001-08-09 2005-10-11 Cheil Industries, Inc. Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
TW591089B (en) * 2001-08-09 2004-06-11 Cheil Ind Inc Slurry composition for use in chemical mechanical polishing of metal wiring
DE60215095T2 (de) 2001-09-19 2007-05-10 Parker-Hannifin Corp., Cleveland Motorantrieb und System
CN100386850C (zh) 2001-10-31 2008-05-07 日立化成工业株式会社 研磨液及研磨方法
JP2003277731A (ja) * 2002-03-26 2003-10-02 Catalysts & Chem Ind Co Ltd 研磨用粒子および研磨材
US6716771B2 (en) * 2002-04-09 2004-04-06 Intel Corporation Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface
US6833186B2 (en) 2002-04-10 2004-12-21 Ppg Industries Ohio, Inc. Mineral-filled coatings having enhanced abrasion resistance and wear clarity and methods for using the same
JP4554142B2 (ja) * 2002-04-30 2010-09-29 日揮触媒化成株式会社 基板洗浄用粒子および該基板洗浄用粒子を含む洗浄材、基材の洗浄方法
US6706398B1 (en) * 2002-09-13 2004-03-16 Dow Corning Corporation Organosilicon compounds and blends for treating silica
KR100442549B1 (ko) * 2002-10-16 2004-07-30 제일모직주식회사 연마성능이 우수하고 안정성이 향상된, 금속 연마를 위한ｃｍｐ용 슬러리 조성물 및 그 제조방법
US6893476B2 (en) 2002-12-09 2005-05-17 Dupont Air Products Nanomaterials Llc Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal
US7044836B2 (en) 2003-04-21 2006-05-16 Cabot Microelectronics Corporation Coated metal oxide particles for CMP
US20070015448A1 (en) * 2003-08-07 2007-01-18 Ppg Industries Ohio, Inc. Polishing pad having edge surface treatment
IL157681A0 (en) 2003-09-01 2004-03-28 J G Systems Inc Improved abrasives for chemical-mechanical polishing applications
US7247567B2 (en) * 2004-06-16 2007-07-24 Cabot Microelectronics Corporation Method of polishing a tungsten-containing substrate
FR2872823B1 (fr) * 2004-07-08 2006-10-06 Kemesys Composition de polissage mecano chimique, procede de preparation, et utilisation
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060096179A1 (en) * 2004-11-05 2006-05-11 Cabot Microelectronics Corporation CMP composition containing surface-modified abrasive particles
KR100704831B1 (ko) * 2005-06-01 2007-04-09 주식회사 아이너스기술 3차원 스캐너를 이용한 실시간 검사 안내 시스템 및 방법
US7294049B2 (en) 2005-09-01 2007-11-13 Micron Technology, Inc. Method and apparatus for removing material from microfeature workpieces
SG173361A1 (en) 2006-07-12 2011-08-29 Cabot Microelectronics Corp Cmp method for metal-containing substrates
US7691287B2 (en) * 2007-01-31 2010-04-06 Dupont Air Products Nanomaterials Llc Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization
CN101338082A (zh) * 2007-07-06 2009-01-07 安集微电子（上海）有限公司 改性二氧化硅溶胶及其制备方法和应用
SG184772A1 (en) * 2007-09-21 2012-10-30 Cabot Microelectronics Corp Polishing composition and method utilizing abrasive particles treated with an aminosilane
CN101802125B (zh) * 2007-09-21 2013-11-06 卡伯特微电子公司 使用经氨基硅烷处理的研磨剂颗粒的抛光组合物和方法
EP2364241A4 (de) * 2008-04-18 2013-12-11 Saint Gobain Abrasives Inc Oberflächenmodifikation von schleifkörnern durch hydrophiles und hydrophobes silan
JP5843613B2 (ja) * 2009-01-20 2016-01-13 キャボット コーポレイションＣａｂｏｔ Ｃｏｒｐｏｒａｔｉｏｎ シラン変性金属酸化物を含む組成物
JP5896925B2 (ja) * 2010-02-24 2016-03-30 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 研磨物品、その製造方法及びその使用方法
KR101243331B1 (ko) * 2010-12-17 2013-03-13 솔브레인 주식회사 화학 기계적 연마 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법
EP2658680B1 (de) 2010-12-31 2020-12-09 Saint-Gobain Ceramics & Plastics, Inc. Schleifgegenstanden mit Schleifpartikeln mit besonderen Formen und Verfahren zur Formung solcher Gegenständen
WO2013003830A2 (en) 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles including abrasive particles of silicon nitride
