ATE350186T1 - Beschichtetes pulver und verfahren zu dessen herstellung - Google Patents

Beschichtetes pulver und verfahren zu dessen herstellung

Info

Publication number
ATE350186T1
ATE350186T1 AT98950428T AT98950428T ATE350186T1 AT E350186 T1 ATE350186 T1 AT E350186T1 AT 98950428 T AT98950428 T AT 98950428T AT 98950428 T AT98950428 T AT 98950428T AT E350186 T1 ATE350186 T1 AT E350186T1
Authority
AT
Austria
Prior art keywords
coated powder
film
films
solid phase
metal alkoxide
Prior art date
Application number
AT98950428T
Other languages
English (en)
Inventor
Katsuto Nakatsuka
Takafumi Atarashi
Hinode-Machi
Original Assignee
Nittetsu Mining Co Ltd
Katsuto Nakatsuka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nittetsu Mining Co Ltd, Katsuto Nakatsuka filed Critical Nittetsu Mining Co Ltd
Application granted granted Critical
Publication of ATE350186T1 publication Critical patent/ATE350186T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/006—Coating of the granules without description of the process or the device by which the granules are obtained
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12181—Composite powder [e.g., coated, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Medicinal Preparation (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Powder Metallurgy (AREA)
  • Oxygen, Ozone, And Oxides In General (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Glanulating (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AT98950428T 1997-10-30 1998-10-28 Beschichtetes pulver und verfahren zu dessen herstellung ATE350186T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29871797A JP3737617B2 (ja) 1997-10-30 1997-10-30 膜被覆粉体の製造方法

Publications (1)

Publication Number Publication Date
ATE350186T1 true ATE350186T1 (de) 2007-01-15

Family

ID=17863375

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98950428T ATE350186T1 (de) 1997-10-30 1998-10-28 Beschichtetes pulver und verfahren zu dessen herstellung

Country Status (12)

