ATE348340T1 - Verfahren und system zur prüfung von rf chips - Google Patents

Verfahren und system zur prüfung von rf chips

Info

Publication number
ATE348340T1
ATE348340T1 AT03798278T AT03798278T ATE348340T1 AT E348340 T1 ATE348340 T1 AT E348340T1 AT 03798278 T AT03798278 T AT 03798278T AT 03798278 T AT03798278 T AT 03798278T AT E348340 T1 ATE348340 T1 AT E348340T1
Authority
AT
Austria
Prior art keywords
chips
testing
test
tested
signals generated
Prior art date
Application number
AT03798278T
Other languages
English (en)
Inventor
Brian J Philips I P St Guthrie
Adrian G Philips I P S Spencer
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE348340T1 publication Critical patent/ATE348340T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Near-Field Transmission Systems (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Monitoring And Testing Of Transmission In General (AREA)
AT03798278T 2002-09-28 2003-09-12 Verfahren und system zur prüfung von rf chips ATE348340T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0222556.3A GB0222556D0 (en) 2002-09-28 2002-09-28 RF chip testing method and system

Publications (1)

Publication Number Publication Date
ATE348340T1 true ATE348340T1 (de) 2007-01-15

Family

ID=9944942

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03798278T ATE348340T1 (de) 2002-09-28 2003-09-12 Verfahren und system zur prüfung von rf chips

Country Status (9)

Country Link
US (1) US20060038579A1 (de)
EP (1) EP1546739B1 (de)
JP (1) JP2006500578A (de)
CN (1) CN1685239A (de)
AT (1) ATE348340T1 (de)
AU (1) AU2003259511A1 (de)
DE (1) DE60310428D1 (de)
GB (1) GB0222556D0 (de)
WO (1) WO2004029636A1 (de)

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DE102005048872A1 (de) * 2005-10-12 2007-04-26 Mühlbauer Ag Testkopfeinrichtung
JP2007124321A (ja) * 2005-10-28 2007-05-17 Denso Wave Inc 無線通信システム
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
US7773531B2 (en) * 2008-07-10 2010-08-10 Litepoint Corporation Method for testing data packet transceiver using loop back packet generation
US9146277B2 (en) * 2008-11-07 2015-09-29 Infineon Technologies Ag Test board and test system
TWI386650B (zh) * 2008-11-19 2013-02-21 京元電子股份有限公司 射頻晶片測試方法
CN101436911B (zh) * 2008-12-05 2012-08-22 上海复控华龙微系统技术有限公司 一种用于无线数据传输模块的生产测试的实现方法
DE102008061474B4 (de) * 2008-12-10 2019-07-04 Snaptrack, Inc. Frontendmodul und Verfahren zum Testen eines Frontendmoduls
US8255183B1 (en) 2009-06-30 2012-08-28 Qualcomm Atheros, Inc Communication unit with analog test unit
US10320494B2 (en) 2011-06-13 2019-06-11 Mediatek Inc. RF testing system using integrated circuit
CN102608517A (zh) * 2012-02-16 2012-07-25 工业和信息化部电子第五研究所 一种创建集成电路测试程序包的快速方法
CN103675552B (zh) * 2013-12-23 2016-09-14 北京交大思诺科技股份有限公司 机车信号设备抗干扰能力的测试系统及方法
CN105652109A (zh) * 2014-12-01 2016-06-08 联发科技股份有限公司 系统与已校正装置
CN104597323B (zh) * 2015-01-26 2018-01-30 中国电子科技集团公司第五十四研究所 一种测量多通道射频芯片相位偏差的测试装置及方法
CN105467295A (zh) * 2015-11-23 2016-04-06 硅谷数模半导体（北京）有限公司 电子芯片的测试系统、方法及装置
CN106872874A (zh) * 2015-12-11 2017-06-20 华大半导体有限公司 一种用于rfid标签芯片集中cp测试方法
CN105959071A (zh) * 2016-04-22 2016-09-21 北京联盛德微电子有限责任公司 一种接收机芯片的校准方法和装置
CN105974301A (zh) * 2016-06-30 2016-09-28 成绎半导体技术（上海）有限公司 芯片测试系统
KR102293662B1 (ko) 2017-09-27 2021-08-25 삼성전자 주식회사 빔포밍 프로세서 시험 장치
CN112540282B (zh) * 2019-09-20 2024-11-12 台湾中华精测科技股份有限公司 测试装置
CN110763935B (zh) * 2019-10-25 2021-12-03 广州视源电子科技股份有限公司 抗干扰的测试方法及测试系统
CN110661583B (zh) * 2019-11-13 2023-09-05 青岛联众芯云科技有限公司 载波芯片测试系统
CN110927499B (zh) * 2019-12-10 2022-05-17 中国民航大学 一种射频集成电路近场电磁兼容性测试设备及其测试方法
CN113395122B (zh) * 2021-06-07 2023-04-07 杭州涂鸦信息技术有限公司 产测电路板、射频参数校准系统、方法和计算机设备
CN113727319B (zh) * 2021-09-02 2023-06-27 德明通讯（上海）股份有限公司 一种用于实现多线程测试蓝牙设备的方法及装置
CN115021832B (zh) * 2022-06-02 2023-12-05 上海磐启微电子有限公司 一种低成本高隔离度的芯片通信测试系统
CN115372740B (zh) * 2022-08-19 2023-07-14 上海物骐微电子有限公司 Rf芯片线损测试方法、系统、可读储存介质及电子设备
CN115802369B (zh) * 2022-11-14 2026-03-13 琻捷电子科技(江苏)股份有限公司 射频电路测试系统和射频电路测试方法
CN117538736B (zh) * 2024-01-09 2024-06-14 杭州芯云半导体技术有限公司 一种射频芯片的测试方法及系统

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DE3229749A1 (de) * 1982-08-10 1984-02-16 Siemens AG, 1000 Berlin und 8000 München Adaptereinrichtung zum simultanen elektrischen anschluss einer mehrzahl zu pruefender bauelemente an ein pruefgeraet, insbesondere fuer die eingangspruefung hochintegrierter digitaler speicherbausteine
US5337316A (en) * 1992-01-31 1994-08-09 Motorola, Inc. Transceiver self-diagnostic testing apparatus and method
US5481186A (en) * 1994-10-03 1996-01-02 At&T Corp. Method and apparatus for integrated testing of a system containing digital and radio frequency circuits
US6119255A (en) * 1998-01-21 2000-09-12 Micron Technology, Inc. Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit
US6331782B1 (en) * 1998-03-23 2001-12-18 Conexant Systems, Inc. Method and apparatus for wireless testing of integrated circuits
US6236223B1 (en) * 1998-11-09 2001-05-22 Intermec Ip Corp. Method and apparatus for wireless radio frequency testing of RFID integrated circuits
US6396291B1 (en) * 1999-04-23 2002-05-28 Micron Technology, Inc. Method for testing semiconductor components
CA2308820A1 (en) * 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
JP5248723B2 (ja) * 2001-01-12 2013-07-31 株式会社アドバンテスト 多出力任意波形発生器及びミクスドｌｓｉテスタ
US7057518B2 (en) * 2001-06-22 2006-06-06 Schmidt Dominik J Systems and methods for testing wireless devices
CA2404183C (en) * 2002-09-19 2008-09-02 Scanimetrics Inc. Non-contact tester for integrated circuits

Also Published As

Publication number Publication date
EP1546739B1 (de) 2006-12-13
WO2004029636A1 (en) 2004-04-08
DE60310428D1 (de) 2007-01-25
JP2006500578A (ja) 2006-01-05
GB0222556D0 (en) 2002-11-06
AU2003259511A1 (en) 2004-04-19
EP1546739A1 (de) 2005-06-29
US20060038579A1 (en) 2006-02-23
CN1685239A (zh) 2005-10-19

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