WO2013003831A2 (en) 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. Liquid phase sintered silicon carbide abrasive particles
US9517546B2 (en) 2011-09-26 2016-12-13 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming
KR102074138B1 (ko) 2011-12-30 2020-02-07 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성방법
PL2797716T3 (pl) 2011-12-30 2021-07-05 Saint-Gobain Ceramics & Plastics, Inc. Kompozytowe ukształtowane cząstki ścierne i sposób ich formowania
KR20140106737A (ko) 2011-12-30 2014-09-03 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자들 형성
US8840696B2 (en) 2012-01-10 2014-09-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
EP2802436B1 (de) 2012-01-10 2019-09-25 Saint-Gobain Ceramics & Plastics, Inc. Schleifpartikel mit komplexen formen
WO2013149209A1 (en) 2012-03-30 2013-10-03 Saint-Gobain Abrasives, Inc. Abrasive products having fibrillated fibers
US8778212B2 (en) * 2012-05-22 2014-07-15 Cabot Microelectronics Corporation CMP composition containing zirconia particles and method of use
KR101813466B1 (ko) 2012-05-23 2017-12-29 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자들 및 이의 형성방법
WO2014005120A1 (en) 2012-06-29 2014-01-03 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
EP2906392B1 (de) 2012-10-15 2025-04-16 Saint-Gobain Abrasives, Inc. Schleifpartikel mit besonderen formen und verfahren zur formung solcher partikel
JP6057706B2 (ja) * 2012-12-28 2017-01-11 株式会社フジミインコーポレーテッド 研磨用組成物
CN104994995B (zh) 2012-12-31 2018-12-14 圣戈本陶瓷及塑料股份有限公司 颗粒材料及其形成方法
KR101427883B1 (ko) * 2013-02-08 2014-08-07 주식회사 케이씨텍 표면 개질된 연마입자, 그의 제조 방법 및 그를 포함하는 슬러리 조성물
WO2014161001A1 (en) 2013-03-29 2014-10-02 Saint-Gobain Abrasives, Inc. Abrasive particles having particular shapes and methods of forming such particles
US10005171B2 (en) 2013-06-24 2018-06-26 3M Innovative Properties Company Abrasive particles, method of making abrasive particles, and abrasive articles
TW201502263A (zh) 2013-06-28 2015-01-16 Saint Gobain Ceramics 包含成形研磨粒子之研磨物品
CN104371553B (zh) * 2013-08-14 2017-10-13 安集微电子（上海）有限公司 一种化学机械抛光液以及应用
CN104371551B (zh) * 2013-08-14 2018-01-12 安集微电子（上海）有限公司 一种碱性阻挡层化学机械抛光液
KR20160057397A (ko) * 2013-09-20 2016-05-23 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
CN111978921A (zh) 2013-09-30 2020-11-24 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
EP3081377A4 (de) * 2013-12-13 2016-12-07 Fujimi Inc Artikel mit einem metalloxidfilm
CN104745083B (zh) * 2013-12-25 2018-09-14 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
CN104745087B (zh) * 2013-12-25 2018-07-24 安集微电子（上海）有限公司 一种化学机械抛光液以及抛光方法
KR102081045B1 (ko) 2013-12-31 2020-02-26 생-고뱅 어브레이시브즈, 인코포레이티드 형상화 연마 입자들을 포함하는 연마 물품
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
US9303189B2 (en) 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US9303188B2 (en) 2014-03-11 2016-04-05 Cabot Microelectronics Corporation Composition for tungsten CMP
US9238754B2 (en) 2014-03-11 2016-01-19 Cabot Microelectronics Corporation Composition for tungsten CMP
US9309442B2 (en) 2014-03-21 2016-04-12 Cabot Microelectronics Corporation Composition for tungsten buffing
US9127187B1 (en) 2014-03-24 2015-09-08 Cabot Microelectronics Corporation Mixed abrasive tungsten CMP composition
US9303190B2 (en) 2014-03-24 2016-04-05 Cabot Microelectronics Corporation Mixed abrasive tungsten CMP composition
AU2015247826A1 (en) 2014-04-14 2016-11-10 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
AU2015247739B2 (en) 2014-04-14 2017-10-26 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
WO2015184355A1 (en) 2014-05-30 2015-12-03 Saint-Gobain Abrasives, Inc. Method of using an abrasive article including shaped abrasive particles
