ATE361537T1 - Eigenständige organische passive bauelemente - Google Patents

Eigenständige organische passive bauelemente

Info

Publication number
ATE361537T1
ATE361537T1 AT04809328T AT04809328T ATE361537T1 AT E361537 T1 ATE361537 T1 AT E361537T1 AT 04809328 T AT04809328 T AT 04809328T AT 04809328 T AT04809328 T AT 04809328T AT E361537 T1 ATE361537 T1 AT E361537T1
Authority
AT
Austria
Prior art keywords
inductor devices
organic
provides
inductor
devices
Prior art date
Application number
AT04809328T
Other languages
English (en)
Inventor
George E White
Madhavan Swanimathan
Sidharth Dalmia
Venkatesh Sundaram
Original Assignee
Georgia Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Georgia Tech Res Inst filed Critical Georgia Tech Res Inst
Application granted granted Critical
Publication of ATE361537T1 publication Critical patent/ATE361537T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT04809328T 2003-03-28 2004-03-29 Eigenständige organische passive bauelemente ATE361537T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/405,024 US6987307B2 (en) 2002-06-26 2003-03-28 Stand-alone organic-based passive devices

Publications (1)

Publication Number Publication Date
ATE361537T1 true ATE361537T1 (de) 2007-05-15

Family

ID=34434759

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04809328T ATE361537T1 (de) 2003-03-28 2004-03-29 Eigenständige organische passive bauelemente

Country Status (5)

