ATE354174T1 - Thermisches kontrollsystem für substrate - Google Patents

Thermisches kontrollsystem für substrate

Info

Publication number
ATE354174T1
ATE354174T1 AT01913112T AT01913112T ATE354174T1 AT E354174 T1 ATE354174 T1 AT E354174T1 AT 01913112 T AT01913112 T AT 01913112T AT 01913112 T AT01913112 T AT 01913112T AT E354174 T1 ATE354174 T1 AT E354174T1
Authority
AT
Austria
Prior art keywords
thermal
diffuser
sink
controllable
substrates
Prior art date
Application number
AT01913112T
Other languages
English (en)
Inventor
Dikran Babikian
Original Assignee
Silicon Valley Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Valley Group filed Critical Silicon Valley Group
Application granted granted Critical
Publication of ATE354174T1 publication Critical patent/ATE354174T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT01913112T 2000-03-07 2001-02-27 Thermisches kontrollsystem für substrate ATE354174T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/519,963 US6472643B1 (en) 2000-03-07 2000-03-07 Substrate thermal management system

Publications (1)

Publication Number Publication Date
ATE354174T1 true ATE354174T1 (de) 2007-03-15

Family

ID=24070603

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01913112T ATE354174T1 (de) 2000-03-07 2001-02-27 Thermisches kontrollsystem für substrate

Country Status (7)

Country Link
US (1) US6472643B1 (de)
EP (2) EP1770759A3 (de)
JP (2) JP2003526921A (de)
KR (1) KR100752408B1 (de)
AT (1) ATE354174T1 (de)
DE (1) DE60126589T2 (de)
WO (1) WO2001067505A2 (de)

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US6472643B1 (en) * 2000-03-07 2002-10-29 Silicon Valley Group, Inc. Substrate thermal management system
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JP4549022B2 (ja) * 2001-04-30 2010-09-22 ラム リサーチ コーポレイション ワーク支持体の表面を横切る空間温度分布を制御する方法および装置
KR100479947B1 (ko) * 2002-06-28 2005-03-30 참이앤티 주식회사 웨이퍼 가열장치
US7846254B2 (en) * 2003-05-16 2010-12-07 Applied Materials, Inc. Heat transfer assembly
KR20190002749A (ko) 2003-07-28 2019-01-08 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법
EP1780772B1 (de) 2004-07-12 2009-09-02 Nikon Corporation Belichtungsgerät und bauelemente-herstellungsverfahren
KR101230712B1 (ko) 2004-08-03 2013-02-07 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
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US7808227B2 (en) * 2006-07-07 2010-10-05 Univation Technologies, Llc Systems and methods for detecting impurities in reactor systems
US7723648B2 (en) * 2006-09-25 2010-05-25 Tokyo Electron Limited Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system
US7838800B2 (en) * 2006-09-25 2010-11-23 Tokyo Electron Limited Temperature controlled substrate holder having erosion resistant insulating layer for a substrate processing system
CN101907899B (zh) * 2010-08-03 2012-05-16 南京航空航天大学 自动铺放成型中预浸料红外辐射加热的动态温度控制方法

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US5954982A (en) * 1997-02-12 1999-09-21 Nikon Corporation Method and apparatus for efficiently heating semiconductor wafers or reticles
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JP3665826B2 (ja) * 1997-05-29 2005-06-29 Ｓｍｃ株式会社 基板熱処理装置
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US6472643B1 (en) * 2000-03-07 2002-10-29 Silicon Valley Group, Inc. Substrate thermal management system

Also Published As

Publication number Publication date
DE60126589T2 (de) 2007-11-22
WO2001067505A2 (en) 2001-09-13
JP2003526921A (ja) 2003-09-09
DE60126589D1 (de) 2007-03-29
KR20030009383A (ko) 2003-01-29
EP1770759A2 (de) 2007-04-04
EP1770759A3 (de) 2007-05-02
EP1261984B1 (de) 2007-02-14
US6472643B1 (en) 2002-10-29
WO2001067505A3 (en) 2002-04-18
JP2008252102A (ja) 2008-10-16
EP1261984A2 (de) 2002-12-04
KR100752408B1 (ko) 2007-08-28

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Legal Events

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