KR102775584B1 (ko) 2014-06-25 2025-03-06 씨엠씨 머티리얼즈 엘엘씨 콜로이드성 실리카 화학적-기계적 연마 조성물
EP3161098B1 (de) 2014-06-25 2022-10-26 CMC Materials, Inc. Chemisch-mechanische wolframpolierzusammensetzung
TWI564380B (zh) * 2014-06-25 2017-01-01 卡博特微電子公司 銅障壁層化學機械拋光組合物
CN104263248B (zh) * 2014-09-26 2016-06-29 深圳市力合材料有限公司 一种适用于低下压力的弱酸性铜抛光液
US9707529B2 (en) 2014-12-23 2017-07-18 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
US9676981B2 (en) 2014-12-24 2017-06-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle fractions and method of forming same
CN105985522B (zh) * 2014-12-24 2019-06-28 财团法人工业技术研究院 高分支聚硅氧烷与混成材料及其形成方法
TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
US10196551B2 (en) 2015-03-31 2019-02-05 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
EP3307483B1 (de) 2015-06-11 2020-06-17 Saint-Gobain Ceramics&Plastics, Inc. Schleifartikel mit geformten schleifpartikeln
JP6408453B2 (ja) * 2015-11-16 2018-10-17 信越化学工業株式会社 研磨組成物及び研磨方法
KR102313436B1 (ko) 2016-05-10 2021-10-19 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 입자들 및 그 형성 방법
EP4071224A3 (de) 2016-05-10 2023-01-04 Saint-Gobain Ceramics and Plastics, Inc. Verfahren zur formung von schleifpartikeln
US11152208B2 (en) * 2016-09-15 2021-10-19 Flosfia Inc. Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of doping
EP4349896A3 (de) 2016-09-29 2024-06-12 Saint-Gobain Abrasives, Inc. Feste schleifartikel und verfahren zur formung davon
US9803108B1 (en) 2016-10-19 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Aqueous compositions of stabilized aminosilane group containing silica particles
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
CN110719946B (zh) 2017-06-21 2022-07-15 圣戈本陶瓷及塑料股份有限公司 颗粒材料及其形成方法
WO2019012388A1 (en) * 2017-07-11 2019-01-17 3M Innovative Properties Company ABRASIVE ARTICLES COMPRISING CONFORMABLE COATINGS AND POLISHING SYSTEM COMPRISING THE SAME
JP7031485B2 (ja) * 2018-05-11 2022-03-08 昭和電工マテリアルズ株式会社 Ｃｍｐ研磨剤及びその製造方法、並びにｃｍｐ研磨方法
CN113677621A (zh) * 2019-03-29 2021-11-19 科瑞泰克集团股份有限公司 制备环硅烷的方法
KR102525287B1 (ko) * 2019-10-18 2023-04-24 삼성에스디아이 주식회사 구리 막 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법
CN111087930A (zh) * 2019-12-23 2020-05-01 长江存储科技有限责任公司 一种化学机械抛光研磨剂的制备方法及化学机械抛光方法
WO2021133876A1 (en) 2019-12-27 2021-07-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
US11926019B2 (en) 2019-12-27 2024-03-12 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
EP4081370A4 (de) 2019-12-27 2024-04-24 Saint-Gobain Ceramics & Plastics Inc. Schleifartikel und verfahren zur formung davon
KR102589505B1 (ko) * 2020-03-03 2023-10-13 삼성에스디아이 주식회사 구리 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법
KR102619857B1 (ko) * 2020-05-20 2023-12-29 삼성에스디아이 주식회사 텅스텐 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 연마 방법
KR102415203B1 (ko) * 2020-08-24 2022-06-30 에스케이씨솔믹스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
KR102577164B1 (ko) 2020-12-29 2023-09-08 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 연마 조성물을 적용한 기판의 연마방법
CN112680187A (zh) * 2021-01-04 2021-04-20 上海晖研材料科技有限公司 一种表面改性的二氧化硅及含其的磨料组合物
KR20220131152A (ko) * 2021-03-19 2022-09-27 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마 방법, 및 반도체 기판의 제조 방법
KR20230055586A (ko) * 2021-10-19 2023-04-26 에스케이하이닉스 주식회사 보론 실리콘 화합물 연마용 cmp 슬러리 조성물과 이를 이용한 cmp 방법 및 반도체 소자의 제조 방법
KR102765056B1 (ko) * 2021-10-21 2025-02-06 한남대학교 산학협력단 화학-기계적 연마 슬러리용 무기산화물 입자의 산화제 기능화를 위한 실란 링커의 제조방법
EP4457054A4 (de) 2021-12-30 2026-01-14 Saint Gobain Abrasives Inc Schleifartikel und verfahren zur formung davon
MX2024007593A (es) 2021-12-30 2024-08-20 Saint Gobain Abrasives Inc Artículos abrasivos y métodos de formación de los mismos.
CN118591436A (zh) 2021-12-30 2024-09-03 圣戈班磨料磨具有限公司 磨料制品及其形成方法
US12552962B2 (en) * 2022-01-07 2026-02-17 Samsung Sdi Co., Ltd. CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same
TW202523821A (zh) 2023-11-20 2025-06-16 美商慧盛材料美國責任有限公司 用於研磨多晶矽膜的cmp配方及方法
WO2025231281A1 (en) 2024-05-03 2025-11-06 Versum Materials Us, Llc Cmp formulations and methods for polishing ruthenium films

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4563483A (en) * 1983-07-06 1986-01-07 Creative Products Resource Ltd. Concrete cleaning composition
US5226930A (en) * 1988-06-03 1993-07-13 Monsanto Japan, Ltd. Method for preventing agglomeration of colloidal silica and silicon wafer polishing composition using the same
JP3303544B2 (ja) * 1994-07-27 2002-07-22 ソニー株式会社 半導体装置の製造方法および配線層表面研磨用のスラリーおよび配線層表面研磨用のスラリーの製造方法
US5645736A (en) * 1995-12-29 1997-07-08 Symbios Logic Inc. Method for polishing a wafer
JP3927270B2 (ja) * 1996-12-27 2007-06-06 富士通株式会社 研磨剤、研磨方法および半導体装置の製造方法
US6299659B1 (en) * 1998-08-05 2001-10-09 Showa Denko K.K. Polishing material composition and polishing method for polishing LSI devices
US6372648B1 (en) 1998-11-16 2002-04-16 Texas Instruments Incorporated Integrated circuit planarization method
IL147039A0 (en) * 1999-07-07 2002-08-14 Cabot Microelectronics Corp Cmp composition containing silane modified abrasive particles

Also Published As

Publication number Publication date
KR100590665B1 (ko) 2006-06-19
DE60030444T2 (de) 2006-12-14
HK1046151A1 (zh) 2002-12-27
EP1200532B1 (de) 2006-08-30
JP2007088499A (ja) 2007-04-05
WO2001004226A3 (en) 2002-10-03
IL147039A0 (en) 2002-08-14
US20030209522A1 (en) 2003-11-13
KR20020026940A (ko) 2002-04-12
CA2378492A1 (en) 2001-01-18
US6582623B1 (en) 2003-06-24
TW538110B (en) 2003-06-21
CN1209429C (zh) 2005-07-06
AU5785700A (en) 2001-01-30
DE60030444D1 (de) 2006-10-12
MY126717A (en) 2006-10-31
EP1200532A1 (de) 2002-05-02
JP2003520283A (ja) 2003-07-02
CN1367809A (zh) 2002-09-04
WO2001004226A2 (en) 2001-01-18

Similar Documents

Publication Publication Date Title
IL147039A0 (en) Cmp composition containing silane modified abrasive particles
WO2004072199A3 (en) Mixed-abrasive polishing composition and method for using the same
AU4810200A (en) Slurry composition and method of chemical mechanical polishing using same
ATE361960T1 (de) Schleifmittelzusammensetzung und dieses gebrauchendes polierverfahren
MY150866A (en) Compositions and methods for polishing silicon nitride materials
TW200740972A (en) Metal polishing slurry
TW200516132A (en) Abrasive particles for chemical mechanical polishing
AU2001271308A1 (en) Polishing composition for metal cmp
WO2010120784A8 (en) Chemical mechanical polishing of silicon carbide comprising surfaces
AU2002361775A1 (en) Abrasive composition containing organic particles for chemical mechanical planarization
EP1242557B8 (de) Verfahren zum polieren oder planarisieren eines substrats
EP1485440A4 (de) An feststoff gebundener radikalbildender aktivator und verwendung zur verbesserung von formulierungen für das chemisch-mechanische polieren
WO2005013937A3 (en) Novel compositions of sildenafil free base
WO2006074248A3 (en) Engineered non-polymeric organic particles for chemical mechanical planarization
DE602004027901D1 (de) Belegte metalloxidteilchen für cmp
MY147273A (en) Oxidation-stabilized cmp compositions and methods
AU2002213054A1 (en) Ceramic aggregate particles
EP1302522A3 (de) Gelfreie kolloidale Schleif- und Polierzusammensetzungen und Verfahren zu ihrer Verwendung
MY153666A (en) Cmp method for metal-containing substrates
MY138857A (en) High selectivity colloidal silica slurry
MY128556A (en) Use of a wafer edge polishing composition
AU1660001A (en) Composition and method for planarizing surfaces
SG155045A1 (en) Semiconductor polishing compound, process for its production and polishing method
TW200738856A (en) Polishing composition and polishing method
MY151925A (en) Silicon oxide polishing method utilizing colloidal silica

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties