ATE353536T1 - Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter - Google Patents

Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter

Info

Publication number
ATE353536T1
ATE353536T1 AT97941061T AT97941061T ATE353536T1 AT E353536 T1 ATE353536 T1 AT E353536T1 AT 97941061 T AT97941061 T AT 97941061T AT 97941061 T AT97941061 T AT 97941061T AT E353536 T1 ATE353536 T1 AT E353536T1
Authority
AT
Austria
Prior art keywords
compositions
electrical conductors
low temperature
producing electrical
temperature processes
Prior art date
Application number
AT97941061T
Other languages
English (en)
Inventor
Paul H Kydd
Gregory A Jablonski
David L Richard
Original Assignee
Partnerships Ltd Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Partnerships Ltd Inc filed Critical Partnerships Ltd Inc
Application granted granted Critical
Publication of ATE353536T1 publication Critical patent/ATE353536T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
  • Organic Insulating Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
AT97941061T 1997-02-20 1997-09-12 Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter ATE353536T1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US3866997P 1997-02-20 1997-02-20
US3845397P 1997-02-20 1997-02-20
US3851497P 1997-02-20 1997-02-20
US3867097P 1997-02-20 1997-02-20
US4654197P 1997-05-15 1997-05-15
US4654097P 1997-05-15 1997-05-15
US4655297P 1997-05-15 1997-05-15

Publications (1)

Publication Number Publication Date
ATE353536T1 true ATE353536T1 (de) 2007-02-15

Family

ID=27567891

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97941061T ATE353536T1 (de) 1997-02-20 1997-09-12 Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter

Country Status (8)

Country Link
EP (1) EP0961809B1 (de)
JP (1) JP3585244B2 (de)
KR (1) KR100532734B1 (de)
AT (1) ATE353536T1 (de)
AU (1) AU4269697A (de)
CA (1) CA2280115C (de)
DE (1) DE69737328T2 (de)
WO (1) WO1998037133A1 (de)

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US6143356A (en) * 1999-08-06 2000-11-07 Parelec, Inc. Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards
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US6591496B2 (en) 2001-08-28 2003-07-15 3M Innovative Properties Company Method for making embedded electrical traces
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US6951666B2 (en) 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US7553512B2 (en) 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
KR100884995B1 (ko) * 2002-06-12 2009-02-20 엘지디스플레이 주식회사 액정표시장치의 공정라인 및 이를 이용한 제조방법
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
US20040178391A1 (en) * 2003-01-29 2004-09-16 Conaghan Brian F. High conductivity inks with low minimum curing temperatures
KR100545288B1 (ko) 2003-03-28 2006-01-25 주식회사 잉크테크 유기은 조성물 및 그 제조방법, 그로부터 제조되는 잉크및 그 잉크를 이용한 도전배선 형성 방법
US7413771B2 (en) * 2003-07-09 2008-08-19 Fry's Metals, Inc. Coating solder metal particles with a charge director medium
EP1665290B1 (de) * 2003-09-02 2007-05-02 Plastic Logic Limited Herstellung elektronischer bauelemente
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KR100872162B1 (ko) * 2004-04-14 2008-12-08 (주)석경에이.티 도전성 금속 나노입자 및 이를 포함하는 나노금속 잉크
JP4628718B2 (ja) * 2004-07-23 2011-02-09 株式会社フジクラ 導電性被膜の形成方法
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
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US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
WO2006076608A2 (en) 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
RU2402385C2 (ru) 2005-08-24 2010-10-27 А.М.Рамп Унд Ко. Гмбх Способ получения изделий, имеющих электропроводящее покрытие
JP2007088221A (ja) * 2005-09-22 2007-04-05 Seiko Epson Corp セラミックス電子部品の製造方法およびセラミックス電子部品
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KR100889489B1 (ko) * 2008-03-18 2009-03-19 주식회사하이퍼플렉스 도전성 섬유재를 갖는 연성 회로기판 및 이를 갖는전자제품
US9578752B2 (en) 2009-02-05 2017-02-21 Lg Chem, Ltd. Method of forming conductive pattern and substrate having conductive pattern manufactured by the same method
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Also Published As

Publication number Publication date
EP0961809A1 (de) 1999-12-08
DE69737328D1 (de) 2007-03-22
AU4269697A (en) 1998-09-09
CA2280115C (en) 2007-11-13
EP0961809B1 (de) 2007-02-07
JP3585244B2 (ja) 2004-11-04
EP0961809A4 (de) 2004-07-21
KR20000075549A (ko) 2000-12-15
CA2280115A1 (en) 1998-08-27
JP2001515645A (ja) 2001-09-18
WO1998037133A1 (en) 1998-08-27
KR100532734B1 (ko) 2005-11-30
DE69737328T2 (de) 2007-11-22

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