ATE358697T1 - Flammwidrige epoxyprepregs, laminate und leiterplatten mit verbesserter wärmestabilität - Google Patents

Flammwidrige epoxyprepregs, laminate und leiterplatten mit verbesserter wärmestabilität

Info

Publication number
ATE358697T1
ATE358697T1 AT04783699T AT04783699T ATE358697T1 AT E358697 T1 ATE358697 T1 AT E358697T1 AT 04783699 T AT04783699 T AT 04783699T AT 04783699 T AT04783699 T AT 04783699T AT E358697 T1 ATE358697 T1 AT E358697T1
Authority
AT
Austria
Prior art keywords
thermal stability
laminates
flame
circuit boards
improved thermal
Prior art date
Application number
AT04783699T
Other languages
English (en)
Inventor
F Paul Ranken
Rene G E Herbiet
Original Assignee
Albemarle Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Albemarle Corp filed Critical Albemarle Corp
Application granted granted Critical
Publication of ATE358697T1 publication Critical patent/ATE358697T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/08—Reinforcements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2631—Coating or impregnation provides heat or fire protection
    • Y10T442/2672—Phosphorus containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
AT04783699T 2003-10-01 2004-09-08 Flammwidrige epoxyprepregs, laminate und leiterplatten mit verbesserter wärmestabilität ATE358697T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/678,019 US20050075024A1 (en) 2003-10-01 2003-10-01 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability

Publications (1)

Publication Number Publication Date
ATE358697T1 true ATE358697T1 (de) 2007-04-15

Family

ID=34393858

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04783699T ATE358697T1 (de) 2003-10-01 2004-09-08 Flammwidrige epoxyprepregs, laminate und leiterplatten mit verbesserter wärmestabilität

Country Status (18)

Country Link
US (1) US20050075024A1 (de)
EP (1) EP1670860B1 (de)
JP (1) JP2007507588A (de)
KR (1) KR20060104993A (de)
CN (1) CN100549092C (de)
AT (1) ATE358697T1 (de)
AU (1) AU2004284408A1 (de)
BR (1) BRPI0415008A (de)
CA (1) CA2540552A1 (de)
DE (1) DE602004005729T2 (de)
ES (1) ES2284058T3 (de)
IL (1) IL174661A0 (de)
MX (1) MXPA06003603A (de)
PT (1) PT1670860E (de)
RS (1) RS20060283A (de)
RU (1) RU2006114699A (de)
WO (1) WO2005040277A1 (de)
ZA (1) ZA200602686B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004018336A1 (de) * 2004-04-15 2005-11-10 Albemarle Corporation Flammhemmender Füllstoff für Kunststoffe
EP1873223A4 (de) * 2005-02-17 2013-05-22 Mitsui Chemicals Inc Harzzusammensetzung für siegelmaterial, siegelmaterial, siegelverfahren und elektrolumineszierende anzeige
JP5135705B2 (ja) * 2006-04-04 2013-02-06 三菱瓦斯化学株式会社 プリプレグ、金属箔張積層板、プリント配線板
US7601429B2 (en) * 2007-02-07 2009-10-13 Mitsubishi Gas Chemical Company, Inc. Prepreg and laminate
US7499622B2 (en) 2007-02-28 2009-03-03 Corning Cable Systems Llc Fiber optic drop terminals for multiple dwelling units
JP2009051978A (ja) * 2007-08-28 2009-03-12 Panasonic Electric Works Co Ltd プリント配線板用エポキシ樹脂組成物、プリプレグ、金属箔張積層板、多層プリント配線板
GB2471318A (en) * 2009-06-26 2010-12-29 Hexcel Composites Ltd Conductive prepreg
KR101309820B1 (ko) * 2010-12-29 2013-09-23 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자
JP5713205B2 (ja) * 2012-04-25 2015-05-07 三菱瓦斯化学株式会社 プリプレグ、金属箔張積層板、プリント配線板
CN107189347A (zh) * 2017-05-09 2017-09-22 建滔敷铜板（深圳）有限公司 树脂组合物、覆铜板、电路板以及制造方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2915475A (en) * 1958-12-29 1959-12-01 Du Pont Fibrous alumina monohydrate and its production
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
JPS5127898A (en) * 1974-09-02 1976-03-09 Showa Denko Kk Tainetsuseisuisankaaruminiumunoseizohoho
US4224302A (en) * 1975-09-16 1980-09-23 Nippon Soken Inc. Process for producing an alumina catalyst carrier
DE3308023A1 (de) * 1983-03-07 1984-09-13 Vereinigte Aluminium-Werke AG, 1000 Berlin und 5300 Bonn Fuellstoff auf basis von aluminiumhydroxid und verfahren zu seiner herstellung
JPH0245349B2 (ja) * 1983-09-13 1990-10-09 Sumitomo Bakelite Co Insatsukairoyosekisoban
US4481347A (en) * 1983-10-24 1984-11-06 The Dow Chemical Company Epoxy resins containing phosphorus
JPS6271643A (ja) * 1985-09-26 1987-04-02 住友ベークライト株式会社 印刷回路用積層板の製造方法
US4632973A (en) * 1985-10-18 1986-12-30 The Dow Chemical Company Method of improving flame resistance of epoxy resins and resulting compositions
US4859365A (en) * 1987-02-10 1989-08-22 Manufacturers Industrial Technology, Inc. Flame retardant and smoke suppressant composition
ATE107677T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharzmischungen.
US5246782A (en) * 1990-12-10 1993-09-21 The Dow Chemical Company Laminates of polymers having perfluorocyclobutane rings and polymers containing perfluorocyclobutane rings
FI902943A7 (fi) * 1989-07-19 1991-01-20 Siemens Ag Kuumassa kovettuvia reaktiohartsiseoksia
DE4237132C1 (de) * 1992-11-03 1994-07-07 Siemens Ag UV-aktiviert thermisch härtendes einkomponentiges Reaktionsharzsystem
DE4308187A1 (de) * 1993-03-15 1994-09-22 Siemens Ag Epoxidharzmischungen
TW270123B (de) * 1993-07-02 1996-02-11 Ciba Geigy
TW297034B (de) * 1994-09-09 1997-02-01 Siemens Ag
TW294694B (de) * 1994-09-09 1997-01-01 Siemens Ag
WO1997000340A1 (en) * 1995-06-14 1997-01-03 Otsuka Kagaku Kabushiki Kaisha Titanate whisker and process for the production thereof
GB9700708D0 (en) * 1997-01-15 1997-03-05 Martinswerk Gmbh F R Chemische Laminate for printed circuit boards
JPH10330596A (ja) * 1997-05-30 1998-12-15 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
US6353080B1 (en) * 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
US5864893A (en) * 1997-12-23 1999-02-02 Liou; Wen-Quey Water discharge assembly for a tank
DE19812279C1 (de) * 1998-03-20 1999-05-12 Nabaltec Gmbh Flammwidrige Kunststoffmischung und Verfahren zur Herstellung eines Füllstoffs
TW528769B (en) * 1998-06-19 2003-04-21 Nat Science Council Flame retardant advanced epoxy resins and cured epoxy resins, and preparation thereof
US6291627B1 (en) * 1999-03-03 2001-09-18 National Science Council Epoxy resin rendered flame retardant by reaction with 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
US6486242B1 (en) * 1999-04-20 2002-11-26 Sumitomo Bakelite Company Limited Flame-retardant resin composition and prepreg and laminate using the same
EP1059329A1 (de) * 1999-06-09 2000-12-13 Matsushita Electric Works, Ltd. Flammhemmende Harzzusammensetzung
JP4633214B2 (ja) * 1999-12-08 2011-02-16 富士通株式会社 エポキシ樹脂組成物
WO2001042253A2 (en) * 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
JP4770019B2 (ja) * 2000-12-22 2011-09-07 三菱瓦斯化学株式会社 プリプレグ及び金属箔張り積層板
JP2002249552A (ja) * 2001-02-23 2002-09-06 Matsushita Electric Works Ltd リン含有エポキシ樹脂組成物、樹脂シート、樹脂付き金属箔、プリプレグ、積層板、多層板
JP4055049B2 (ja) * 2002-02-05 2008-03-05 日立化成工業株式会社 非ハロゲン系プリント配線板用プリプレグ及びその用途
JP2003231762A (ja) * 2002-02-13 2003-08-19 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板
JP2004059643A (ja) * 2002-07-25 2004-02-26 Mitsubishi Gas Chem Co Inc プリプレグ及び積層板

Also Published As

Publication number Publication date
AU2004284408A1 (en) 2005-05-06
RU2006114699A (ru) 2007-12-10
DE602004005729D1 (de) 2007-05-16
WO2005040277A1 (en) 2005-05-06
US20050075024A1 (en) 2005-04-07
EP1670860A1 (de) 2006-06-21
IL174661A0 (en) 2006-08-20
KR20060104993A (ko) 2006-10-09
CN100549092C (zh) 2009-10-14
EP1670860B1 (de) 2007-04-04
CA2540552A1 (en) 2005-05-06
PT1670860E (pt) 2007-05-31
BRPI0415008A (pt) 2006-11-07
MXPA06003603A (es) 2006-06-05
ES2284058T3 (es) 2007-11-01
JP2007507588A (ja) 2007-03-29
ZA200602686B (en) 2007-09-26
DE602004005729T2 (de) 2007-12-27
RS20060283A (sr) 2008-04-04
CN1871300A (zh) 2006-11-29

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