Country Link
US (1) US6387532B1 (de)
EP (1) EP1040885B1 (de)
JP (1) JP3737617B2 (de)
KR (1) KR100544869B1 (de)
CN (2) CN1919502A (de)
AT (1) ATE350186T1 (de)
AU (1) AU748497B2 (de)
CA (1) CA2307636C (de)
DE (1) DE69836828T2 (de)
EA (1) EA003474B1 (de)
NO (1) NO20002225L (de)
WO (1) WO1999022894A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3737617B2 (ja) * 1997-10-30 2006-01-18 日鉄鉱業株式会社 膜被覆粉体の製造方法
JP3565421B2 (ja) * 1999-04-13 2004-09-15 日鉄鉱業株式会社 白色粉体およびその製造方法
CN101030457B (zh) * 2001-09-06 2010-05-26 诺利塔克股份有限公司 导体组合物及其制造方法
EP1484365B1 (de) 2002-03-14 2020-04-29 Nittetsu Mining Co., Ltd. Belegtes pulver, beschichtungszusammensetzung sowie beschichteter gegenstand
US6795364B1 (en) 2003-02-28 2004-09-21 Monolithic System Technology, Inc. Method and apparatus for lengthening the data-retention time of a DRAM device in standby mode
JP4113045B2 (ja) * 2003-05-26 2008-07-02 日鉄鉱業株式会社 白色粉体およびその製造方法
KR100709822B1 (ko) * 2004-12-15 2007-04-23 삼성전기주식회사 산 용액을 이용한 니켈 입자의 표면 처리 방법
WO2006076191A2 (en) * 2005-01-10 2006-07-20 Elc Management Llc Discontinuous surface coating for particles
DE102009056634A1 (de) * 2009-12-02 2011-06-09 Giesecke & Devrient Gmbh Festkörperpartikel mit Siliciabeschichtung
CN108176851A (zh) * 2018-01-02 2018-06-19 中国工程物理研究院化工材料研究所 一种金属铝粉包覆防护方法
JP7109222B2 (ja) * 2018-03-27 2022-07-29 Ｊｘ金属株式会社 被膜が形成された金属粉及びその製造方法並びに該金属粉を用いた積層造形物
JP7500245B2 (ja) 2019-04-25 2024-06-17 日鉄鉱業株式会社 コバルトフェライト粒子の製造方法とそれにより製造されたコバルトフェライト粒子
JP7454425B2 (ja) 2019-05-24 2024-03-22 日鉄鉱業株式会社 コバルトフェライト粒子の製造方法とそれにより製造されたコバルトフェライト粒子
JP7375469B2 (ja) 2019-10-30 2023-11-08 セイコーエプソン株式会社 絶縁体被覆磁性合金粉末粒子、圧粉磁心、およびコイル部品
JP7732236B2 (ja) 2021-06-21 2025-09-02 セイコーエプソン株式会社 被膜付き金属粉末の製造方法
JP7786233B2 (ja) 2022-02-04 2025-12-16 セイコーエプソン株式会社 絶縁物被覆軟磁性粉末、絶縁物被覆軟磁性粉末の製造方法、圧粉磁心、磁性素子、電子機器および移動体
EP4495072A4 (de) 2022-03-17 2026-03-18 Nittetsu Mining Co Ltd Verfahren zur herstellung von kobaltferritteilchen und damit hergestellte kobaltferritteilchen
CN117531995A (zh) * 2022-08-02 2024-02-09 横店集团东磁股份有限公司 一种包覆型SmFeN永磁材料及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5553017A (en) * 1978-10-16 1980-04-18 Nippon Mining Co Method of manufacturing multiple coating composite powder
JPS5931003A (ja) * 1982-08-14 1984-02-18 Hitachi Maxell Ltd 金属磁性粉末およびその製造方法
JPS63213905A (ja) * 1987-03-03 1988-09-06 Ishihara Sangyo Kaisha Ltd 金属磁性粉末の製造方法
US5021315A (en) * 1989-06-07 1991-06-04 Olin Hunt Sub I Corp. Method for making magnetic particles having improved conductivity and their use in electrostatographic printing applications
US5071676A (en) * 1989-08-03 1991-12-10 E. I. Du Pont De Nemours And Company Electroconductive particles and method for adjusting the isoelectric point thereof
CA2114913C (en) * 1993-02-05 2003-12-09 Takafumi Atarashi Powder having at least one layer and process for preparing the same
JPH06299363A (ja) * 1993-04-09 1994-10-25 Japan Energy Corp 錫めっき方法
JPH0776702A (ja) * 1993-09-07 1995-03-20 Japan Synthetic Rubber Co Ltd 複合粒子の製造方法
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
JP3389935B2 (ja) * 1994-03-04 2003-03-24 戸田工業株式会社 針状コバルト被着型マグネタイト粒子粉末及びその製造法
SE9500473D0 (sv) * 1995-02-09 1995-02-09 Sandvik Ab Method of making metal composite materials
US6197364B1 (en) * 1995-08-22 2001-03-06 International Business Machines Corporation Production of electroless Co(P) with designed coercivity
US5759230A (en) * 1995-11-30 1998-06-02 The United States Of America As Represented By The Secretary Of The Navy Nanostructured metallic powders and films via an alcoholic solvent process
JP3737617B2 (ja) * 1997-10-30 2006-01-18 日鉄鉱業株式会社 膜被覆粉体の製造方法

Also Published As

Publication number Publication date
EA200000380A1 (ru) 2000-10-30
EP1040885A4 (de) 2003-03-26
EP1040885A8 (de) 2001-06-06
CN100444992C (zh) 2008-12-24
EP1040885A1 (de) 2000-10-04
WO1999022894A1 (fr) 1999-05-14
CN1283143A (zh) 2001-02-07
EA003474B1 (ru) 2003-06-26
DE69836828T2 (de) 2007-04-26
KR20010024578A (ko) 2001-03-26
JPH11131102A (ja) 1999-05-18
EP1040885B1 (de) 2007-01-03
AU9649798A (en) 1999-05-24
KR100544869B1 (ko) 2006-01-24
AU748497B2 (en) 2002-06-06
CA2307636A1 (en) 1999-05-14
NO20002225L (no) 2000-06-26
JP3737617B2 (ja) 2006-01-18
DE69836828D1 (de) 2007-02-15
US6387532B1 (en) 2002-05-14
NO20002225D0 (no) 2000-04-28
CA2307636C (en) 2010-05-18
CN1919502A (zh) 2007-02-28

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Legal Events

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