ATE360885T1 - Substratreinigungssystem - Google Patents
SubstratreinigungssystemInfo
- Publication number
- ATE360885T1 ATE360885T1 AT01113291T AT01113291T ATE360885T1 AT E360885 T1 ATE360885 T1 AT E360885T1 AT 01113291 T AT01113291 T AT 01113291T AT 01113291 T AT01113291 T AT 01113291T AT E360885 T1 ATE360885 T1 AT E360885T1
- Authority
- AT
- Austria
- Prior art keywords
- cleaning
- booth
- substrates
- cleaning treatment
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP01113291A EP1263022B1 (de) | 2001-05-31 | 2001-05-31 | Substratreinigungssystem |
| US09/871,250 US6763839B2 (en) | 2001-05-31 | 2001-06-01 | Substrate cleaning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE360885T1 true ATE360885T1 (de) | 2007-05-15 |
Family
ID=26076605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT01113291T ATE360885T1 (de) | 2001-05-31 | 2001-05-31 | Substratreinigungssystem |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6763839B2 (de) |
| EP (1) | EP1263022B1 (de) |
| AT (1) | ATE360885T1 (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060035475A1 (en) | 2004-08-12 | 2006-02-16 | Applied Materials, Inc. | Semiconductor substrate processing apparatus |
| CA2795066A1 (en) * | 2010-03-31 | 2011-10-06 | Jason Paulman | Wet bench apparatus and method |
| DE102010028489A1 (de) * | 2010-05-03 | 2011-11-03 | Dürr Ecoclean GmbH | Anlage und Verfahren zum Reinigen und/oder Entgraten von Werkstücken |
| US9530676B2 (en) * | 2011-06-01 | 2016-12-27 | Ebara Corporation | Substrate processing apparatus, substrate transfer method and substrate transfer device |
| KR102030690B1 (ko) | 2011-06-23 | 2019-10-10 | 다이나믹 마이크로시스템즈 세미컨덕터 이큅먼트 게엠베하 | 반도체 클리너 시스템들 및 방법들 |
| KR102410435B1 (ko) * | 2017-07-21 | 2022-06-17 | 코닝 인코포레이티드 | 압력 맵핑 장치 및 이를 이용한 유리 기판 세정 방법 |
| JP6920141B2 (ja) * | 2017-09-05 | 2021-08-18 | 株式会社ディスコ | 研磨装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
| KR100390293B1 (ko) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
| US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
| US5975097A (en) * | 1996-09-02 | 1999-11-02 | Tokyo Electron Limited | Processing apparatus for target processing substrate |
| AU3553599A (en) * | 1998-04-13 | 1999-11-01 | Acm Research, Inc. | Method and apparatus for enhancing adhesion between barrier layer and metal layer formed by plating |
| US6610150B1 (en) * | 1999-04-02 | 2003-08-26 | Asml Us, Inc. | Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system |
-
2001
- 2001-05-31 AT AT01113291T patent/ATE360885T1/de not_active IP Right Cessation
- 2001-05-31 EP EP01113291A patent/EP1263022B1/de not_active Expired - Lifetime
- 2001-06-01 US US09/871,250 patent/US6763839B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1263022B1 (de) | 2007-04-25 |
| US6763839B2 (en) | 2004-07-20 |
| US20020179127A1 (en) | 2002-12-05 |
| EP1263022A1 (de) | 2002-12-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1263022 Country of ref document: EP |
|
| REN | Ceased due to non-payment of the annual fee |