ATE364308T1 - Wärmemanagement bei einer leiterplattenanordnung - Google Patents

Wärmemanagement bei einer leiterplattenanordnung

Info

Publication number
ATE364308T1
ATE364308T1 AT05253641T AT05253641T ATE364308T1 AT E364308 T1 ATE364308 T1 AT E364308T1 AT 05253641 T AT05253641 T AT 05253641T AT 05253641 T AT05253641 T AT 05253641T AT E364308 T1 ATE364308 T1 AT E364308T1
Authority
AT
Austria
Prior art keywords
heat management
pcb
circuit board
board arrangement
edges
Prior art date
Application number
AT05253641T
Other languages
English (en)
Inventor
Robert Mowat Ireland
Graham Charles Kirk
John Albert Boocock
Michael Arthur Isles
Original Assignee
Radstone Technology Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radstone Technology Plc filed Critical Radstone Technology Plc
Application granted granted Critical
Publication of ATE364308T1 publication Critical patent/ATE364308T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cookers (AREA)
  • Structure Of Printed Boards (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Electric Clocks (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT05253641T 2004-06-15 2005-06-13 Wärmemanagement bei einer leiterplattenanordnung ATE364308T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0413420.1A GB0413420D0 (en) 2004-06-15 2004-06-15 Heat management in printed wiring boards

Publications (1)

Publication Number Publication Date
ATE364308T1 true ATE364308T1 (de) 2007-06-15

Family

ID=32749979

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05253641T ATE364308T1 (de) 2004-06-15 2005-06-13 Wärmemanagement bei einer leiterplattenanordnung

Country Status (10)

Country Link
US (1) US7660125B2 (de)
EP (1) EP1610596B1 (de)
AT (1) ATE364308T1 (de)
DE (1) DE602005001297T2 (de)
DK (1) DK1610596T3 (de)
ES (1) ES2287875T3 (de)
GB (2) GB0413420D0 (de)
PL (1) PL1610596T3 (de)
PT (1) PT1610596E (de)
SI (1) SI1610596T1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1495702A1 (de) 2003-07-10 2005-01-12 Nestec S.A. Vorrichtung zur Extraktion einer Kartusche
AU2008306060C1 (en) 2007-10-04 2015-08-27 Société des Produits Nestlé S.A. Beverage brewing unit
WO2009043851A2 (en) 2007-10-04 2009-04-09 Nestec S.A. Integrated heater for a beverage preparation device
CL2008002963A1 (es) 2007-10-04 2010-01-22 Nestec Sa Dispositivo calentador para una maquina para la preparacion de alimento liquido o bebida, que comprende una unidad termica con una masa metalica, a traves de la cual circula el liquido, y acumula calor y lo suministra al liquido, y tiene uno o mas componentes electricos asegurados en forma rigida a la unidad termica; y maquina.
EP2278900B1 (de) 2008-04-22 2016-04-27 Nestec S.A. Modularer zusammenbau einer getränkezubereitungsmaschine
JP5608647B2 (ja) 2008-08-08 2014-10-15 ネステク ソシエテ アノニム 持ち運びハンドルおよび設定変更可能な外観ならびに副次的機能を伴う飲料装置
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
RU2534915C2 (ru) 2009-03-23 2014-12-10 Нестек С.А. Крепление насоса в аппарате для приготовления напитка
DE102011088256A1 (de) * 2011-12-12 2013-06-13 Zf Friedrichshafen Ag Multilayer-Leiterplatte sowie Anordnung mit einer solchen
US20210203213A1 (en) * 2017-11-06 2021-07-01 Core Innovation, Llc Structures and methods of manufacture of serpentine stator coils
US10827629B2 (en) * 2018-01-19 2020-11-03 Ge Aviation Systems Llc Control boxes and system-on-module circuit boards for unmanned vehicles

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
IT1201315B (it) * 1985-06-17 1989-01-27 M A S Ind Spa Metodo per assicurare il raffreddamento di componenti elettronici fissati su di un multistrato per circuiti stampati e multistrato realizzato secondo detto metodo
US4853828A (en) * 1985-08-22 1989-08-01 Dart Controls, Inc. Solid state device package mounting apparatus
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5617294A (en) * 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US5986887A (en) * 1998-10-28 1999-11-16 Unisys Corporation Stacked circuit board assembly adapted for heat dissipation
US6510053B1 (en) * 2000-09-15 2003-01-21 Lucent Technologies Inc. Circuit board cooling system
EP1276357A3 (de) * 2001-07-13 2004-08-25 Behr-Hella Thermocontrol GmbH Leiterplatte für elektrische Schaltungen

Also Published As

Publication number Publication date
GB2415297A (en) 2005-12-21
DK1610596T3 (da) 2007-10-08
ES2287875T3 (es) 2007-12-16
DE602005001297T2 (de) 2007-12-20
US20050281007A1 (en) 2005-12-22
EP1610596A1 (de) 2005-12-28
US7660125B2 (en) 2010-02-09
PT1610596E (pt) 2007-07-30
SI1610596T1 (sl) 2007-12-31
PL1610596T3 (pl) 2007-09-28
GB0413420D0 (en) 2004-07-21
GB0511880D0 (en) 2005-07-20
EP1610596B1 (de) 2007-06-06
DE602005001297D1 (de) 2007-07-19

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