Country Link
US (1) US6987307B2 (de)
EP (1) EP1609161B1 (de)
AT (1) ATE361537T1 (de)
DE (1) DE602004006241T2 (de)
WO (1) WO2005036567A2 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10220653A1 (de) * 2002-05-08 2003-11-27 Infineon Technologies Ag Integrierte Leiterbahnanordnung
US7053466B2 (en) * 2002-12-17 2006-05-30 Intel Corporation High-speed signaling interface with broadside dynamic wave coupling
WO2004079795A2 (en) 2003-03-04 2004-09-16 Rohm And Haas Electronic Materials, L.L.C. Coaxial waveguide microstructures and methods of formation thereof
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
CN101027732B (zh) * 2004-09-29 2011-06-15 财团法人国际科学振兴财团 芯片元件
EP1864310A2 (de) * 2005-03-02 2007-12-12 Georgia Tech Research Corporation Kapselungssysteme mit dünnfilm-flüssigkristallpolymer (lcp) und herstellungsverfahren
US20060255434A1 (en) * 2005-05-12 2006-11-16 Yinon Degani Shielding noisy conductors in integrated passive devices
US7409667B1 (en) * 2005-12-15 2008-08-05 Emc Corporation Techniques for modeling a circuit board structure
US7679162B2 (en) * 2005-12-19 2010-03-16 Silicon Laboratories Inc. Integrated current sensor package
TW200727748A (en) * 2006-01-12 2007-07-16 Asustek Comp Inc Inductor apparatus
CN101009153A (zh) * 2006-01-24 2007-08-01 华硕电脑股份有限公司 电感装置
US7755457B2 (en) * 2006-02-07 2010-07-13 Harris Corporation Stacked stripline circuits
US7851709B2 (en) * 2006-03-22 2010-12-14 Advanced Semiconductor Engineering, Inc. Multi-layer circuit board having ground shielding walls
US7990132B2 (en) * 2006-06-30 2011-08-02 Silicon Laboratories Inc. Current sensor including an integrated circuit die including a first and second coil
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
US7646255B2 (en) * 2006-11-17 2010-01-12 Cts Corporation Voltage controlled oscillator module with ball grid array resonator
KR101476438B1 (ko) 2006-12-30 2014-12-24 누보트로닉스, 엘.엘.씨 3차원 미세구조 및 그 형성방법
WO2008083867A1 (en) 2007-01-12 2008-07-17 Nokia Siemens Networks Gmbh & Co. Kg Apparatus for processing audio and/or video data and method to be run on said apparatus
KR101593686B1 (ko) 2007-03-20 2016-02-12 누보트로닉스, 엘.엘.씨 일체화된 전자 요소들 및 이들의 형성 방법
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
US8161633B2 (en) * 2007-04-03 2012-04-24 Harris Corporation Method of fabricating non-planar circuit board
US8212155B1 (en) * 2007-06-26 2012-07-03 Wright Peter V Integrated passive device
US20090186169A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods
US8778124B2 (en) * 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US9117602B2 (en) 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
JP2011513952A (ja) * 2008-02-25 2011-04-28 フェアチャイルド・セミコンダクター・コーポレーション 一体化薄膜インダクタを含むマイクロモジュール及びその製造方法
US7583871B1 (en) * 2008-03-20 2009-09-01 Bchir Omar J Substrates for optical die structures
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US7733265B2 (en) * 2008-04-04 2010-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Three dimensional integrated automotive radars and methods of manufacturing the same
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
WO2009125656A1 (ja) * 2008-04-08 2009-10-15 株式会社村田製作所 電子部品
US7728578B2 (en) * 2008-05-15 2010-06-01 Silicon Laboratories Inc. Method and apparatus for high current measurement
US8395472B2 (en) 2008-07-02 2013-03-12 Nxp B.V. Planar, monolithically integrated coil
US7990237B2 (en) * 2009-01-16 2011-08-02 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for improving performance of coplanar waveguide bends at mm-wave frequencies
JP5705857B2 (ja) 2009-09-16 2015-04-22 マラディン テクノロジーズ リミテッドＭａｒａｄｉｎ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｌｔｄ． 微小コイル装置およびその製作方法
US20110123783A1 (en) * 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
US9159777B2 (en) * 2011-04-15 2015-10-13 Infineon Technologies Ag Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
US9993982B2 (en) 2011-07-13 2018-06-12 Nuvotronics, Inc. Methods of fabricating electronic and mechanical structures
CN103327726A (zh) * 2012-03-19 2013-09-25 鸿富锦精密工业（深圳）有限公司 电子装置及其印刷电路板的布局结构
KR101365368B1 (ko) * 2012-12-26 2014-02-24 삼성전기주식회사 공통모드필터 및 이의 제조방법
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
JP6004078B2 (ja) 2013-02-15 2016-10-05 株式会社村田製作所 積層回路基板、積層回路基板の製造方法
JP5743034B2 (ja) * 2013-02-19 2015-07-01 株式会社村田製作所 インダクタブリッジおよび電子機器
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
EP3095159A4 (de) 2014-01-17 2017-09-27 Nuvotronics, Inc. Testschnittstelleneinheit im wafer-masstab: vorrichtungen mit geringem verlust und hoher isolation und verfahren für hochdichte gemischte signalverbindungen und schütze
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
TWI571979B (zh) * 2014-11-25 2017-02-21 彭賢斌 整合式被動模組、半導體裝置及其製作方法
WO2016094129A1 (en) 2014-12-03 2016-06-16 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
WO2016132911A1 (ja) * 2015-02-18 2016-08-25 株式会社村田製作所 コイル内蔵基板およびその製造方法
US10262786B2 (en) 2016-07-26 2019-04-16 Qualcomm Incorporated Stepped-width co-spiral inductor structure
US10163771B2 (en) * 2016-08-08 2018-12-25 Qualcomm Incorporated Interposer device including at least one transistor and at least one through-substrate via
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
CN110148519B (zh) * 2019-06-03 2021-12-10 四川省正元包装印务有限责任公司 一种网络滤波器引线手工绕线方法
US11096271B1 (en) 2020-04-09 2021-08-17 Raytheon Company Double-sided, high-density network fabrication
KR102899094B1 (ko) * 2020-10-27 2025-12-11 삼성전기주식회사 코일 부품

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0322703B1 (de) * 1987-12-18 1995-08-30 Canon Kabushiki Kaisha Mesomorphische Verbindung, Flüssigkristallzusammensetzung und Flüssigkristallvorrichtung
DE3825066A1 (de) * 1988-07-23 1990-01-25 Roehm Gmbh Verfahren zur herstellung von duennen, anisotropen schichten auf oberflaechenstrukturierten traegern
US5106461A (en) * 1989-04-04 1992-04-21 Massachusetts Institute Of Technology High-density, multi-level interconnects, flex circuits, and tape for tab
US5716663A (en) * 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
JP2777747B2 (ja) 1990-11-26 1998-07-23 東亞合成株式会社 電磁波シールド層を有するプリント抵抗器内蔵多層プリント回路板
DE69211201T2 (de) 1991-03-29 1996-10-31 Ngk Insulators Ltd Dielektrische Filter mit Koppelelektroden um Resonatoren oder Elektroden zu Verbinden, und Verfahren zur Einstellung der Frequenzcharakteristik des Filters
JP2606044B2 (ja) 1991-04-24 1997-04-30 松下電器産業株式会社 誘電体フィルタ
US5162257A (en) * 1991-09-13 1992-11-10 Mcnc Solder bump fabrication method
US5384434A (en) 1992-03-02 1995-01-24 Murata Manufacturing Co., Ltd. Multilayer ceramic circuit board
US5440805A (en) 1992-03-09 1995-08-15 Rogers Corporation Method of manufacturing a multilayer circuit
US5259110A (en) * 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
JP3210414B2 (ja) * 1992-04-30 2001-09-17 日本特殊陶業株式会社 ストリップラインフィルタ
US5312674A (en) * 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
US5498450A (en) * 1992-11-18 1996-03-12 Fuji Xerox Co., Ltd. Liquid crystal-polymer composite film, electro-optical element using the same, and process for producing electro-optical element
US6051289A (en) * 1993-02-12 2000-04-18 Nippon Petrochemicals, Co., Ltd Liquid crystalline polymer film, laminate sheet for optical element using same, and optical element using the laminate
US5479141A (en) * 1993-03-25 1995-12-26 Matsushita Electric Industrial Co., Ltd. Laminated dielectric resonator and dielectric filter
DE69432059T2 (de) * 1993-08-24 2003-11-20 Matsushita Electric Industrial Co., Ltd. Geschichtetes dielektrisches Filter
JP2949250B2 (ja) * 1993-08-25 1999-09-13 株式会社村田製作所 チップ型フィルタ
JP3209304B2 (ja) * 1993-12-03 2001-09-17 株式会社村田製作所 積層型電子部品及びその製造方法
JPH07273502A (ja) * 1994-03-29 1995-10-20 Murata Mfg Co Ltd ローパスフィルタ
US5416454A (en) * 1994-03-31 1995-05-16 Motorola, Inc. Stripline filter with a high side transmission zero
US5610433A (en) * 1995-03-13 1997-03-11 National Semiconductor Corporation Multi-turn, multi-level IC inductor with crossovers
JP3351102B2 (ja) * 1994-06-14 2002-11-25 株式会社村田製作所 共振器
US5719354A (en) * 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
US5497337A (en) * 1994-10-21 1996-03-05 International Business Machines Corporation Method for designing high-Q inductors in silicon technology without expensive metalization
US5545916A (en) * 1994-12-06 1996-08-13 At&T Corp. High Q integrated inductor
US5635892A (en) * 1994-12-06 1997-06-03 Lucent Technologies Inc. High Q integrated inductor
US5559360A (en) * 1994-12-19 1996-09-24 Lucent Technologies Inc. Inductor for high frequency circuits
JP3120682B2 (ja) * 1995-01-09 2000-12-25 株式会社村田製作所 チップ型フィルタ
US6026286A (en) * 1995-08-24 2000-02-15 Nortel Networks Corporation RF amplifier, RF mixer and RF receiver
JPH09130103A (ja) 1995-10-31 1997-05-16 Nippon Cement Co Ltd 多層基板内層型トラップ付きバンドパスフィルタ
US5703544A (en) * 1996-03-13 1997-12-30 Ericsson Inc. RF printed circuit module and method of making same
US5739193A (en) * 1996-05-07 1998-04-14 Hoechst Celanese Corp. Polymeric compositions having a temperature-stable dielectric constant
DE69738021T2 (de) * 1997-01-07 2008-05-29 Matsushita Electric Industrial Co., Ltd., Kadoma Mehrschichtiges filter
US5798563A (en) * 1997-01-28 1998-08-25 International Business Machines Corporation Polytetrafluoroethylene thin film chip carrier
US5818313A (en) * 1997-01-31 1998-10-06 Motorola Inc. Multilayer lowpass filter with single point ground plane configuration
US5844299A (en) * 1997-01-31 1998-12-01 National Semiconductor Corporation Integrated inductor
US5801100A (en) * 1997-03-07 1998-09-01 Industrial Technology Research Institute Electroless copper plating method for forming integrated circuit structures
US6040226A (en) * 1997-05-27 2000-03-21 General Electric Company Method for fabricating a thin film inductor
US6005197A (en) 1997-08-25 1999-12-21 Lucent Technologies Inc. Embedded thin film passive components
US6385638B1 (en) * 1997-09-04 2002-05-07 Equator Technologies, Inc. Processor resource distributor and method
SE510487C2 (sv) * 1997-09-17 1999-05-31 Ericsson Telefon Ab L M Flerlagerskretskort
US6261872B1 (en) * 1997-09-18 2001-07-17 Trw Inc. Method of producing an advanced RF electronic package
JPH11133412A (ja) * 1997-10-29 1999-05-21 Nitto Denko Corp 液晶素子、光学素子及び偏光素子
JPH11136002A (ja) * 1997-10-30 1999-05-21 Philips Japan Ltd 誘電体フィルタ及び誘電体フィルタの通過帯域特性を調整する方法
US6038133A (en) 1997-11-25 2000-03-14 Matsushita Electric Industrial Co., Ltd. Circuit component built-in module and method for producing the same
KR19990055422A (ko) * 1997-12-27 1999-07-15 정선종 실리콘 기판에서의 인덕터 장치 및 그 제조 방법
JP3322199B2 (ja) 1998-01-06 2002-09-09 株式会社村田製作所 多層セラミック基板およびその製造方法
JPH11205006A (ja) * 1998-01-20 1999-07-30 Matsushita Electric Ind Co Ltd 積層フィルタ
US6099677A (en) * 1998-02-13 2000-08-08 Merrimac Industries, Inc. Method of making microwave, multifunction modules using fluoropolymer composite substrates
US6008102A (en) * 1998-04-09 1999-12-28 Motorola, Inc. Method of forming a three-dimensional integrated inductor
JPH11340036A (ja) * 1998-05-26 1999-12-10 Alps Electric Co Ltd 軟磁性膜とこの軟磁性膜を用いた薄膜磁気ヘッド、平面型磁気素子、及びフィルタ
SE513875C2 (sv) * 1998-06-15 2000-11-20 Ericsson Telefon Ab L M Elektrisk komponent samt ett flerlagrigt kretskort
US6114925A (en) * 1998-06-18 2000-09-05 Industrial Technology Research Institute Miniaturized multilayer ceramic filter with high impedance lines connected to parallel coupled lines
TW396594B (en) * 1998-07-13 2000-07-01 Winbond Electronics Corp High quality inductor device and its manufacturing method
US6259148B1 (en) * 1998-08-13 2001-07-10 International Business Machines Corporation Modular high frequency integrated circuit structure
US6031727A (en) 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
US6021050A (en) 1998-12-02 2000-02-01 Bourns, Inc. Printed circuit boards with integrated passive components and method for making same
US6287931B1 (en) * 1998-12-04 2001-09-11 Winbond Electronics Corp. Method of fabricating on-chip inductor
SG93278A1 (en) * 1998-12-21 2002-12-17 Mou Shiung Lin Top layers of metal for high performance ics
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
EP1028475A1 (de) * 1999-02-09 2000-08-16 Sony International (Europe) GmbH Elektronisches Bauelement mit einer kolumnar-diskotischer Phase
US6191666B1 (en) * 1999-03-25 2001-02-20 Industrial Technology Research Institute Miniaturized multi-layer ceramic lowpass filter
US6380608B1 (en) * 1999-06-01 2002-04-30 Alcatel Usa Sourcing L.P. Multiple level spiral inductors used to form a filter in a printed circuit board
US6255714B1 (en) * 1999-06-22 2001-07-03 Agere Systems Guardian Corporation Integrated circuit having a micromagnetic device including a ferromagnetic core and method of manufacture therefor
DE60037367T2 (de) * 1999-07-08 2008-12-04 Matsushita Electric Industrial Co., Ltd., Kadoma Laminiertes Filter, Duplexer und Mobilfunksystem damit
JP2001060802A (ja) * 1999-08-19 2001-03-06 Sony Corp 回路素子基板と半導体装置及びその製造方法
JP2001177306A (ja) * 1999-12-20 2001-06-29 Ngk Insulators Ltd 積層型誘電体フィルタ
US6529096B2 (en) * 2000-05-30 2003-03-04 Matsushita Electric Industrial Co., Ltd. Dielectric filter, antenna duplexer, and communications appliance
JP2001345212A (ja) * 2000-05-31 2001-12-14 Tdk Corp 積層電子部品
SE520151C2 (sv) 2000-06-07 2003-06-03 Shaofang Gong Modul för radiokommunikation
AU2001268277A1 (en) * 2000-06-08 2001-12-17 World Properties Inc. Method of manufacturing circuit laminates
WO2001097582A1 (en) 2000-06-15 2001-12-20 Ajinomoto Co., Inc. Adhesive film and method for manufacturing multilayer printed wiring board comprising the same
AU2002227426A1 (en) * 2000-08-15 2002-06-24 World Properties Inc. Multi-layer circuits and methods of manufacture thereof
US20020064701A1 (en) * 2000-09-11 2002-05-30 Hand Doris I. Conductive liquid crystalline polymer film and method of manufacture thereof
JP4529262B2 (ja) * 2000-09-14 2010-08-25 ソニー株式会社 高周波モジュール装置及びその製造方法
WO2002049404A2 (en) * 2000-12-14 2002-06-20 World Properties Inc. Liquid crystalline polymer bond plies and circuits formed therefrom
US20020158305A1 (en) * 2001-01-05 2002-10-31 Sidharth Dalmia Organic substrate having integrated passive components
JP2002217059A (ja) * 2001-01-12 2002-08-02 Murata Mfg Co Ltd 積層型ｌｃフィルタ
JP2002324729A (ja) 2001-02-22 2002-11-08 Tdk Corp 電子部品とその製造方法
US6663946B2 (en) * 2001-02-28 2003-12-16 Kyocera Corporation Multi-layer wiring substrate
CN1630946A (zh) * 2001-07-12 2005-06-22 株式会社日立制作所 电子电路部件
JP4318417B2 (ja) * 2001-10-05 2009-08-26 ソニー株式会社 高周波モジュール基板装置

Also Published As

Publication number Publication date
DE602004006241D1 (de) 2007-06-14
DE602004006241T2 (de) 2008-01-10
WO2005036567A8 (en) 2005-09-29
EP1609161B1 (de) 2007-05-02
US6987307B2 (en) 2006-01-17
WO2005036567A3 (en) 2005-07-14
WO2005036567A2 (en) 2005-04-21
US20040000701A1 (en) 2004-01-01
WO2005036567A9 (en) 2005-05-26
EP1609161A2 (de) 2005-12-28

Similar Documents

Publication Publication Date Title
ATE361537T1 (de) Eigenständige organische passive bauelemente
ATE434840T1 (de) Durch verwendung von mehrschichtigen organischen laminaten hergestellte integrierte passive bauelemente
MY148173A (en) Solder resist material, wiring board using the solder resist material, and semiconductor package
EP1156525A4 (de) Mehrschichtige leiterplatte und halbleiterbauelement
US8310835B2 (en) Systems and methods for providing vias through a modular component
GB2488265A (en) Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
GB2437465B (en) Multilayer wiring board, method for manufacturing such multilayer wiring board, and semiconductor device, and electronic device using multilayer wiring board
TW200746477A (en) Semiconductor light emitting device with integrated electronic components
TW200507131A (en) Multi-layer circuit board for electronic device
TW200501863A (en) Multilayer wiring board including stacked via structure
TW200610003A (en) Semiconductor device with three-dimensional stacked structure and method of fabricating same
WO2013036323A3 (en) A small size and fully integrated power converter with magnetics on chip
TW200713487A (en) Embedded capacitor with interdigitated structure
EP1791410A3 (de) Mehrschichtige Leiterplatte
US9698130B2 (en) Connection system for electronic components
KR102194721B1 (ko) 인쇄회로기판 및 그 제조 방법
JPWO2014162478A1 (ja) 部品内蔵基板及びその製造方法
EP1589798A4 (de) Mehrschichtige leiterplatte, elektronische vorrichtung und verkapselungsverfahren
EP4402721A4 (de) Mikroelektronische anordnungen mit direkter befestigung an leiterplatten
SE0001943L (sv) Modul för radiokommunikation
WO2006089171A3 (en) Stacked ball grid array package module utilizing one or more interposer layers
KR20150095473A (ko) 전자소자 내장 기판 및 그 제조 방법
JP2005150283A5 (de)
US11116075B2 (en) Component carrier comprising dielectric structures with different physical properties
CN101657896B (zh) 电子电路封装

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties