ATE328370T1 - Leistungsteiler/-kombinierer - Google Patents
Leistungsteiler/-kombiniererInfo
- Publication number
- ATE328370T1 ATE328370T1 AT03100647T AT03100647T ATE328370T1 AT E328370 T1 ATE328370 T1 AT E328370T1 AT 03100647 T AT03100647 T AT 03100647T AT 03100647 T AT03100647 T AT 03100647T AT E328370 T1 ATE328370 T1 AT E328370T1
- Authority
- AT
- Austria
- Prior art keywords
- port
- transmission line
- combiner
- power divider
- power management
- Prior art date
Links
- 230000005540 biological transmission Effects 0.000 abstract 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI20020522A FI20020522A0 (fi) | 2002-03-19 | 2002-03-19 | Tehonhallintajärjestely |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE328370T1 true ATE328370T1 (de) | 2006-06-15 |
Family
ID=8563599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03100647T ATE328370T1 (de) | 2002-03-19 | 2003-03-14 | Leistungsteiler/-kombinierer |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6861923B2 (de) |
| EP (1) | EP1347532B1 (de) |
| CN (1) | CN1236520C (de) |
| AT (1) | ATE328370T1 (de) |
| DE (1) | DE60305553T2 (de) |
| ES (1) | ES2263914T3 (de) |
| FI (1) | FI20020522A0 (de) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4636950B2 (ja) * | 2005-06-22 | 2011-02-23 | 株式会社日立メディアエレクトロニクス | 伝送回路、アンテナ共用器、高周波スイッチ回路 |
| JP2008109094A (ja) * | 2006-09-29 | 2008-05-08 | Sanyo Electric Co Ltd | 素子搭載用基板および半導体モジュール |
| JP2008252215A (ja) * | 2007-03-29 | 2008-10-16 | Soshin Electric Co Ltd | ドハティ増幅器用合成器 |
| US8216912B2 (en) | 2009-08-26 | 2012-07-10 | International Business Machines Corporation | Method, structure, and design structure for a through-silicon-via Wilkinson power divider |
| TWI639273B (zh) | 2012-05-11 | 2018-10-21 | 國立中山大學 | 堆疊電感諧振器及使用此諧振器的帶通濾波器結構 |
| TWI508361B (zh) * | 2012-07-30 | 2015-11-11 | Inpaq Technology Co Ltd | 共模訊號濾波器 |
| EP2912717B1 (de) * | 2012-10-25 | 2018-07-18 | Telefonaktiebolaget LM Ericsson (publ) | Leistungsteiler und verfahren zur herstellung davon |
| CA2875097C (en) | 2013-12-18 | 2022-02-22 | Com Dev International Ltd. | Transmission line circuit assemblies and processes for fabrication |
| CN104319448B (zh) * | 2014-10-24 | 2018-01-16 | 中国电子科技集团公司第四十一研究所 | 一种基于附电阻膜的高频印制板的多层功率分配网络 |
| CN105633537B (zh) * | 2014-11-24 | 2018-11-16 | 中国航空工业集团公司雷华电子技术研究所 | 一种带线功分器片式电阻让位孔的设计结构 |
| DE102015212232B4 (de) | 2015-06-30 | 2020-03-05 | TRUMPF Hüttinger GmbH + Co. KG | Leistungscombiner zur Kopplung von Hochfrequenzsignalen und Leistungscombineranordnung mit einem solchen Leistungscombiner |
| CN107039734B (zh) * | 2016-06-08 | 2022-04-29 | 深圳振华富电子有限公司 | 一种叠层片式功率分配模块及其制造方法 |
| CN107039735B (zh) * | 2016-06-08 | 2022-04-29 | 深圳振华富电子有限公司 | 一种叠层片式功率分配模块及其制造方法 |
| KR102554415B1 (ko) * | 2016-11-18 | 2023-07-11 | 삼성전자주식회사 | 반도체 패키지 |
| KR102299451B1 (ko) * | 2016-12-20 | 2021-09-08 | 한국전자기술연구원 | 광대역 특성을 갖는 분배/합성기 |
| US10320043B2 (en) | 2017-05-23 | 2019-06-11 | Nanning Fugui Precision Industrial Co., Ltd. | Power distributing device |
| WO2022081964A1 (en) * | 2020-10-16 | 2022-04-21 | Anokiwave, Inc. | Pinwheel three-way wilkinson power divider for millimeter wave applications |
| CN118572340A (zh) * | 2023-02-23 | 2024-08-30 | 鹏鼎控股(深圳)股份有限公司 | 功率分配器及其制作方法 |
| DE102024131929A1 (de) | 2024-10-31 | 2026-04-30 | TRUMPF Hüttinger GmbH + Co. KG | Hochfrequenz-Leistungskoppler für einen Leistungsumwandler für eine Industrieprozessanordnung |
| DE102024131926A1 (de) | 2024-10-31 | 2026-04-30 | TRUMPF Hüttinger GmbH + Co. KG | Hochfrequenz-Leistungskoppler für einen Leistungsumwandler für eine Industrieprozessanordnung |
| DE102024131930A1 (de) | 2024-10-31 | 2026-04-30 | TRUMPF Hüttinger GmbH + Co. KG | Hochfrequenz-Leistungskoppler für einen Leistungsumwandler für eine Industrieprozessanordnung |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206611A (en) * | 1992-03-12 | 1993-04-27 | Krytar, Inc. | N-way microwave power divider |
| JP3333014B2 (ja) * | 1993-10-04 | 2002-10-07 | ティーディーケイ株式会社 | 高周波信号分配・合成器 |
| US5426404A (en) | 1994-01-28 | 1995-06-20 | Motorola, Inc. | Electrical circuit using low volume multilayer transmission line devices |
| US5467064A (en) | 1994-01-28 | 1995-11-14 | Motorola, Inc. | Embedded ground plane for providing shielded layers in low volume multilayer transmission line devices |
| US5534830A (en) * | 1995-01-03 | 1996-07-09 | R F Prime Corporation | Thick film balanced line structure, and microwave baluns, resonators, mixers, splitters, and filters constructed therefrom |
| US5689217A (en) * | 1996-03-14 | 1997-11-18 | Motorola, Inc. | Directional coupler and method of forming same |
| US5929729A (en) * | 1997-10-24 | 1999-07-27 | Com Dev Limited | Printed lumped element stripline circuit ground-signal-ground structure |
| US6525623B2 (en) * | 2000-06-09 | 2003-02-25 | Synergy Microwave Corporation | Multi-layer microwave circuits and methods of manufacture |
-
2002
- 2002-03-19 FI FI20020522A patent/FI20020522A0/fi unknown
-
2003
- 2003-03-14 AT AT03100647T patent/ATE328370T1/de not_active IP Right Cessation
- 2003-03-14 DE DE60305553T patent/DE60305553T2/de not_active Expired - Lifetime
- 2003-03-14 ES ES03100647T patent/ES2263914T3/es not_active Expired - Lifetime
- 2003-03-14 EP EP03100647A patent/EP1347532B1/de not_active Expired - Lifetime
- 2003-03-18 US US10/390,538 patent/US6861923B2/en not_active Expired - Fee Related
- 2003-03-19 CN CNB031204996A patent/CN1236520C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE60305553T2 (de) | 2007-05-10 |
| FI20020522A0 (fi) | 2002-03-19 |
| CN1445883A (zh) | 2003-10-01 |
| US20030227352A1 (en) | 2003-12-11 |
| CN1236520C (zh) | 2006-01-11 |
| US6861923B2 (en) | 2005-03-01 |
| ES2263914T3 (es) | 2006-12-16 |
| EP1347532B1 (de) | 2006-05-31 |
| DE60305553D1 (de) | 2006-07-06 |
| EP1347532A1 (de) | 2003-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60305553D1 (de) | Leistungsteiler/-kombinierer | |
| WO1999025023B1 (en) | Asic routing architecture | |
| MY143173A (en) | Compact power semiconductor module having a connecting device | |
| EP4535937A3 (de) | Komponententräger mit elektronischen komponenten und thermisch leitfähigen blöcken auf beiden seiten | |
| EP1478023A4 (de) | Modulteil | |
| MY128632A (en) | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture | |
| TW200701854A (en) | Communication circuit module | |
| DE59913954D1 (de) | Elektrochrome Anordnung | |
| WO2007024483A8 (en) | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | |
| WO2004008577A3 (en) | Electromagnetic coupling connector for three-dimensional electronic circuits | |
| TW200603386A (en) | Interconnect structure with aluminum core | |
| DE60219815D1 (de) | Monolitische elektronische mehrlagenanordnung und deren herstellungsverfahren | |
| TW200501863A (en) | Multilayer wiring board including stacked via structure | |
| TW200503016A (en) | Laminated ceramic capacitor, mounted structure of laminated ceramic capacitor, and capacitor module | |
| EP1549121A3 (de) | Induktorelement enthaltende Leiterplatte und Leistungsverstärkermodul | |
| ATE306186T1 (de) | Mehrlagige leiterplatte mit an den kontaktlöchern verringerten verlusten | |
| JP3866213B2 (ja) | 電源モジュール及びこれを使用した電子装置 | |
| TW200627653A (en) | Interconnection structure through passive component | |
| DE69929122D1 (de) | Breite, mehrschichtige Isoliermäntel für einen supraleitenden Magneten ohne Verdampfungsverluste | |
| MY129379A (en) | Layered polymer on aluminum stacked capacitor | |
| MY128174A (en) | Thin film capacitor and thin film electronic component and method for manufacturing the same. | |
| TW200624010A (en) | High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same | |
| US20060232204A1 (en) | Double-sided electroluminescene display | |
| ATE364308T1 (de) | Wärmemanagement bei einer leiterplattenanordnung | |
| TW200715525A (en) | Semiconductor integrated circuit device and method for manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |